LOW VALUE FLAT CHIP RESISTOR
ISO-9001
Registered
LRC / LRF
•
•
•
•
•
SERIES
IRC proprietary low
value resistance film
system
Standard 2512, 2010 and 1206 sizes
s
Resistance values down to 0.003 ohms
Leach resistant solder-plated copper wrap-around termination
Low inductance - less than 0.2nH
Standard EIA Tape - 1206 = 8mm; 2010 or 2512 = 12mm
High conductivity plated wrap
around termination
SPECIFICATIONS:
Resistance
Range
(Ohms)
0.010 to 1
0.003 to 1
0.003 to 1
0.003 to 0.10
±100
(Contact factory
for value below
0.050 ohms)
Power Rating
at 70°C
(Watts)
0.5
1.0
1.5 / 2.0*
2.0
Dielectric
Withstanding
Voltage
200
200
200
200
Temperature
Rise at
Rated Power
40°C
80°C
90°C
80°C
Pad and Trace Area
for Max Power
Rating @ 70°C
30 mm
2
30 mm
2
100 mm
2
200 mm
2
Model
LR1206
LR2010
LR2512
LR1225
TCR
(ppm/°C)
* 2 Watts with total solder pad and trace size of 300 mm
2
CONSTRUCTION & MECHANICAL DIMENSIONS:
LR1206 / 2010 / 2512
LR1225
D
L
D bottom
2 places
Plating
Wrap-around
D
w
H
60/40 Solder Plating
Nickel Barrier Layer
Protective Overcoat
Copper Wraparound
Termination
Alumina Substrate
H
Resistive Element
W
Copper Termination
BOTTOM
SIZE
in.
LR1206
mm
LR2010
in.
mm
in.
LR2512
mm.
LR1225
in.
mm.
L
TOP
W
0.064 ± 0.008
1.63 ± 0.203
0.104 ± 0.010
2.64 ± 0.25
0.128 ± .010
3.25 ± 0.25
0.256 ± 0.015
6.5 ± 0.38
H
0.024 ± 0.004
0.061 ± 0.102
0.029 ± 0.004
0.74 ± 0.1
0.029 ± 0.004
0.74 ± 0.1
0.029 ± 0.004
0.74 ± 0.1
D
0.019 ± 0.010
0.48 ± 0.25
0.019 ± 0.010
0.48 ± 0.25
0.019 ± 0.010
0.48 ± 0.25
0.020 ± 0.010
0.48 ± 0.25
D bottom
0.019 ± 0.010
0.48 ± 0.25
0.019 ± 0.010
0.48 ± 0.25
0.019 ± 0.010
0.48 ± 0.25
0.031 ± 0.005
0.79 ± 0.12
0.126 ± 0.012
3.20 ± 0.305
0.206 ± 0.015
5.23 ± 0.38
0.256 ± 0.015
6.50 ± 0.38
0.128 ± 0.010
3.25 ± 0.25
ADVANCED FILM DIVISION
4222 South Staples Street
•
Corpus Christi, Texas 78411
•
Tel: 361-992-7900
•
Fax: 361-992-3377
•
www.irctt.com
050699
LRC / LRF
Characteristic
Thermal Shock
Short Time
Overload
High Temperature
Exposure
Temperature
Cycling
Moisture
SERIES
ISO-9001
Registered
Environmental Performance
Test Method
MIL-STD-202 Method 107
Condition B, -65°C +125°C
MIL-PRF-55342
Recommended Solder Pad Dimensions
Performance
±0.5%
B
A
±0.5%
C
MIL-PRF-55342
MIL-STD-883 Method 1010
Test Condition B
MIL-PRF-55342
MIL-PRF-55342
Rated Power @ 70°C
MIL-PRF-55342
±0.5%
DIM.
LR1206
in.
mm
in.
mm
in.
mm
0.080
(2.0)
0.160
(4.0)
0.050
(1.25)
LR2010
0.120
(3.05)
0.255
(6.5)
0.060
(1.5)
LR2512
0.145
(3.7)
0.305
(7.75)
0.060
(1.5)
LR1225
0.305
(7.75)
0.175
(4.45)
0.06
(1.5)
±0.25%
A
B
±0.5%
Load Life
Low Temperature
Operation
Low Temperature
Storage
Resistance to
Solder Heat
Leach Resistance
±1.0%
C
±0.5%
Derating Curve
100
-65°C, 100 Hours
±0.5%
% Of Rated Power
50
MIL-STD-202 Method 210
±0.25%
90 seconds
minimum
10
25°
70°
150°
Molten Solder 250°C
Temperature in °C
Pulse and Surge Capability
70
50
Surge Power Watts
30
20
10
7
5
3
LRC 25
12 2 w
atts
LRC 20
10 1 w
att
LRC 12
06 0.5
watts
Average power
dissipation
should not
exceed normal
70°C rating
300 µ Sec
Sec
1 m Sec
3 m Sec
10 m Sec
30 m Sec
Surge or Repetitive Pulse Duration
100 m Sec
300 m Sec
1
HOW TO ORDER
Sample Part Number: LRC - LR 2010 - 01 - R040 - J
MODEL
LR = Resistance ranges above .025 ohm
LRF = Resistance range .025 and below
SIZE:
1206, 2010, 2512, 1225
TCR CHARACTERISTIC
01 =
±
100 ppm/
o
C (Standard)
RESISTANCE CODE
Standard MIL code with “R” signifying decimal place.
TOLERANCE
F = ±1%; G = ±2%; J = ±5%; K = ±10%
ADVANCED FILM DIVISION
4222 South Staples Street
•
Corpus Christi, Texas 78411
•
Tel: 361-992-7900
•
Fax: 361-992-3377
•
www.irctt.com
050699
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