303134, 303135, 303136, 303137, 303138
Vishay Foil Resistors
Models 303134 through to 303138 (Ultra High Precision Surface Mount Chip
Resistors, VSMP Z-Foil Technology Configuration), Screen/Test Flow in Compliance
with EEE-INST-002, (Tables 2A and 3A, Film/Foil, Level 1) and MIL-PRF-55342
FEATURES
•
Temperature coefficient of resistance (TCR):
0.05 ppm/°C typical (0 °C to + 60 °C)
0.2 ppm/°C typical (- 55 °C to + 125 °C, + 25 °C ref.)
•
Tolerance: to ± 0.02 %
•
Power coefficient “ΔR due to self heating”:
5 ppm at rated power
•
Power rating: to 400 mW at + 70 °C
Top View
•
Load life stability: to ± 0.03 % at 70 °C, 2000 h at rated
power
•
Resistance range: 10
Ω
to 75 kΩ
•
Vishay Foil resistors are not restricted to standard values,
we can supply specific “as required” values at no extra cost
or delivery (e.g. 1K2345 vs. 1K)
•
Fast thermal stabilization < 1 s
•
Electrostatic discharge (ESD) up to 25 000 V
•
Short time overload:
≤
0.02 %
•
Non-inductive, non-capacitive design
•
Rise time: 1 ns effectively no ringing
•
Current noise: - 42 dB
•
Voltage coefficient < 0.1 ppm/V
•
Non-inductive: < 0.08 µH
•
Non hot spot design
•
Terminal finish: tin/lead alloy
•
Matched sets are available on request
•
For prototype units, append a “U” to the model number
(example: 303134U). These units have all of the table 2A
(page 3) 100 % tests performed, with no destructive
qualification testing required (table 3A, page 4). For more
information, please contact
foil@vishay.com
INTRODUCTION
The 303134 through to 303138 series is the first surface
mount device to provide high rated power, excellent load life
stability along with extremely low TCR all in one resistor.
One of the most important parameters influencing stability is
the temperature coefficient of resistance (TCR). Although the
TCR of foil resistors is considered extremely low, this
characteristic has been further refined over the years. The
303134 through to 303138 Series utilizes ultra high precision
Bulk Metal
®
Z-Foil. The Z-Foil technology provides a
significant reduction of the resistive element’s sensitivity to
ambient temperature variations (TCR) and to self heating
when power is applied (power coefficient). Along with the
inherently low PCR and TCR, Z-Foil technology also
provides remarkably improved load life stability, low noise
and availability of tight tolerance.
The 303134 through to 303138 series has a full wraparound
termination which ensures safe handling during the
manufacturing process, as well as providing stability during
multiple thermal cyclings.
Our application engineering department is available to
advise and make recommendations.
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
(- 55 °C to + 125 °C, + 25 °C ref.)
RESISTANCE
VALUE
(Ω)
250 to 75K
100 to < 250
50 to < 100
25 to < 50
10 to < 25
TOLERANCE
(%)
± 0.02
± 0.05
± 0.1
± 0.25
± 0.5
MAXIMUM TCR
(ppm/°C)
±3
±3
±4
±5
±5
FIGURE 1 - POWER DERATING CURVE
Percent of Rated Power
- 55 °C
100
75
50
25
0
- 75
+ 70 °C
- 50
- 25
0
+ 25 + 50 + 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
Document Number: 63169
Revision: 22-Oct-09
For any questions, contact:
foil@vishay.com
www.vishay.com
1
303134, 303135, 303136, 303137, 303138
Vishay Foil Resistors
FIGURE 2 - TRIMMING TO VALUES
(Conceptual Illustration)
FIGURE 3 - TYPICAL RESISTANCE/
TEMPERATURE CURVE
TCR Values for Different Temperature Ranges
+ 500
+ 400
Interloop
Capacitance
Reduction
in Series
Mutual
Inductance
Reduction due
to Opposing
Current in
Adjacent Lines
Current Path
Before Trimming
Current Path
After Trimming
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing Resistance
+ 300
+ 200
+ 100
ΔR
0
R
(ppm)
- 100
- 200
- 300
- 400
- 500
- 55
- 25
0
+ 25
+ 60 + 75
Ambient Temperature (°C)
+ 100 + 125
- 0.16 ppm/°C
0.05 ppm/°C
- 0.1 ppm/°C
0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C
Note:
Foil shown in black, etched spaces in white
Note
• The TCR values for < 100
Ω
are influenced by the termination
composition and result in deviation from this curve.
