Operating Temperature Range -20°C to +70°C or -40°C to +85°C
Tape and Reel Packaging, EIA-418
Wireless Communications
Broadband Access
FPGA/Microcontrollers
Computer Peripherals
Microprocessors
Test and Measurement
Consumer Electronics
Portable Equipment
Part Dimensions:
11.1 × 4.83 × 4.3mm
•
587.84mg
Applications
Description
CTS ATSSMTS incorporates a high Q quartz resonator in a proven resistance-weld metal package. ATSSMTS offers
tight stability options that are ideal for supporting a wide range of commercial and industrial applications.
Ordering Information
Model
TS
Frequency Code
[MHz]
XXX
Mode of
Oscillation
F
Tolerance
@ +25°C
3
Temperature
Stability
3
Temperature
Range
I
Load
Capacitance
D
Packaging
T
Code
Frequency
Product Frequency Code
1
Code
1
X
2
Y
3
Tolerance
±10ppm
±15ppm
±20ppm
±25ppm
±30ppm
Code Temp. Range
-20°C to +70°C
C
-40°C to +85°C
I
Packing
Code
Tape & Reel
T
Code
F
T
Mode
Fundamental
3rd Overtone
Code
1
X
2
Y
3
5
Stability
±10ppm
±15ppm
±20ppm
±25ppm
±30ppm
±50ppm
2
Code Capacitance Code Capacitance
K
D
8pF
18pF
9pF
20pF
J
E
10pF
24pF
A
F
12pF
30pF
L
G
13pF
32pF
B
H
16pF
Series
C
S
Notes:
1] Refer to document 016-1454-0, Frequency Code Tables. 3-digits for frequencies <100MHz.
2] Check factory availability when combined with -40°C to +85°C temperature range.
Not all performance combinations and frequencies may be available.
Contact your local CTS Representative or CTS Customer Service for availability.
This product is specified for use only in standard commercial applications. Supplier disclaims all express and implied warranties and liability in connection with any use of this
product in any non-commercial applications or in any application that may expose the product to conditions that are outside of the tolerances provided in its specification.
2008年7月17～18日，由深圳创意时代主办的“第四届便携式产品设计与电源管理技术研讨会”在深圳隆重召开。为期两天的大会紧紧围绕便携产品设计、便携电源管理两大主题展开，引起了关于便携主题的广泛讨论。国际知名企业TI、ST 、ADI倾情参与，知名行业分析机构IN-Stat China 预测了行业的最新趋势，3M、飞兆、英飞凌、精工、爱国者、中电等国内外著名企业都发表了精彩演讲。 精彩的...[详细]
复杂 IC 不仅吸引了更多系统，而且还吞食着设计者用于建立、评估与校准芯片的测试设备。 芯片设计者正开始在自己的复杂 IC上设计测试与测量仪器。在IC中设计测试仪器的潮流开始于CPU核心与总线的数字调试硬件。现在，设计者也在高速I/O块中建立分析仪器。设计者正在高频芯片的内部作业中集成更复杂的模拟与RF测试仪器，如读取通道IC。 这只是尺度问题。随着系统级 IC 越来越大而复杂...[详细]
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
