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BZX84C22W-7-F

产品描述diode zener 22v 200mw sot323
产品类别半导体    分立半导体   
文件大小91KB,共4页
制造商All Sensors
标准  
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BZX84C22W-7-F概述

diode zener 22v 200mw sot323

BZX84C22W-7-F规格参数

参数名称属性值
Datasheets
BZX84C2V4W - BZX84C39W
Product Photos
SOT-323
RoHS Informati
RoHS Cert of Compliance
Standard Package3,000
CategoryDiscrete Semiconductor Products
FamilyDiodes - Zener - Single
系列
Packaging
Tape & Reel (TR)
Voltage - Zener (Nom) (Vz)22V
容差
Tolerance
±6%
Power - Max200mW
Impedance (Max) (Zzt)55 Ohm
Current - Reverse Leakage @ V100nA @ 15.4V
Voltage - Forward (Vf) (Max) @ If900mV @ 10mA
Operating Temperature-65°C ~ 125°C
Mounting TypeSurface Mou
封装 / 箱体
Package / Case
SC-70, SOT-323
Supplier Device PackageSOT-323
Other NamesBZX84C22W7F

文档预览

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BZX84C2V4W - BZX84C39W
200mW SURFACE MOUNT ZENER DIODE
Please click here to visit our online spice models database.
Features
Planar Die Construction
200mW Power Dissipation
Zener Voltages from 2.4V – 39V
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 4)
"Green" Device (Notes 1 and 2)
Mechanical Data
Case: SOT-323
Case Material: Molded Plastic, "Green" Molding Compound,
Note 2. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Polarity: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.006 grams (approximate)
Top View
Device Schematic
Maximum Ratings
Forward Voltage
@T
A
= 25°C unless otherwise specified
@ I
F =
10mA
Symbol
V
F
Value
0.9
Unit
V
Characteristic
Thermal Characteristics
Characteristic
Power Dissipation (Note 3)
Thermal Resistance, Junction to Ambient Air (Note 3)
Operating and Storage Temperature Range
Notes:
Symbol
P
D
R
θ
JA
T
J
, T
STG
Value
200
625
-65 to +125
Unit
mW
K/W
°C
1. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com./products/lead_free/index.php.
2. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
3. Mounted on FR4 PC board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
4. No purposefully added lead.
BZX84C2V4W - BZX84C39W
Document number: DS30066 Rev. 15 - 2
1 of 4
www.diodes.com
May 2008
© Diodes Incorporated

 
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