bga surface mount
参数名称 | 属性值 |
Datasheets | |
514-xx-yyyMxx-zzz148 | |
RoHS Informati | |
RoHS Declarati | |
Standard Package | 13 |
Category | Connectors, Interconnects |
Family | Sockets for ICs, Transistors |
系列 Packaging | Bulk |
类型 Type | BGA |
Number of Positions or Pins (Grid) | 576 (30 x 30) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 29.5µin (0.75µm) |
Contact Material - Mating | Beryllium Coppe |
Mounting Type | Surface Mou |
Features | Open Frame |
Terminati | Solde |
Pitch - Pos | 0.100" (2.54mm) |
Contact Finish - Pos | Ti |
Contact Material - Pos | Brass |
外壳材料 Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature | -55°C ~ 125°C |
Termination Post Length | 0.055" (1.40mm) |
Material Flammability Rating | UL94 V-0 |
电流额定值 Current Rating | 1A |
Contact Resistance | 10 mOhm |
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