Datasheet> 器件分类 > 无源元件> 电阻器> R0202AS-02-5421-C

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R0202AS-02-5421-C: 产品描述Fixed Resistor, Thin Film, 0.25W, 5420ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP; 产品类别无源元件电阻器; 文件大小381KB，共3页; 制造商TT Electronics plc; 官网地址http://www.ttelectronics.com/; 标准

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R0202AS-02-5421-C概述

Fixed Resistor, Thin Film, 0.25W, 5420ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

R0202AS-02-5421-C规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
Objectid	1579458995
包装说明	, 0202
Reach Compliance Code	compliant
ECCN代码	EAR99
JESD-609代码	e3
制造商序列号	WBC
安装特点	SURFACE MOUNT
端子数量	2
最高工作温度	150 °C
最低工作温度	-55 °C
封装形状	RECTANGULAR PACKAGE
包装方法	TRAY
额定功率耗散 (P)	0.25 W
额定温度	70 °C
电阻	5420 Ω
电阻器类型	FIXED RESISTOR
尺寸代码	0202
表面贴装	YES
技术	THIN FILM
温度系数	50 ppm/°C
端子面层	Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状	ONE SURFACE
容差	0.25%
工作电压	100 V

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Wire Bondable

Chip Resistors

WBC Series

•

Discrete or tapped schematics

•

MIL inspection available

•

High resistor density

IRC’s WBC series wire bondable chip resistors are ideally suited for

the most demanding hybrid application. The WBC combines IRC’s

TaNSil

tantalum nitride thin film technology with silicon substrate processing to produce an extremely small

footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil

resistor film.

Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-

tions. Custom resistance values, sizes and schematics are available on request from the factory.

Physical Data

R0202 - Discrete

(0.508mm ±0.025)

0.020˝ ±0.001

Electrical Data

Absolute Tolerance

Absolute TCR

Package Power Rating

(@ 70°C)

Rated Operating Voltage

√

(not to exceed P x R )

Operating Temperature

Back contact

Noise

Top contact

pad chamfered

0.004˝ min bond pad size

to ±0.1%

to ±25ppm/°C

250mW

100V

-55°C to +150°C

<-30dB

Oxidized Silicon

(10KÅ SiO

min)

0.010˝ ±0.001

(0.254mm ±0.025)

10KÅ minimum

15KÅ minimum

Silicon

(Al / Au optional)

3KÅ Au minimum

10KÅ Al minimum

Silicon Dioxide or

Silicon Nitride

0.004˝ min bond pad size

0.020˝ ±0.001

(0.508mm ±0.025)

B0202 - Discrete back contact

(0.508mm ±0.025)

0.020˝ ±0.001

Substrate Material

Top contact

Substrate Thickness

Aluminum

Gold

R0202 and

T0303

B0202

0.020˝ ±0.001

(0.508mm ±0.025)

T0303 - Tapped network ½R + ½R

Bond Pad

Metallization

(0.762mm ±0.025)

0.030˝ ±0.001

½R

Backside

0.030˝ ±0.001

(0.762mm ±0.025)

0.004˝ min bond pad size

Passivation

General Note

IRC reserves the right to make changes in product specification without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

• Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

A subsidiary of

TT electronics plc

WBC Series Issue January 2009 Sheet 1 of 3

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