REV LTR
-
A
B
Orig. Release
DESCRIPTION
DATE
5/01/14
1/18/15
7/15/15
APPVD.
MLG
MLG
MLG
Extended Frequency range to 125 MHz
Added Footprint details to Fig.1 on page 6, Changed
Para. 4.1 & 4.2 to include non-destruct Bond-Pull.
XSIS XE71S – Lx, SERIES
HC/ACMOS OSCILLATORS
FOR SPACE APPLICATIONS
500 KHz to 125 MHz
( 5 x 7 mm, Formed Leads, SMD, 3.3 V )
REV STATUS
OF SHEETS
APPROVALS
PREP.
ENG.
M. Gupta
Q. A.
M. Gupta
CUST.
ENG.
CUST
Q A.
S. Gupta
REV
SHEET NO.
1
DATE
5/01/14
5/01/14
5/01/14
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16
XSIS ELECTRONICS, INC.
12620 W. 63
rd
Street, Shawnee, KS 66216 USA
XE71S-Lx SERIES HC/ACMOS
“S” LEVEL OSCILLATORS
FSC NO.
57051
SCALE
N/A
SHEET
DWG. NO.
XE71S-Lx
1 OF 3
1.
SCOPE: XE71S-Lx, HC/ACMOS series, high reliability hybrid microcircuit crystal oscillators are
specifically designed, produced and tested by Xsis Electronics, Inc. for use in space applications.
2.
APPLICABLE DOCUMENTS:
MIL-PRF-55310E
MIL-PRF-38534G
MIL-STD-883E
Oscillator, Crystal Controlled, General Specifications for
Hybrid Microcircuits, General Specifications for
Test Methods and Procedures for Microelectronics
3.
3.1
REQUIREMENTS:
General: The individual item requirements shall be as specified herein.
Package: Ceramic, 90% Min. AL
2
O
3.
Thermal Resistance,
θ
JC
: 75 C / Watt.
o
3.2
3.2.1 Termination Finish: 1.0
µm
minimum gold plate over nickel. Hot Solder tinning with Sn60/Pb40
solder per MIL-PRF-55310 is optional at an additional cost.
3.2.2 Weight:
0.4 Gms Max.
o
3.2.3 Reflow Soldering: Reflow soldering at 260 C for 10 seconds shall not degrade the performance.
-8
3.3
Hermeticity: Resistance welded, hermetically sealed, leak rate of 1(10)
atm-cc/s Max.
3.4.
Marking: As a minimum, the parts shall be marked with Xsis P/N and date code.
3.5
Absolute Maximum Ratings: Unless otherwise specified, absolute maximum ratings shall be as
follows:
Supply Voltage
Operating Free-Air Temperature Range
Storage Temperature
-0.5 to +5 VDC
o
o
-55 C to +125 C
o
o
-55 C to +125 C
3.6
Electrical Characteristics: See Table I
3.6.1 Total Dose Radiation: Hybrid Microcircuit Crystal Oscillators shall be capable of meeting the
electrical characteristics of Para. 3.6 after being exposed to total ionizing dose radiation of
100 krads as per MIL-STD-883, method 1019.
3.7
Hybrid Elements:
3.7.1 Quartz Crystals: High grade cultured quartz crystals shall be used. As an option, Xsis will use
premium Q swept quartz crystals at an additional charge. Crystal element evaluation shall be in
accordance with MIL-PRF-55310. If swept quartz crystal is required, it must be specified on the
purchase order.
XSIS ELECTRONICS, INC.
12620 W. 63
rd
FSC NO.
USA
DWG. NO.
REV
St., Shawnee, KS 66216
57051
SCALE
N/A
XE71S-Lx
SHEET
2 OF 9
B
3.7.2 Passive Elements: Established Reliability (ER) QPL components, failure level R minimum shall
be used or element lot evaluation shall be as per MIL-PRF-55310, class S, or MIL-PRF-38534,
Appendix C, Class K as applicable.
3.7.3 Microcircuit die shall be from lots that have passed the element evaluation per MIL-PRF-55310,
Appendix B, Level S, except testing per Subgroup 5 is omitted. Subgroup 5 testing is circuit
configuration dependent, therefore, it is more effectively performed at the oscillator level as
explained in Paragraph 3.7.4 herein.
3.7.4 For Output Frequency up to 85 MHz, Microcircuit die used in the oscillator shall be from NSC/FC
54ACT family and must be from wafer lot that has been successfully tested in the oscillator for
ionizing radiation of up to100 krads and is Single Event Latch-up immune for LET of up to 95
2
Mev-cm /mg. Xsis Electronics has also performed SET & SEL testing on the microcircuit die.
Test reports are available on request. For output frequencies above 85 MHz, the microcircuit die
shall be from 0.8 µm BiCMOS Si family and must be from wafer lots that have been successfully
tested in the oscillator for ionizing radiation of up to 100Krads and is known to be Single Event
2
Latch-up immune for LET of up to 95 Mev-cm /mg.
3.7.5 Workmanship, Rework and Process controls shall be in accordance with the requirements of
MIL-PRF-55310.
3.7.6 Lot Traceability: Production lot for these oscillators shall be homogenous. Each element used in
the production lot shall be traceable to a single lot. Swept quartz shall be traceable to the quartz
bar, and its applicable processing details.
4.
Quality Assurance Provisions: The quality assurance provisions shall be per MIL-PRF-55310,
except as specified herein.
