Ceramic SMD Crystal Unit
SMD 1.6 x 1.2mm Type
F
EATURE
•
•
•
•
•
Surface Mount Low Profile
Seam Sealed Ceramic
Excellent Heat Resistance
High precision and high frequency stability
MX1 series
Applications: Wired Network, Mobile Communication, WiMAX, WLAN,
Test Equipment
P
ART
N
UMBERING
S
YSTEM
MX1
(1)
No
(1)
(2)
(3)
(4)
(5)
(6)
8
(2)
H
(3)
J
(4)
Item
C
(5)
32M0
(6)
Code
MX1
F
H
J
C
32M0
Description
Crystal Unit
8: 8pF
H: ±30ppm
J: ±50ppm
C: -20~+70ºC
32M0: 32.000MHz
Series Reference
Ceramic SMD Crystal 1.6x1.2mm 4 Pads
8: 8pF, 9: 9pF, A: 10pF, B: 12pF (see options)
F: ±20ppm, G: ±25ppm (see options)
G: ±25ppm, H: ±30ppm (see options)
C: -20~+70ºC, I: -40~+85ºC (see options)
24M0 ~ 54M0 (M denotes decimal point)
Meritek Series
Load Capacitance
Frequency Tolerance
Stability vs Oper Temp.
Operating Temp.
Frequency
D
IMENSIONS AND
R
ECOMMENDED
P
ATTERN
(Unit:mm)
A
VAILABLE
O
PTIONS
Parameters
Load Capacitance
Frequency Tolerance
Stability vs Oper Temp.
Operating Temperature
8: 8pF, 9: 9pF, A: 10pF, B: 12pF
A: ±10ppm, C: ±15ppm, F: ±20ppm, G: ±25ppm, H: ±30ppm, J: ±50ppm
A: ±10ppm, C: ±15ppm, F: ±20ppm, G: ±25ppm, H: ±30ppm, J: ±50ppm, K: ±100ppm
B: 0~+70C, A: -10~+60C, C: -20~+70C, K: -30~+85C, I: -40~+85C, R: -40~+105C
Part Number Options
Note: Custom options available. Contact Meritek for more information.
Meritek Electronics Corporation
|
www.meritekusa.com
Rev.7a 12/21/2017
Ceramic SMD Crystal Unit
SMD 1.6 x 1.2mm Type
E
LECTRICAL
C
HARACTERISTICS
Parameters
Frequency Range
Operation Mode
Load Capacitance
Frequency Tolerance (at
25ºC)
Freq Stability over Oper Temp.
Operating Temperature
Storage Temperature
Drive Level
Aging
Shunt Capactiance
Insulation Resistance
Equivalent Series
Resistance
24.0 ~ 30.000 Fundamental
30.01 ~ 54.000 Fundamental
MX1 series
Characteristic
24.000 ~ 54.000 MHz
Fundamental
18 pF (see options)
±30 ppm (see options)
±50 ppm (see options)
-40 ~ +85°C (see options)
-40 ~ +85°C
100µW max. (10 typ.)
±5 ppm / year
5.0 pF max.
500 MΩ min. (@100Vdc ±15V)
100
Ω
max.
80
Ω
max.
R
ECOMMENDED
S
OLDERING
P
ROFILES
Reflow Condition
Temp. Min T
s(min)
Pre
Heat
Temp. Max T
s(max)
Time (min. to max.) (t
s
)
Average ramp up rate (T
L
) to peak
T
s(max)
to T
L
(Ramp-up rate)
Reflow
Temp. (T
L
)
Time (min. to max.) (t
L
)
150°C
180°C
60~120 seconds
1°C/second max.
3°C/second max.
230°C
30~40 seconds
260°C
10 seconds max.
6°C/second
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
*Specifications subject to change without notice.
Meritek Electronics Corporation
|
www.meritekusa.com
Rev.7a 12/21/2017
Microchip MCU
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