microtech GmbH electronic Teltow
Chip resistors - Made in Germany
ISO/TS 16949:2009
Thick film series – Power variant
Type: CDP
Sizes: 0402, 0603, 0805, 1206
Characteristics:
•
•
•
•
•
•
•
Chip resistors in thick film technology
Resistance area coated with glass and varnish passivation
High stability and reliability
Tight tolerances (≥0,5%) – low temperature coefficient
RoHS-conform
Customer specific barcodes available - also in 2D
All sizes can be manufactured with the following contact variants
⇒
Electroplated alloy resistant tinned
⇒
Contact with low rest permeability -N
⇒
Epoxy bondable contact -K
⇒
Special corrosive gas resistant contact -S
Dimensions (in mm):
Size
L
Length
Min
Max
W
Width
Min
Max
H
Depth
Min
Max
t
Contact
back
Min
Max
T
Contact
front
Min
Max
H
t
0402
0603
0805
1206
0,95
1,50
1,85
2,90
1,10
1,70
2,15
3,35
0,45
0,75
1,10
1,45
0,60
0,95
1,40
1,75
0,25
0,35
0,35
0,35
0,40
0,55
0,65
0,65
0,10
0,10
0,15
0,25
0,35
0,50
0,60
0,75
0,05
0,10
0,15
0,15
0,35
0,50
0,60
0,75
T
L
W
Packaging units:
Reel
Ø
180 mm
330 mm
Card tape
acc. EN 60286-3
5 T pcs.
10 T pcs. for size 0402
10 T pcs.
20 T pcs.
Samples by bulk into plastic bags up to 50 pcs./value
Ordering information:
CDP
Type
-N
Contact
0603
Size
0402
0603
0805
1206
10k
R-
Value
1R
.
1%
Tolerance
0,5
1,0
50ppm/K
TC
50
100
K
Marking
P
Packaging
(optional)
5
Pcs. / Reel
(T Pcs.)
Depends
on size and
packaging
unit
CDP Standard (without
add.)
-N (non magnetic)
-K (epoxy bondable)
-S (corrosive gas
resistant)
to
.
N- without
P- Card tape
K- with
S- Bulk
(from size 0603)
10M
Stand: April 2013
Catalog microtech GmbH electronic
microtech GmbH electronic Teltow
ISO/TS 16949:2009
Chip resistors - Made in Germany
Thick film series – Power variant
Type: CDP
Sizes: 0402, 0603, 0805, 1206
Technical data – depending on size:
Size
Nominal voltage
U
max
(V)
Load
P
70
(W)
R-Range
R-Tolerance
(%)
TC
(ppm/K)
P
0402
0603
0805
1206
50
75
150
200
0,100
0,125
0,200
0,400
1R - 10M
1R - 10M
1R - 10M
1R - 10M
1,0
0,5 / 1,0
0,5 / 1,0
0,5 / 1,0
50 / 100
50 / 100
50 / 100
50 / 100
x
x
x
x
Packaging
B
S
x
x
x
x
Technical data - general:
Technical data
Operating temperature range
Climatic category acc. EN 60068
Solderability acc. EN 60068-2-58
Soldering heat resistance acc. EN 60068-2-58
Long time stability
Storage 155°C / 1000h
Endurance P
70
/ 70°C / 1000h
Damp heat, steady state (56d / 40°C / 96%)
± ( 1,0% + 0,05R )
± ( 1,0% + 0,05R )
± ( 1,0% + 0,05R )
-55°C … +155°C
55 / 155 / 56
245°C 3s
±( 0,5% + 0,05R ) at 260°C 10s
Data, unless specified, acc. EN 140401-802.
Catalog microtech GmbH electronic
Stand:
April 2013
FPGA/CPLD
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