Surface Mount Microwave
Schottky Mixer Diodes
Technical Data
HSMS-8101 Single
HSMS-8202 Series Pair
HSMS-8205 Unconnected Pair
HSMS-8207 Ring Quad
HSMS-8209 Crossover Quad
Features
• Optimized for use at
10-14 GHz
• Low Capacitance
• Low Conversion Loss
• Low RD
• Low Cost Surface Mount
Plastic Package
Plastic SOT-23 Package
Package Lead Code
Identification
(Top View)
SINGLE
3
SERIES
3
1
#1
2
1
#2
2
Plastic SOT-143 Package
Description/Applications
These low cost microwave
Schottky diodes are specifically
designed for use at X/Ku-bands
and are ideal for DBS and VSAT
downconverter applications. They
are available in SOT-23 and
SOT-143 standard package
configurations.
Note that HP's manufacturing
techniques assure that dice found
in pairs and quads are taken from
adjacent sites on the wafer,
assuring the highest degree of
match.
UNCONNECTED
PAIR
3
4
RING
QUAD
3
4
1
#5
2
1
#7
2
CROSS-OVER
QUAD
3
4
1
#9
2
Absolute Maximum Ratings
[1]
, T
A
= +25°C
Symbol Parameter
P
T
P
IV
T
J
T
STG
, T
op
Total Device Dissipation
[2]
Peak Inverse Voltage
Junction Temperature
Storage and Operating
Temperature
Unit
mW
V
°C
°C
Min.
—
—
—
-65
Max.
75
4
+150
+150
Notes:
1. Operation in excess of any one
of these conditions may result
in permanent damage to the
device.
2. Measured in an infinite heat
sink at T
CASE
= 25°C. Derate
linearly to zero at 150°C per
diode.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
2
DC Electrical Specifications, T
A
= 25°C
Symbol Parameters and Test Conditions
V
BR
C
T
∆C
T
R
D
∆R
D
V
F
∆V
F
Breakdown Voltage
I
R
= 10
µA
Total Capacitance
V
R
= 0 V, f = 1 MHz
Capacitance Difference
V
R
= 0 V, f = 1 MHz
Dynamic Resistance
I
F
= 5 mA
Dynamic Resistance Difference
I
F
= 5 mA
Forward Voltage
I
F
= 1 mA
Forward Voltage Difference
I
F
= 1 mA
Lead Code
Package Marking Code in White
V
pF
pF
Ω
Ω
mV
mV
HSMS-8101 HSMS-8102 HSMS-8205 HSMS-8207 HSMS-8209
Units Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
4
0.26
—
14
—
250
350
—
1
R1
2
2R
250
4
0.26
0.04
14
2
350
20
5
R5
250
4
0.26
0.04
14
2
350
20
7
R7
250
4
0.26
0.04
14
2
350
20
9
R9
250
4
0.26
0.04
14
2
350
20
RF Electrical Parameters, T
A
= 25°C
Symbol
L
c
Z
IF
SWR
Parameter
Conversion Loss at 12 GHz
IF Impedance
SWR at 12 GHz
Units
dB
Ω
Typical
6.3
150
1.2
Note:
DC Load Resistance = 0
Ω;
LO Power = 1 mW.
SPICE Parameters
I
S
= 4.6 E-8
R
S
= 6
N = 1.09
B
V
= 7.3
I
BV
= 10E-5
E
G
= 0.69
C
JO
= 0.18 E-12
P
B
(V
J
) = 0.5
M = 0.5
FC = 0.5
TT = 0
Linear Equivalent Circuit
0.08 pF
1.0 nH
1.3 nH
6
Ω
0.17 pF
R
j
Self Bias
R
j
1 mA
263
2.5 mA
142
3
Typical Performance, T
C
= 25°C
100
I
F
- FORWARD CURRENT (mA)
FORWARD CURRENT (mA)
∆V
F
- FORWARD VOLTAGE DIFFERENCE (mV)
30
I
F
(Left Scale)
10
30
9
10
10
CONVERSION LOSS (dB)
8
1
0.1
T
A
= +125°C
T
A
= +25°C
T
A
= –55°C
∆V
F
(Right Scale)
1
1
7
0.01
0
0.2
0.4
0.6
0.8
0.3
0.3
0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55
V - FORWARD VOLTAGE (V)
6
–7 –5 –3 –1 1
3
5
7
9
11 13
FORWARD VOLTAGE (V)
LOCAL OSCILLATOR POWER (dBm)
Figure 1. Typical Forward Current
vs. Forward Voltage at Three
Temperatures.
Figure 2. Typical VF Match, HSMS-
820X Pairs and Quads.
Figure 3. Typical Conversion Loss
vs. Local Oscillator Power.
Ordering Information
Specify part number followed by option. For example:
H SMS - 8101 - XXX
Bulk or Tape and Reel Option
Part Number
Surface Mount Schottky
Hewlett-Packard
Profile Option
Descriptions
-BLK = Bulk
-TR1 = 3K pc. Tape and Reel,
Device Orientation
Figures 4, 5
-TR2 = 10K pc. Tape and Reel,
Device Orientation
Figures 4, 5
Tape and Reeling conforms to
Electronic Industries RS-481,
“Taping of Surface Mounted
Components for Automated
Placement.”
TOP VIEW
4 mm
END VIEW
Device Orientation
REEL
8 mm
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
Figure 4. Option -TR1/-TR2 for SOT-23 Packages.
4 mm
8 mm
Figure 5. Option -TR1/-TR2 for SOT-143 Packages.
Package Characteristics
Lead Material ...................................................................................... Alloy 42
Lead Finish ............................................................................ Tin-Lead 85-15%
Maximum Soldering Temperature .............................. 260°C for 5 seconds
Minimum Lead Strength .......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance .............................. 0.08 pF (opposite leads)
Package Dimensions
Outline 23 (SOT-23)
1.02 (0.040)
0.89 (0.035)
0.54 (0.021)
0.37 (0.015)
3
1.40 (0.055)
1.20 (0.047)
2
2.65 (0.104)
2.10 (0.083)
PACKAGE
MARKING
CODE
XX
1
0.50 (0.024)
0.45 (0.018)
2.04 (0.080)
1.78 (0.070)
TOP VIEW
0.152 (0.006)
0.066 (0.003)
1.02 (0.041)
0.85 (0.033)
3.06 (0.120)
2.80 (0.110)
0.10 (0.004)
0.013 (0.0005)
SIDE VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.69 (0.027)
0.45 (0.018)
END VIEW
Outline 143 (SOT-143)
0.92 (0.036)
0.78 (0.031)
E
PACKAGE
MARKING
CODE
C
1.40 (0.055)
1.20 (0.047)
E
0.60 (0.024)
0.45 (0.018)
2.65 (0.104)
2.10 (0.083)
www.hp.com/go/rf
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Americas/Canada:
1-800-235-0312 or
408-654-8675
Far East/Australasia:
Call your local HP
sales office.
0.15 (0.006)
0.09 (0.003)
1.02 (0.041)*
0.85 (0.033)
0.10 (0.004)**
0.013 (0.0005)
0.69 (0.027)
0.45 (0.018)
XX
B
2.04 (0.080)
1.78 (0.070)
3.06 (0.120)
2.80 (0.110)
0.54 (0.021)
0.37 (0.015)
Japan:
(81 3) 3335-8152
Europe:
Call your local HP sales office.
Data subject to change.
Copyright © 1999 Hewlett-Packard Co.
Obsoletes 5966-0929E
5968-3886E (3/99)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
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