IC socket .100" 28pos
| 参数名称 | 属性值 |
| Datasheets | |
| 212-1-28-006 Drawing | |
| Standard Package | 1,700 |
| Category | Connectors, Interconnects |
| Family | Sockets for ICs, Transistors |
| 系列 Packaging | Tube |
| 类型 Type | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Material - Mating | Beryllium Coppe |
| Mounting Type | Surface Mou |
| Features | Open Frame |
| Terminati | Solde |
| Pitch - Pos | 0.100" (2.54mm) |
| Contact Finish - Pos | Ti |
| Contact Finish Thickness - Pos | 200µin (5.08µm) |
| Contact Material - Pos | Brass |
| 外壳材料 Housing Material | Polybutylene Terephthalate (PBT) |
| Operating Temperature | -40°C ~ 105°C |
| Material Flammability Rating | UL94 V-0 |
| 电流额定值 Current Rating | 3A |
| Contact Resistance | 4 mOhm |
| 212-1-28-006 | 212-1-24-006 | 212-1-32-006 | 212-1-48-006 | 212-1-40-006 | |
|---|---|---|---|---|---|
| 描述 | IC socket .100" 28pos | IC socket .100" 24pos | IC socket .100" 32pos | IC socket .100" 48pos | IC socket .100" 40pos |
| Standard Package | 1,700 | 2,000 | 1,500 | 1,000 | 1,200 |
| Category | Connectors, Interconnects | Connectors, Interconnects | Connectors, Interconnects | Connectors, Interconnects | Connectors, Interconnects |
| Family | Sockets for ICs, Transistors | Sockets for ICs, Transistors | Sockets for ICs, Transistors | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
| 系列 Packaging |
Tube | Tube | Tube | Tube | Tube |
| 类型 Type |
DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 28 (2 x 14) | 24 (2 x 12) | 32 (2 x 16) | 48 (2 x 24) | 40 (2 x 20) |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold | Gold | Gold | Gold | Gold |
| Contact Material - Mating | Beryllium Coppe | Beryllium Coppe | Beryllium Coppe | Beryllium Coppe | Beryllium Coppe |
| Mounting Type | Surface Mou | Surface Mou | Surface Mou | Surface Mou | Surface Mou |
| Features | Open Frame | Open Frame | Open Frame | Open Frame | Open Frame |
| Terminati | Solde | Solde | Solde | Solde | Solde |
| Pitch - Pos | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish - Pos | Ti | Ti | Ti | Ti | Ti |
| Contact Finish Thickness - Pos | 200µin (5.08µm) | 200µin (5.08µm) | 200µin (5.08µm) | 200µin (5.08µm) | 200µin (5.08µm) |
| Contact Material - Pos | Brass | Brass | Brass | Brass | Brass |
| 外壳材料 Housing Material |
Polybutylene Terephthalate (PBT) | Polybutylene Terephthalate (PBT) | Polybutylene Terephthalate (PBT) | Polybutylene Terephthalate (PBT) | Polybutylene Terephthalate (PBT) |
| Operating Temperature | -40°C ~ 105°C | -40°C ~ 105°C | -40°C ~ 105°C | -40°C ~ 105°C | -40°C ~ 105°C |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 |
| 电流额定值 Current Rating |
3A | 3A | 3A | 3A | 3A |
| Contact Resistance | 4 mOhm | 4 mOhm | 4 mOhm | 4 mOhm | 4 mOhm |
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微控制器 MCU
单片机
微控制器 MCU
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