电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MC2512-2003-DT101

产品描述Fixed Resistor, Metal Glaze/thick Film, 1W, 200000ohm, 250V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP
产品类别无源元件    电阻器   
文件大小67KB,共1页
制造商RCD Components Inc.
官网地址http://www.rcdcomponents.com/
下载文档 详细参数 全文预览

MC2512-2003-DT101概述

Fixed Resistor, Metal Glaze/thick Film, 1W, 200000ohm, 250V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP

MC2512-2003-DT101规格参数

参数名称属性值
Objectid1593933108
包装说明CHIP
Reach Compliance Codecompliant
Country Of OriginTaiwan
ECCN代码EAR99
YTEOL7.85
其他特性PRECISION
制造商序列号MC
安装特点SURFACE MOUNT
端子数量2
最高工作温度155 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR
额定功率耗散 (P)1 W
额定温度70 °C
电阻200000 Ω
电阻器类型FIXED RESISTOR
尺寸代码2512
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子形状WRAPAROUND
容差0.5%
工作电压250 V

文档预览

下载PDF文档
THICK FILM CHIP RESISTORS AND JUMPERS
L
RESISTORS CAPACITORS COILS DELAY LINES
MC SERIES
50mW (0201) to 3W (2040)
ZC SERIES
Zero-ohm chip (1A - 25A)
Industry’s widest selection & lowest prices-
0.1Ω to 22M, 50mW to 3W, 0.25% to 5%, TC’s to 50ppm
0402, 0603, 0805, 1206 sizes heavily stocked in 1% & 5%
(other sizes available from stock in many popular values)
Option V: +175° operating temperature
Option U: User-trimmable chips
Option P: Increased pulse capability
Military screening, custom values & TC, microwave design, etc.
Std TC
2
RCD Type Wattage
Resis. Range
ppm/°C,
MC, ZC Rating
1
±0.5% Tol
2
typ.
100
0201
.05W
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
RoHS
Term.W is
RoHS
compliant
& 260°C
compatible
T
t
W
RCD’s Series MC resistors utilize precision thick film technology
offering inherently low inductance, exceptional reliability and superior
performance. Heavy plating with
NO LEACH
TM
nickel barrier assures
superb solderability and long shelf life. State-of-the-art production line
enables the industry’s most precise accuracies (0.25% & 50ppm!)
thereby replacing more costly thin-film chips in many applications.
RCD offers low cost offshore assembly of SM and leaded PCB’s
(refer to RCD’s Assembly Services p.114 for more information).
Standard
Resis. Range
±5% Tol
2
MC
Voltage
Rating
2
25V
Standard
Resis. Range
±1% Tol
2
10
to 22K
22.1K to 1M
10
to 1M
1Ω to 9.76
10
to 1M
1Ω to 9.76
10
to 1M
TYPE ZC
Jumper
3
L
Dimensions
Inch [mm]
W
T
t
10
to 1M
1- 9.1
,1.1M- 2.2M
10
to 1M
1- 9.1
,1.1M- 4.7M
10
to 1M
1- 9.1
,1.1M- 10M
1 Amp Max. .024±.002 .012±.002 .010±.002 .006±.002
50m
Max. [0.6±.03] [.3±.03] [.25±.03] [.15±.05]
1 Amp Max. .040±.004 .020±.004 .014±.004 .010±.004
50m
Max. [1.00±.1]
[.5±.1]
[.35±.1] [.25±.1]
1.5 Amp
.061±.005 .031±.004 .016±.006 .010±.006
Max.
[1.55±.12] [.8±.1] [.40±.15] [.25±.15]
50m
Max.
2 Amp Max. .079±.005 .050±.006 .020±.006 .016±.008
50m
Max. [2.0±.15] [1.25±.15] [.50±.15] [.4±.2]
2 Amp Max. .126±.008 .061±.006 .024±.006 .020±.008
50m
Max. [3.2±.2] [1.55±.15] [.61±.15] [.51±.2]
3 Amp Max. .126±.008 .098±.008 .024±.008 .020±.010
50m
Max. [3.2±.2]
[2.5±.2]
[.6±.2]
[.5±.25]
3 Amp Max. .197±.008 .102±.008 .024±.008 .020±.010
50m
Max. [5.0±.2]
[2.6±.2]
[.6±.2] [.50±.25]
4 Amp Max. .250±.01 .125±.010 .024±.008 .026±.012
50m
Max. [6.35±.25] [3.2±.25] [.6±.2] [.65±.3]
4
N/A
.201±.008 .402±.008 .024±.008 .055±.018
[5.1±.2] [10.2±.2] [.6±.2] [1.4±.46]
0402
Stock item
0603
Stock item
0805
Stock item
1206
Stock item
1206B
1210
.063W
50V
10
to 1M
.1W
50V
10
to 1M
.125W
.25W
.50W
.33W
10
to 1M
10
to 1M
10
to 1M
2010
2512
2512B
.75W
1.0W
2.0W
10
to 1M
2040
1
2
2.0/3.0*
10
to 1M
0.1-9.76
, 1.02M-10M 0.1-9.1
, 1.1M-20M
10
to 1M
1.02M to 5.6M
10
to 5.6M
0.1-9.76
Ω,
5.62M-10M 0.1-9.1
, 6.2M-22M
10
to 1M
1.02M to 5.6M
10
to 5.6M
0.1-9.76
Ω,
5.62M-10M 0.1-9.1
, 6.2M-22M