TABLE 2 - DIMENSIONS AND LAND PATTERN
in Inches (Millimeters)
Top View
L
X
T
D
MODEL
(CHIP SIZE)
303134 (0805)
303135 (1206)
303136 (1506)
303137 (2010)
L
± 0.005 (0.13)
0.080 (2.03)
0.126 (3.20)
0.150 (3.81)
0.198 (5.03)
W
± 0.005 (0.13)
0.050 (1.27)
0.062 (1.57)
0.062 (1.57)
0.097 (2.46)
THICKNESS
MAXIMUM
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
D
± 0.005 (0.13)
0.015 (0.38)
0.020 (0.51)
0.020 (0.51)
0.025 (0.64)
0.032 (0.81)
Z
(1)
0.122 (3.10)
0.175 (4.45)
0.199 (5.05)
0.247 (6.27)
0.291 (7.39)
G
(1)
0.028 (0.71)
0.059 (1.50)
0.083 (2.11)
0.115 (2.92)
0.150 (3.81)
X
(1)
0.050 (1.27)
0.071 (1.80)
0.071 (1.80)
0.103 (2.62)
0.127 (3.23)
Recommended Land Pattern
Footprint
W
Z
G
303138 (2512)
0.249 (6.32)
0.127 (3.23)
Note
(1)
Land Pattern Dimensions are per IPC-7351A
TABLE 3 - SPECIFICATIONS
MODEL
(CHIP SIZE)
303134 (0805)
303135 (1206)
303136 (1506)
303137 (2010)
303138 (2512)
RATED POWER (mW)
at + 70 °C
100
150
200
300
400
MAX. WORKING
VOLTAGE (≤
P
×
R
)
22 V
46 V
57 V
102 V
173 V
RESISTANCE RANGE
(Ω)
10 to 5K
10 to 14K
10 to 16K
10 to 35K
10 to 75K
MAXIMUM WEIGHT
(mg)
6
11
12
27
40
TABLE 4 - PERFORMANCES
TEST OR CONDITIONS
Thermal Shock, 100 x (- 65 °C to + 150 °C)
Low Temperature Operation, - 65 °C, 45 min at Rated Power
Short Time Overload, 6.25 x Rated Power, 5 s
High Temperature Exposure, + 150 °C, 100 h
Resistance to Soldering Heat
Moisture Resistance
Load Life Stability + 70 °C for 2000 h at Rated Power
Note
(1)
As shown + 0.01
Ω
to allow for measurement errors at low values.
www.vishay.com
2
MIL-PRF-55342
CHARACTERISTIC E
ΔR
LIMITS
± 0.1 %
± 0.1 %
± 0.1 %
± 0.1 %
± 0.2 %
± 0.2 %
± 0.5 %
TYPICAL
ΔR
LIMITS
MAXIMUM
ΔR
LIMITS
(1)
± 0.005 % (50 ppm) ± 0.01 % (100 ppm)
± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
± 0.01 % (100 ppm) ± 0.03 % (300 ppm)
± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
± 0.005 % (50 ppm) ± 0.04 % (400 ppm)
± 0.005 % (50 ppm) ± 0.03 % (300 ppm)
For any questions, contact:
foil@vishay.com
Document Number: 63169
Revision: 22-Oct-09
303134, 303135, 303136, 303137, 303138
Vishay Foil Resistors
(1)(2)(3)
FIGURE 4 - RECOMMENDED MOUNTING
25 % to
85
% of T
A low profile
solder
fillet is
recommended to avoid unnecessary
stresses
along top edge of
metallization. IR and vapor phase
reflow are best.
Notes
(1)
Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction
(2)
Vacuum pick up is recommended for handling
(3)
Soldering iron may damage the resistor
MODEL NUMBER
CHIP SIZE
VALUE RANGE (SPACE APPLICATIONS)
RATED POWER AT 70 °C
(1)
303134
0805
10
Ω
to 5 kΩ
100 mW
303135
1206
10
Ω
to 14 kΩ
150 mW
303136
1506
10
Ω
to 16 kΩ
200 mW
303137
2010
10
Ω
to 35 kΩ
300 mW
303138
2512
10
Ω
to 75 kΩ
400 mW
Notes
Measurement error allowed for
ΔR
limits: 0.01
Ω.
(2)
An additional 54 sample units per lot which successfully pass 100 % screening are to be used for destructive testing and are to be kept on
file at the plant of manufacture.
(3)
Lot definition (1 lot = 1 primary flowcard): Each value per chip size should be qualified individually. Contact Vishay application engineering for
alternative lot definitions.
