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ECQF2683KSH

产品描述CAPACITOR, FILM/FOIL, POLYPROPYLENE, 200V, 0.068uF, THROUGH HOLE MOUNT, RADIAL LEADED
产品类别无源元件    电容器   
文件大小222KB,共3页
制造商Panasonic(松下)
官网地址http://www.panasonic.co.jp/semicon/e-index.html
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ECQF2683KSH概述

CAPACITOR, FILM/FOIL, POLYPROPYLENE, 200V, 0.068uF, THROUGH HOLE MOUNT, RADIAL LEADED

ECQF2683KSH规格参数

参数名称属性值
Objectid1936506478
包装说明,
Reach Compliance Codeunknown
ECCN代码EAR99
电容0.068 µF
电容器类型FILM CAPACITOR
介电材料POLYPROPYLENE
制造商序列号ECQF
安装特点THROUGH HOLE MOUNT
负容差10%
端子数量2
最高工作温度85 °C
最低工作温度-25 °C
封装形状RECTANGULAR PACKAGE
包装方法AMMO PACK
正容差10%
额定(直流)电压(URdc)200 V
表面贴装NO
端子形状WIRE

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Panasonic
Polypropylene Film Capacitor
Type:
Discontinued
Plastic Film Capacitors
ECQF
Non-inductive construction using Polypropylene film
with epoxy resin coating and impregnated wax
sFeatures
Low loss and excellent frequency characteristics
High insulation and moisture resistance
sRecommended
Applications
High frequency and high current circuits
General purpose circuits
sExplanation
of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
C
Q
F
Capacitance
Cap. Tol. Suffix
Straight
Blank
Suffix
Product code
Dielectric & Rated volt.
construction
J
200VDC 400VDC 630VDC
2
4
6
±
5
% ±
10
% ±
20
%
K
M
Crimped lead
H
q
Explanation of Part Number for Odd Size Taping
E
C
Q
F
Capacitance
R
7.5mm Cap. Tol. Suffix
Crimped lead
Product code
Dielectric & Rated volt.
construction
sSpecifications
Category temp. range
Rated voltage
Capacitance range
Capacitance tolerance
Dissipation factor
Withstand voltage
Insulation resistance
–25 to +85˚C
(For a higher temperature than 70˚C, derating is required.)
(Derating is required according to cap. value.)
200VDC, 400VDC, 630VDC
0.001 to 0.47µF
±5%(J), ±10%(K), ±20%(M)
0.1%max. (20˚C, 1kHz)
Between terminals
:
Rated volt.(VDC)
250% 1 to 5s
C
<
0.33µF : 45000MΩmin.
=
C>0.33µF : 15000MΩ µFmin.
(20˚C, 100VDC 60s)
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Mar. 2005

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