IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Reach Compliance Code | unknow |
主体宽度 | 0.693 inch |
主体深度 | 0.201 inch |
主体长度 | 1.4 inch |
联系完成配合 | AU |
联系完成终止 | Tin/Lead (Sn/Pb) |
触点材料 | P-CUSN |
触点样式 | SQ PIN-SKT |
目前评级 | 1 A |
设备插槽类型 | IC SOCKET |
使用的设备类型 | DIP28 |
介电耐压 | 500VAC V |
外壳材料 | GLASS FILLED THERMOPLASTIC |
绝缘电阻 | 5000000000 Ω |
JESD-609代码 | e0 |
制造商序列号 | 1500 |
插接触点节距 | 0.1 inch |
安装方式 | STRAIGHT |
触点数 | 28 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
PCB接触模式 | RECTANGULAR |
PCB触点行间距 | 0.6 mm |
端子节距 | 2.54 mm |
端接类型 | SOLDER |
Base Number Matches | 1 |
1500-806-28 | 1500-803-32 | 1500-803-24 | 1500-803-28 | 1500-803-20 | 1500-806-40 | 1500-806-32 | 1500-806-24 | |
---|---|---|---|---|---|---|---|---|
描述 | IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder | IC Socket, DIP32, 32 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder | IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder | IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder | IC Socket, DIP20, 20 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder | IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder | IC Socket, DIP32, 32 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder | IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
主体宽度 | 0.693 inch | 0.391 inch | 0.391 inch | 0.391 inch | 0.391 inch | 0.693 inch | 0.693 inch | 0.693 inch |
主体深度 | 0.201 inch | 0.201 inch | 0.201 inch | 0.201 inch | 0.201 inch | 0.201 inch | 0.201 inch | 0.201 inch |
主体长度 | 1.4 inch | 1.6 inch | 1.2 inch | 1.4 inch | 1 inch | 2 inch | 1.6 inch | 1.2 inch |
联系完成配合 | AU | AU | AU | AU | AU | AU | AU | AU |
联系完成终止 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
触点材料 | P-CUSN | P-CUSN | P-CUSN | P-CUSN | P-CUSN | P-CUSN | P-CUSN | P-CUSN |
触点样式 | SQ PIN-SKT | SQ PIN-SKT | SQ PIN-SKT | SQ PIN-SKT | SQ PIN-SKT | SQ PIN-SKT | SQ PIN-SKT | SQ PIN-SKT |
目前评级 | 1 A | 1 A | 1 A | 1 A | 1 A | 1 A | 1 A | 1 A |
设备插槽类型 | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET |
使用的设备类型 | DIP28 | DIP32 | DIP24 | DIP28 | DIP20 | DIP40 | DIP32 | DIP24 |
介电耐压 | 500VAC V | 500VAC V | 500VAC V | 500VAC V | 500VAC V | 500VAC V | 500VAC V | 500VAC V |
外壳材料 | GLASS FILLED THERMOPLASTIC | GLASS FILLED THERMOPLASTIC | GLASS FILLED THERMOPLASTIC | GLASS FILLED THERMOPLASTIC | GLASS FILLED THERMOPLASTIC | GLASS FILLED THERMOPLASTIC | GLASS FILLED THERMOPLASTIC | GLASS FILLED THERMOPLASTIC |
绝缘电阻 | 5000000000 Ω | 5000000000 Ω | 5000000000 Ω | 5000000000 Ω | 5000000000 Ω | 5000000000 Ω | 5000000000 Ω | 5000000000 Ω |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
制造商序列号 | 1500 | 1500 | 1500 | 1500 | 1500 | 1500 | 1500 | 1500 |
插接触点节距 | 0.1 inch | 0.1 inch | 0.1 inch | 0.1 inch | 0.1 inch | 0.1 inch | 0.1 inch | 0.1 inch |
安装方式 | STRAIGHT | STRAIGHT | STRAIGHT | STRAIGHT | STRAIGHT | STRAIGHT | STRAIGHT | STRAIGHT |
触点数 | 28 | 32 | 24 | 28 | 20 | 40 | 32 | 24 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
PCB接触模式 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
PCB触点行间距 | 0.6 mm | 0.3 mm | 0.3 mm | 0.3 mm | 0.3 mm | 0.6 mm | 0.6 mm | 0.6 mm |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端接类型 | SOLDER | SOLDER | SOLDER | SOLDER | SOLDER | SOLDER | SOLDER | SOLDER |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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