8
THIS DRAWING IS UNPUBLISHED.
RELEASED FOR PUBLICATION
ALL RIGHTS RESERVED.
7
-
6
5
4
3
2
REVISIONS
P
LTR
DESCRIPTION
1
DATE
DWN
APVD
C
COPYRIGHT copyright_date -
BY
0.00
0.00
1
0.76µm GOLD IN LOCALIZED PLATE AREA, 3.81µm TIN-LEAD
ON SOLDER TAILS ALL OVER 1.27µm NICKEL.
CIRCUIT IDENTIFICATION FEATURE OMITTED ON 10 POSITION
HEADER ASSEMBLIES.
DIMENSION APPLIES AT BASE OF SHROUD.
NOTE DELETED.
NOTE DELETED.
VACUUM COVER DESIGNED FOR 4mm DIA NOZZLE.
VACUUM COVER TO BE REMOVED AFTER SOLDERING.
PACKAGED IN TAPE AND REEL PER EIA-481 SPECIFICATIONS.
SEE CHART FOR TAPE WIDTHS.
6.75mm MIN TARGET AREA FOR VACUUM PICK-UP.
HOUSING: LCP
CONTACT: COPPER ALLOY
VACUUM COVER: ALUMINUM.
VACUUM COVER SHOWN IN PHANTOM LINE.
0.76µm GOLD IN LOCALIZED PLATE AREA, 3.81µm TIN
ON SOLDER TAILS, ALL OVER 1.27µm NICKEL.
NOTE DELETED.
NO CIRCUIT IDENTIFICATION FEATURE ON 10,12,20,24 AND 30 POSITION
PARTS.
FINISH: 0.025µm MIN GOLD ON GOLD PLATED AREA, 3.81-6.35µm
MATTE TIN-LEAD ON TIN PLATED AREA. UNDER PLATING TO BE
1.27-2.54µm NICKEL ON ENTIRE CONTACT.
FINISH: 0.025µm MIN GOLD ON GOLD PLATED AREA, 3.81-6.35µm
MATTE TIN ON TIN PLATED AREA. UNDER PLATING TO BE 1.27-2.54µm
NICKEL ON ENTIRE CONTACT.
PRELIMINARY - NOT FOR PRODUCTION.
9.19
REF
SEE DETAIL S
H
REDRAWN/REVISED PER ECO 17-001755
17MAY2017
BDA
JO
2
3
4
5
D
6
10
1.27
1.27
1.27
0.64
D
147377-1 SHOWN
7
8
9
BASIC DIMENSIONS FOR
EVEN NUMBER OF SPACES
(SEE TABLE)
3.50 0.05
0.74 0.03
1.27 0.05
TYP
5.69
BASIC DIMENSIONS FOR
ODD NUMBER OF SPACES
(SEE TABLE)
DETAIL S
0.23 s M | N
PAD TYP
0.05 s
0.23 s M | N
0.05 s
10
11
PAD TYP
12
13
56mm
44mm
88mm
26.67
13.97
62.23
49.53
36.83
30.48
24.13
17.78
11.43
26.67
13.97
62.23
49.53
36.83
30.48
24.13
17.78
11.43
26.67
13.97
62.23
49.53
36.83
30.48
24.13
17.78
11.43
26.67
13.97
62.23
49.53
36.83
30.48
24.13
17.78
11.43
5.08
DIM_C
DWN
CHK
21
11
49
39
29
24
19
14
9
4
21
11
49
39
29
24
19
14
9
4
21
11
49
39
29
24
19
14
9
4
21
11
49
39
29
24
19
14
9
4
31.24
18.54
66.80
54.10
41.40
35.05
28.70
22.35
16.00
31.24
18.54
66.80
54.10
41.40
35.05
28.70
22.35
16.00
31.24
18.54
66.80
54.10
41.40
35.05
28.70
22.35
16.00
31.24
18.54
66.80
54.10
41.40
35.05
28.70
22.35
16.00
-
E
-
-
-
44
24
100
80
60
50
40
30
20
10
44
24
100
80
60
50
40
30
20
10
44
24
100
80
60
50
40
30
20
10
44
24
100
80
60
50
40
30
20
10
16
16
16
8-147377-0
7-147377-9
7-147377-8
7-147377-7
2.84
.MMM
15
88mm
72mm
56mm
56mm
56mm
44mm
14
C
15
16
7-147377-4
16
7-147377-3
16
7-147377-2
16
7-147377-5
16
7-147377-6
C
16
B SPACES AT @(1.27) = DIM_C±0.05
TOLERANCE NON -CUMULATIVE
-Z-
.NNN
32mm
56mm
44mm
88mm
88mm
72mm
56mm
56mm
56mm
44mm
32mm
56mm
44mm
88mm
5.08
7-147377-1
6-147377-0
5-147377-9
5-147377-8
5-147377-7
5-147377-6
5-147377-5
5-147377-4
5-147377-3
5-147377-2
5-147377-1
3-147377-0
2-147377-9
RECOMMENDED BOARD LAYOUT
V2
1.27
2 PLC
11
SEE DETAIL
W
V1
Z2
1.17
REF
0.77 0.25
X
2.54 0.05
1.27
11.00 0.18
3.175 0.10
1.39
LOCALIZED GOLD
PLATE AREA
1.45 0.25
Z1
0.38 0.02
TYP
DIM_E±0.08
X | Y s| Z s
13
5.08
16
16
B
0.38 0.02
Y
6
X | Y s| Z s
88mm
14
16
2-147377-8
16
2-147377-7
72mm
56mm
56mm
56mm
44mm
32mm
56mm
44mm
2-147377-6
B
16
2-147377-5
16
2-147377-4
16
2-147377-3
8
SECTION
A-A
2-147377-2
1-147377-0
147377-9
147377-8
147377-7
147377-6
147377-5
147377-4
147377-3
147377-2
147377-1
5.08
16
2-147377-1
0.00
10
88mm
SEE DETAIL S
(1.27 )
1.52 0.05
1
88mm
72mm
56mm
56mm
56mm
44mm
32mm
0.00
1.27
1.27
Y
-Y-
V1
(2.54 )
7.21 0.07
3
.00
VACUUM COVER
-V-
0.15 V
A
FINISH
TAPE
WIDTH
B
SPACES
17MAY2017
17MAY2017
17MAY2017
NAME
0.38 0.02
B SPACES AT
1.27
=
C
TYP
4
1.27
X | Y s| Z s
ALL SOLDER
LEADS
DETAIL
W
SCALE 10:1
0.10
THIS DRAWING IS A CONTROLLED DOCUMENT.
DIMENSIONS:
TOLERANCES UNLESS
OTHERWISE SPECIFIED:
NO
OF
POSN
PART
NUMBER
TE Connectivity
A
RAVI S
J.OLSON
J.OLSON
mm
APVD
MATERIAL
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
FINISH
-
0.5
0.13
-
-
PRODUCT SPEC
APPLICATION SPEC
108-1093
1 $
9
4805 (3/13)
SEE NOTES
WEIGHT
114-25035
-
CUSTOMER DRAWING
A1
00779
SIZE
HEADER ASSEMBLY, VERTICAL, SHROUDED,
DUAL ROW W/SIDE AND END LATCHES
W/O HOLD DOWNS
CAGE CODE
DRAWING NO
RESTRICTED TO
147377
SCALE
5:1
SHEET
1
OF
1
REV
-
H
Microchip MCU
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