(4)
For prototype units, append a “U” to the model number (example: 303134U). These units have all of the table 2A 100 % tests performed, with
no destructive qualification testing required.
TABLE 5 - EEE-INST-002 (TABLE 2A FILM/FOIL, LEVEL 1) 100 % TESTS/INSPECTIONS
Pre-cap Visual Inspection
RC Record
Thermal Shock
Power Conditioning
RC Record
Final Inspection
Visual Inspection
Mechanical Inspection
Performed in production flow prior overcoating
In tolerance
25 x (- 65 °C to + 150 °C)
70 °C, 100 h, 1.5 rated power - not to exceed max. voltage
In tolerance
ΔR
= 0.05 % for thermal shock and conditioning combined
5 % PDA on
ΔR
only, 10 % PDA on “Out of Final Tolerance”
Materials, design, etc.
Physical dimensions, sample size: 3 units, zero failure
Document Number: 63169
Revision: 22-Oct-09
For any questions, contact:
foil@vishay.com
www.vishay.com
3
303134, 303135, 303136, 303137, 303138
Vishay Foil Resistors
TABLE 6 - EEE-INST-002 (TABLE 3A FILM/FOIL, LEVEL 1) DESTRUCTIVE TESTS
Sample size: 3, zero failure
Group 2
Solderability
Sample size: 10, zero failure - mounted on FR4
Values
TCR
(- 55 °C/+ 25 °C/+ 125 °C)
≥
100
Ω
50
Ω
to < 100
Ω
10
Ω
to < 50
Ω
Group 3
Low temperature storage
ΔR
= 0.02 %
- 65 °C no load dwell for 24 h ± 4 h
+ 25 °C ambient no load dwell for 2 h to 8 h
ΔR
= 0.02 %
- 65 °C no load dwell for 1 h
rated power for 45 min
+ 25 °C ambient no load dwell for 24 h ± 4 h
ΔR
= 0.02 %
6.25 x rated power, 5 s - no “I” limitation: not to exceed twice the maximum voltage
TCR limits
± 3 ppm/°C
± 4 ppm/°C
± 5 ppm/°C
Low temperature operation
Short time overload
Sample size: 9, zero failure - mounted on FR4
Group 4
Resistance to soldering heat
ΔR
= 0.02 %
Performed per MIL-PRF-55342 para. 4.8.8.1
Sample size: 12, zero failure - mounted on FR4
Group 6
Life
ΔR
= 0.03 %
2000 h, + 70 °C, rated power
Sample size: 10, zero failure - mounted on FR4
Group 7B
Solder mounting integrity
Performed per MIL-PRF-55342
For 0805, 1206, 1506: force applied: 2 kg, 30 s
For 2010, 2512: force applied: 3 kg, 30 s
Sample Size: 5, zero failure - chips not mounted
Group 8
Voltage coefficient
ΔR
= 0.1 ppm/V
Applicable resistors
≥
10K
Performed per MIL-STD-202 method 309
Sample size: 5, zero failure - mounted on FR4
Group 9
High temperature exposure
ΔR
= 0.03 %
Performed per MIL-PRF-55342
100 h at + 150 °C ± 5 °C
www.vishay.com
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For any questions, contact:
foil@vishay.com
Document Number: 63169
Revision: 22-Oct-09
303134, 303135, 303136, 303137, 303138
Vishay Foil Resistors
TABLE 7 - PART NUMBER IDENTIFICATION
Model #
Chip Size
Value Range
(Space Application)
303134
0805
10
Ω
to 5 kΩ
303135
1206
10
Ω
to 14 kΩ
303136
1506
10
Ω
to 16 kΩ
303137
2010
10
Ω
to 35 kΩ
303138
2512
10
Ω
to 75 kΩ
Part Number:
{Model} - {Value} - {Tolerance} - {Termination} - {Packaging}
Resistance Value
250R to 75K
100R to < 250R
50R to < 100R
25R to < 50R
10R to < 25R
Tolerance (Tightest) Code
0.02 %
0.05 %
0.1 %
0.25 %
0.5 %
Q
A
B
C
D
Termination
Tin/lead
Code
B
Packaging
Waffle
Tape and reel
Code
W
T
Example:
303135 - 10K025 - DBW
1206 chip size, 10.025 kΩ, 0.5 %, tin/lead termination, waffle packaging
Document Number: 63169
Revision: 22-Oct-09
For any questions, contact:
foil@vishay.com
www.vishay.com
5
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