transistor socket TO-3 solder
| 参数名称 | 属性值 |
| Datasheets | |
| 4-1437504-1 | |
| Standard Package | 400 |
| Category | Connectors, Interconnects |
| Family | Sockets for ICs, Transistors |
| 系列 Packaging | Bulk |
| 类型 Type | Transistor, TO-3 |
| Number of Positions or Pins (Grid) | 3 (Oval) |
| Contact Finish - Mating | Gold |
| Contact Material - Mating | Beryllium Coppe |
| Mounting Type | Chassis Mou |
| Features | Closed Frame |
| Terminati | Solde |
| Contact Finish - Pos | Gold |
| Contact Material - Pos | Beryllium Coppe |
| 外壳材料 Housing Material | Polytetrafluoroethylene (PTFE) |
| Operating Temperature | -55°C ~ 125°C |
| 4-1437504-1 | 4-1437504-5 | 4-1437504-9 | |
|---|---|---|---|
| 描述 | transistor socket TO-3 solder | conn socket transist 3term TO-3 | conn socket transist 3term TO-3 |
| Standard Package | 400 | 100 | 400 |
| Category | Connectors, Interconnects | Connectors, Interconnects | Connectors, Interconnects |
| Family | Sockets for ICs, Transistors | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
| 系列 Packaging |
Bulk | Bulk | Bulk |
| 类型 Type |
Transistor, TO-3 | Transistor, TO-3 | Transistor, TO-3 |
| Number of Positions or Pins (Grid) | 3 (Oval) | 3 (Oval) | 3 (Oval) |
| Contact Finish - Mating | Gold | Gold | Gold |
| Contact Material - Mating | Beryllium Coppe | Beryllium Coppe | Beryllium Coppe |
| Mounting Type | Chassis Mou | Chassis Mou | Chassis Mou |
| Features | Closed Frame | Closed Frame | Closed Frame |
| Terminati | Solde | Solde | Solde |
| Contact Finish - Pos | Gold | Gold | Gold |
| Contact Material - Pos | Beryllium Coppe | Beryllium Coppe | Beryllium Coppe |
| 外壳材料 Housing Material |
Polytetrafluoroethylene (PTFE) | Polytetrafluoroethylene (PTFE) | Polytetrafluoroethylene (PTFE) |
| Operating Temperature | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C |
测试/测量
嵌入式系统
51单片机
模拟电子
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嵌入式系统
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