4.1
100% Screening: The 100% screening shall be performed as per Table II. PDA requirements for
nondestructive bond pull and burn-in shall be as specified below.
PDA for Nondestruct Bond Pull: Unless otherwise specified, PDA shall be 2% of total number of
wires or 1 wire whichever is greater.
PDA for Burn-in: Unless otherwise specified, PDA for burn-in shall be 2% or 1 oscillator whichever
o
o
is greater and shall be applicable to +23 C and/or +25 C static tests only. In addition Delta
Calculation shall be performed after Burn-in and shall count for PDA. All measured values for
Delta Calculation shall be recorded. Parts that exceed the specified delta limits shall be rejected and
be counted for PDA. Delta Calculation shall be performed at 3.3 VDC for the following parameters:
Input Current
Output High Level
Output Low Level
10% change Maximum
10% change Maximum
0.1V change Maximum
4.2
4.3
4.4
4.5
Group A inspection shall be in accordance with MIL-PRF-55310 for product level S.
Group B inspection ( 30 day aging ) shall be in accordance with MIL-PRF-55310 for product level S.
In order to expedite delivery, by customer request, the aging test can be ended after 15 days if the
amount of frequency aging is less than 50% of the 30 day specification limit.
Oscillators shall be capable of meeting group C inspection per MIL-PRF-55310. Generic group C
inspection data on similar parts may be used to satisfy this requirement. When specified by the
Customer, Xsis Electronics will perform Group C testing at an additional charge.
FSC NO.
USA
DWG. NO.
REV
4.6
XSIS ELECTRONICS, INC.
12620 W. 63
rd
St., Shawnee, KS 66216
57051
SCALE
N/A
XE71S-Lx
SHEET
3 OF 9
B
4.7
Inspection and Test Data: Unless otherwise specified in the purchase order, the following
Inspection and test data documentation shall be supplied with the parts.
Certificate of Conformance
Summary of Class “S” screening Test Results
PDA Calculations for Non-Destruct Bond Pull and Burn-in
Summary of Elements Lot Traceability
Electrical Tests before and after Burn-in
Group A Inspection Summary
Group B (30 day Aging) Data
Radiographic Inspection Certificate
4.8
The following test and inspection options are available at customer request.
Customer Source Inspection for Pre-Cap and Final
Group C Inspection per MIL-PRF-55310 on 4 or 8 units
DPA (Destructive Physical Analysis)
Life Test, 1000 Hrs at 125C per MIL-STD-883, Method 1005, Cond. A
MIL-PRF-38534, Group B Inspection
MIL-PRF-38534, Group C Inspection
5.0
Preservation, Packaging and Packing: The oscillators shall be clean, dry and packaged in a
manner to provide adequate protection against electrostatic discharge, corrosion, deterioration
and physical damage during shipment.
XSIS ELECTRONICS, INC.
12620 W. 63
rd
FSC NO.
USA
DWG. NO.
REV
St., Shawnee, KS 66216
57051
SCALE
N/A
XE71S-Lx
SHEET
4 OF 9
B
6.0 Part Numbering Example:
XE71S - L
Model #
(See Note Below)
-
FREQUENCY
Add Suffix “ G ” if Enable/Disable is Required
*
Overall Frequency Accuracy Options
1 = + 50 PPM
2 = + 25 PPM
3 = + 100 PPM
4 = + 50 PPM
5 = + 25 PPM
6 = + 100 PPM
7 = + 75 PPM
8 = + 60 PPM
-10
o
C
-10
o
C
-40
o
C
-40
o
C
-40
o
C
-55
o
C
-55
o
C
-55
o
C
to +70
o
C
to +70
o
C
to +85
o
C
to +85
o
C
to +85
o
C
to +125
o
C
to +125
o
C
to +105
o
C
Load variations and 5 year aging
•
*
Overall Frequency Accuracy includes effects of Operating Temperature, Supply Voltage,
P/N Example: XE71S - L7 - 24.000 MHz = 24.000 MHz, Class “S” Oscillator, + 75 PPM Overall Frequency Accuracy
o
o
over an operating temperature range of -55 C to +125 C,
NOTE:
Following additional models are available for applications that can accommodate reduced level of
screening and quality conformance inspection:
XE71H:
Model XE71H
is same as
Model XE71S
except as follows:
Group A inspection is per MIL-PRF-55310, Class B
Group B inspection (30 day aging ) per MIL-PRF-55310 is not applicable
XE71E:
Model XE71E
uses the same design and elements as
Model X71S
except as follows:
100% screening is as per Table III herein
PDA for Burn-in is 10% or 1 unit whichever is greater
Delta measurements of paragraph 4.3 are not applicable
Group A inspection is as per MIL-PRF-55310, Class B
Group B inspection (30 day aging ) per MIL-PRF-55310 is not applicable
XE71B:
Model XE71B
is same as
Model XE71E
except as follows:
Active and Passive Elements are as per MIL-PRF-55310, Class B. Microcircuit die
is similar to the one used in Model XE7S but is not from radiation tested wafer lot.
XE71P:
Model XE71P
is a form, fit and function equivalent prototype of
Model XE71S.
Prototypes may use commercial grade elements and are not screened. Quality
Conformance inspection is not applicable.
XSIS ELECTRONICS, INC.
12620 W. 63
rd
FSC NO.
USA
DWG. NO.
REV
St., Shawnee, KS 66216
57051
SCALE
N/A
XE71S-Lx
SHEET
5 OF 9
B
FPGA/CPLD
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