10
to 1M
1.02M to 5.6M
10
to 5.6M
0.1-9.76
Ω,
5.62M-10M 0.1-9.1
, 6.2M-22M
10
to 1M
1.02M to 5.6M
10
to 5.6M
0.1-9.76
Ω,
5.62M-10M 0.1-9.1
, 6.2M-22M
10
to 1M
10
to 1M
1- 9.1
150V
200V
200V
200V
( 250V
Opt. P)
250V
( 350V
Opt. P)
350V
Operation at or near full rated power (especially >1W) involves consideration of mounting geometry (solder pad and trace area/thickness, etc.). Request FA2623 for suggested mounting pad layouts.
Extended resistance range available
.
Most sizes available down to 0.01Ω 1%.
3
Up to 25A available.
4
Dim. t on MC2512B is .094[2.4] maximum.
TYPICAL PERFORMANCE
Thermal Shock (-55° to +125°C)
Overload (2.5x W, 5S, NTE 2x rated V)
Low Temp. Operation (-55°C)
High Temp. Exposure (125°C, 100hrs)
Resistance to Solder Heat
Moisture Resistance
Load Life(1000 hrs.)
Operating Temp. (+175°C Opt. V)
Derating (above 70°C)
0.2%
∆R
1%
∆R
0.2%
∆R
0.5%
∆R
0.2%
∆R
0.5%
∆R
1.0%
∆R
-55 to +155°C
Derate W & V by 1.18%/°C
PULSE WITHSTAND CHART
(increased pulse levels avail.)
500
Peak Power (Watts)
100
MC2512P
MC2010P
MC1210P
MC1206P
MC0805P
MC0603P
MC0402P
1uS
10uS
100uS
1mS
10mS
100mS
10
P/N DESIGNATION:
MC 1206
- 2210 - F T
W
1
RCD Type:
MC or ZC
Chip Size:
0201 to 2040
Options:
U, P, etc. (leave blank if std)
Resis. Code
0.25% to 1% Tol: 3 signif. digits & multiplier
(R100= .1Ω, 1R00=1Ω, 10R0=10Ω, 1000=100Ω, 1001=1KΩ)
5% Tol: 2 signif. digits & multiplier (R10=.1Ω, 1R0=1Ω, 100=10Ω,
101=100Ω, 102=1KΩ). Leave blank on ZC zero-ohm chips.
Tolerance:J=5%,
F=1%, D=0.5%, C=0.25% Leave blank on ZC
zero-ohm chips. Opt.U trimmable chips W=±15%, M=±20%, U=0 to -30%.
Packaging:
B=Bulk, T=Tape & Reel
Optional TC:
50=50ppm, 101=100ppm, 201=200ppm (leave blank if std)
Termination:
W= Lead-free, Q= Tin/Lead (leave blank if either is acceptable)
Pulse Duration
Pulse capability is dependent on res. value, waveform, repetition, etc.
Chart is a general guide for Opt. P version, single or infrequent pulses,
with peak voltage levels not exceeding 150V for 0402 & 0603 size, 300V
for 0805, 400V for 1206 & 1210, 450V for 2010 & 2512. Max pulse
wattage for standard parts (w/o Opt.P) is 50% less, max pulse voltage
is 50V less. Increased pulse levels available. For improved performance
and reliability, pulse derating factor is recommended (30-50% typ., refer
to #R-42). Verify selection by evaluating under worst-case conditions.
RCD Components Inc,
520 E.Industrial Park Dr, Manchester, NH, USA 03109
rcdcomponents.com
Tel: 603
-
669
-
0054 Fax: 603
-
669
-
5455 Email:sales@rcdcomponents.com
FA033F
Sale of this product is in accordance with GF-061. Specifications subject to change without notice.
16
让嵌入式设备枚举成WinUSB设备
USB接口作为PC上最流行和通用的接口,具备可连接多种类型的设备,连接简单,即插即用,支持热插拨,多数应用场景下不需要提供独立的电源,高传输速率,高可靠性等特点,被越来越多的产品 ......
Aguilera 微控制器 MCU
【TI DLP创意征集】将DLP应用于照相机,实现各种功能。
DLP对于光的控制作用相当于一个光开关,作为一个伪摄影爱好者,我立马想到了利用DLP控制相机感光元件个点曝光量的“鬼点子”。 具体做法是在相机镜头和感光元件之间加入DLP,以控制感光元件上 ......
sdx474621895 TI技术论坛
有用过MAX3111E的大神吗?求交流
小弟最近在用这款芯片来实现SPI到SCI的转换,发送的时候没有问题,但是在接收数据时就会出现问题。比如PC机发送5个数据1,2,3,4,5 那么MAX3111E产生5次接收中断,但是读取出来的数据是00 01 02 ......
silence0574 DSP 与 ARM 处理器
FPGA设计的四种常用思想与技巧
本文讨论的四种常用FPGA/CPLD设计思想与技巧:乒乓操作、串并转换、流水线操作、数据接口同步化,都是FPGA/CPLD逻辑设计的内在规律的体现,合理地采用这些设计思想能在FPGA/CPLD设计工作种取得 ......
eeleader FPGA/CPLD
EEWORLD大学堂----Atmel软件框架(ASF)入门(上)
Atmel软件框架(ASF)入门(上):https://training.eeworld.com.cn/course/462更进一步了解Atmel软件框架,,一个产品源代码集合,如驱动、协议栈和触摸功能。学习创建项目,导入新驱动、DMA和中断 ......
dongcuipin 嵌入式系统
PCB抄板过程中反推原理图的方法 
怎样来进行PCB原理图的反推,反推过程有该注意那些细节呢?  1、合理划分功能区域  在对一块完好的PCB电路板进行原理图的逆向设计时,合理划分功能区域能够帮工程师减少一些不必要的麻烦 ......
方学放 PCB设计

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1083  2354  1932  1283  1359  33  10  17  14  36 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved