CC
S
1000 Series Card Edge Connector, AT Style
.100” X .200” Contact Spacing, Press Fit
Features
• Flat Plate Installation eliminates the need for
secondary operation tooling which can damage
the connector.
• Extra large chamfered entry
• Conforms to Bell-core spec TR-TSY-00078
• Extended card scoops available
• Replaceable contacts
• Molded in polarization available between
contact, or on contact position.
• De-population of contacts per
customer specification.
• Available in selective gold plate at contact point
• Many other custom options available, including,
but not limited to:
• Single or Both Ends Open
• Shorting Contacts
Specifications
Insulator Material: Glass filled polyester, type PBT,
94 V-O, UL Rated.
Contact Material: Phosphor Bronze Alloy
Contact Plating: Gold and/or Tin over .000050” Nickel,
(See Contact Plating Options).
Current Rating:
3 amp at 30°C
Contact Resistance:
Contact to Daughter Card:
10 m
W
max.
Compliant section to P.T.H.:
2 m
W
max.
Insulation Resistance:
5000 M
W
min.
Dielectric Withstand Voltage:
1000 V AC
Daughter Board Insertion Force:
16 oz max. per contact pair
when tested with a .071” thick
gage.
Daughter Board Withdrawal Force:
1 oz min. per contact pair
when tested with a .054” thick
gage.
Compliant Section Insertion Force:
40 lbs max per contact
Compliant Section Withdrawal Force:
10 lbs min. per contact
Recommended Board Thickness:
.093”+
Recommended PCB Layout Page A-33
Operating Temperature:
-54
B
C to +125
B
C
Recommended Hole Size
.040 ±.003 [1.02]
.0453 ±.001 [1.15]
.0040 [.10] min.
.0003 [.008] min.
R
C
R
Dimensions are in inch [mm]
Drilled Hole
Diameter
Plating
Thickness
.001-.003 [.03-.08]
.0003 [.008]min.
.001-.003 [.03-.08]
Hole
Diameter
Pad
Diameter
Recognized under the recognized component
Program of Underwriters Laboratories, Inc.
File Numbers: E146967 and E176234
.0453±.001
[1.15]
Copper
Tin / Lead
After Plating
.040±.003
[1.02]
.065 [1.65]
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