CHM1290REF
20-30GHz SUB-HARMONICALLY PUMPED MIXER
GaAs Monolithic Microwave IC in SMD leadless package
Description
The monolithic microwave IC (MMIC) in the
package is a multi-function chip which
integrates a self biased LO buffer amplifier
and a sub-harmonic diode mixer for 2LO
suppression. It is usable both for up- and
down-conversion and it is designed for a
wide range of applications, typically
commercial communication systems for
broadband local access (LMDS).
The circuit is manufactured with a PM-
HEMT process, 0.25µm gate length, via
holes through the substrate, air bridges and
electron beam gate lithography. It is
supplied in a new SMD-type leadless chip
carrier.
Main Features
•
•
•
•
•
•
•
Broadband performance : 20-30GHz
10.5 dB conversion Loss
-25dBm 2LO Power @ RF port
-4dBm LO input power
-3dBm input power 1dB compression
Low DC power consumption,
33mA@ 3.0V
Dimensions: 5.08 x 5.08 x 0.97 mm
3
SMD Package Dimensions
Ref.: DSCCHM1290REF2239 -27-Aug.-02
1/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
CHM1290REF
Schematic
20-30GHz SHP Mixer
Typical Bias Conditions
For an ambient temperature of +25°C
Symbol
V
d
I
d
Pin No
3
3
Parameter
Drain bias Voltage
Drain current
Values
4
33
Unit
V
mA
Absolute Maximun Ratings
(1)
Tamb. = 25°C
Symbol
Vd
Pin
Top
Tstg
Drain bias voltage
Maximum peak input overdive (2)
Operating temperature range (3)
Storage temperature range
Parameter
Values
5
8
-55 to 85
-55 to 125
Unit
V
dBm
ºC
ºC
(1) Operation of the device above anyone of these parameters may cause permanent damage
(2) Duration <1s
(3) Upper temperature limit strongly dependent on motherboard design; ratings given for ideal
thermal coupling.
Ref. : DSCCHM1290REF2239 -27-Aug.-02
2/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
20-30GHz SHP Mixer
Vd=4V, Id at 33mA
CHM1290REF
Typical results on PCB (recommended motherboard layout)
CHM1290 SMD packaged : UP-CONVERTER ( Conv. Losses & Leakages )
Vds=4V / Ids=33mA / LO Power=-4dBm / IF Frequency= 1Ghz
0
-2.5
-5
Conversion Loss (dB)
-7.5
RF(+)=21 GHz
RF(+)=31 GHz
5
Lc(2xLO-IF)
Lc(2xLO+IF)
2*OL/RF
OL/RF
0
-5
-10
-15
-20
-25
RF(-)=29 GHz
-10
-12.5
-15
-17.5
-20
RF(-)=19 GHz
-30
-35
-40
-45
9
10
11
12
13
14
15
16
-22.5
-25
LO Frequency (GHz)
CHM1290 SMD packaged : UP-CONVERTER ( Conv. Losses & Leakages )
Vds=4V / Ids=33mA / LO Power=0dBm / IF Frequency= 1Ghz
0
-2.5
-5
-7.5
Conversion Loss (dB)
-10
-12.5
5
Lc(2xLO-IF)
Lc(2xLO+IF)
2*OL/RF
OL/RF
0
-5
RF(+)=21 GHz
RF(+)=31 GHz
-10
-15
-20
RF(-)=29 GHz
-15
-17.5
-20
-22.5
-25
9
10
11
12
13
14
15
16
-25
RF(-)=19 GHz
-30
-35
-40
-45
LO Frequency (GHz)
Ref. : DSCCHM1290REF2239 -27-Aug.-02
3/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
Leakage @ LO & 2xLO (dBm)
Leakage @ LO & 2xLO (dBm)
CHM1290REF
Footprint
20-30GHz SHP Mixer
Please note that PIN 1 is located in the lower left corner of the package (front-side
view) for all SMD-type packages from United Monolithic Semiconductors. It is
indicated by a triangle on the package lid. Starting with PIN 1 the other pads are
numbered counter-clockwise (front-side view). ATTENTION: The dot on the backside
of the package (i.e. side with metallic pads) is just for fabrication purposes and does
NOT indicate the location of PIN 1.
Ref. : DSCCHM1290REF2239 -27-Aug.-02
4/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
20-30GHz SHP Mixer
Application note
CHM1290REF
The design of the motherboard has a strong impact on the over all performance since
the transition from the motherboard to the package is comparably large. In case of
the SMD-type packages of United Monolithic Semiconductors the motherboard
should be designed according to the information given in the following to achieve
good performance. Other configurations are also possible but can lead to different
results. If you need advise please contact United Monolithic Semiconductors for
further information.
SMD-type packages of UMS should allow design and fabrication of micro- and mm-
wave modules at low cost. Therefore, a suitable motherboard environment has been
chosen. All tests and verifications have been performed on Rogers RO4003. This
material exhibits a permittivity of 3.38 and has been used with a thickness of 200µm
[8 mils] and a 1/2oz or less copper cladding. The corresponding 50 Ohm
transmission line has a strip width of about 460µm [approx. 18 mils].
The contact areas on the motherboard for the package connections should be
designed according to the footprint given above. The proper via structure under the
ground pad is very important in order to achieve a good RF and lifetime performance.
All tests have been done by using a grid of plenty plated through vias with a diameter
of less than 200µm [8 mils] and a spacing of less than 400µm [16 mils] from the
centres of two adjacent vias. The via grid should cover the whole space under the
ground pad and the vias closest to the RF ports should be located near the edge of
the pad to allow a good RF ground connection. Since the vias are important for heat
transfer, a proper via filling should be guaranteed during the mounting procedure to
get a low thermal resistance between package and heat sink. For power devices the
use of heat slugs in the motherboard instead of a via grid is recommended.
For the mounting process the SMD-type package can be handled as a standard
surface mount component. The use of either solder or conductive epoxy is possible.
The solder thickness after reflow should be typical 50µm [2 mils] and the lateral
alignment between the package and the motherboard should be within 50µm [2 mils].
Caution should be taken to obtain a good and reliable contact over the whole pad
areas. Voids or other improper connections, in particular, between the ground pads of
motherboard and package will lead to a deterioration of the RF performance and the
heat dissipation. The latter effect can reduce drastically reliability and lifetime of the
product.
Ref. : DSCCHM1290REF2239 -27-Aug.-02
5/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
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