F-214
QTH–090–01–C–D–A
®
(0,50 mm) .0197"
QTH–060–07–F–D–A
QTH–030–01–L–D–A
QTH SERIES
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5 mm Stack Height)
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSH
Cable Mates:
HQCD, HQDP
(See Also Available note)
Integral metal plane for
power or ground
Standard Stack Heights
from 5 mm to 25 mm
ls
toco d
Pro orte
Supp
100 GbE
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spor t
Hyper tran
XAUI
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s
PCI Expres
TA
SA
™
InfiniBand
QTH/QSH
5 mm Stack Height
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (030-060)
(0,15 mm) .006" max (090)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D
9 GHz / 18 Gbps
9.5 GHz / 19 Gbps
Differential Pair Signaling
–D
8 GHz / 16 Gbps 10.5 GHz / 21 Gbps
Differential Pair Signaling
–DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTH or contact sig@samtec.com
Type
notes at
Download app ppnote
com/a
www.samtec.
m
@ samtec.co
Contact SIG
tocols
on pro
for questions
QTH
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE
A
OTHER
OPTION
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
–030, –060, –090
(60 total pins per bank = –D)
–020, –040, –060
(20 pairs per bank = –D–DP)
FILE NO: 090871_0_000
Specify
LEAD
STYLE
from
chart
–K
–F
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
–L
–D = (No. of Pins per Row/30) x (20,00) .7875
= (7,00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
(N/A with -05 &
-07 lead style)
ALSO AVAILABLE
(MOQ Required)
• 14 mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating
for Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80 (-DP), 120, 150
positions per row
• Retention Option
Contact Samtec.
(7,11)
.280
–DP = (No. of Pairs per Row/20) x (20,00) .7875
(20,00) .7875
01
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
QTH
LEAD
STYLE
A
(4,27)
.168
(7,26)
.286
(10,27)
.404
(15,25)
.600
(18,26)
.718
(24,24)
.954
HEIGHT
= Tape & Reel
WITH
(–090 positions
QSH*
maximum)
(5,00)
.197
(8,00)
.315
(11,00)
.433
(16,00)
.630
(19,00)
.748
(25,00)
.984
–TR
–C*
02
–01
–02
–03
–04
–05
–07
(0,50)
.0197
(0,20)
.008
A
–01 & –02
–03 thru –07
A
(0,76)
.030
(0,89)
.035
DIA
(0,64)
.025
–L
= Electro-Polished
Selective
50µ" (1,27 µm) min Au
over 150µ" (3,81 µm)
Ni on Signal Pins in
contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27 µm) min Ni
on all solder tails
*Note:
–C Plating passes
10 year MFG testing
–L
= Latching
Option
(–01 lead
style only)
(N/A on
–060 (–D–DP)
& –090)
*Processing conditions
will affect mated height.
OTHER
SOLUTIONS
• Board Spacing Standoffs.
See SO Series.
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
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