INTERCONNECTS
SERIES 310, 311, 315 • .100” GRID SOLDER TAIL •
SINGLE ROW STRIPS
•
SIP sockets accept .015 - .025” diameter pins
and standard IC leads
•
Various solder tails available: standard length,
long for multi-layer boards, very low and ultra
low profile. See Mill-Max #1001, #0134, #0501
or #1534 pins. See pages 161, 162 and 165
for details
•
Hi-Rel, 4-finger BeCu #12 and #30 contact are
rated at 3 amps. See pages 252 and 253 for
details
•
Insulators are high temperature thermoplastic,
FIG. 1
suitable for all soldering operations
ORDERING INFORMATION
Series 310...001
Standard Solder Tail
310-XX-1_ _-41-001000
Specify number of pins
01-64
FIG. 1
Series 311...001
Long Solder Tail
311-XX-1_ _-41-001000
FIG. 2
FIG. 2
Series 315...001
Specify number of pins
O
O
O
01-64
Very Low Profile
315-XX-1_ _-41-001000
FIG. 3
Series 315...003
Specify number of pins
01-64
Ultra Low Profile
315-XX-1_ _-41-003000
FIG. 4
FIG. 3
Specify number of pins
01-64
2011/65/EU
RoHS - 2
XX=Plating Code
See Below
11
10
μ”
Au
10
μ”
Au
For
Electrical, Mechanical
& Enviromental Data,
See page 264
SPECIFY PLATING CODE XX=
13
30
μ”
Au
91
10
μ”
Au
93
99
41
43
44
FIG. 4
Sleeve
(Pin)
Contact
(Clip)
10
μ”
Au
200
μ”
Sn/Pb 200
μ”
Sn/Pb 200
μ”
Sn/Pb
200
μ”
Sn 200
μ”
Sn 200
μ”
Sn
30
μ”
Au
100
μ”
Sn/Pb
10
μ”
Au
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
O
41 & 91 Platings Non-Standard
30
μ”
Au 100
μ”
Sn
PAGE 65 | INTERCONNECTS
NXP MCU
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