电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1-794638-6

产品描述conn header 16pos dual gold smd
产品类别连接器   
文件大小236KB,共1页
制造商All Sensors
下载文档 详细参数 全文预览

1-794638-6在线购买

供应商 器件名称 价格 最低购买 库存  
1-794638-6 - - 点击查看 点击购买

1-794638-6概述

conn header 16pos dual gold smd

1-794638-6规格参数

参数名称属性值
Datasheets
794638 Drawing
Product Photos
1-794636-6, 1-794638-6, 4-794638-6, 4-794636-6
Catalog Drawings
Vertical SMT Header Dual Row
3D Model
1-794638-6.pdf
Standard Package4,900
CategoryConnectors, Interconnects
FamilyRectangular Connectors - Headers, Male Pins
系列
Packaging
Tape & Reel (TR)
Contact TypeMale Pi
Connector TypeHeader, Shrouded
位置数量
Number of Positions
16
Number of Positions LoadedAll
节距
Pitch
0.118" (3.00mm)
排数
Number of Rows
2
Row Spacing0.118" (3.00mm)
Mounting TypeSurface Mou
TerminatiSolde
Fastening TypeLocking Ram
Contact FinishGold
Contact Finish Thickness30µin (0.76µm)
ColBlack
Mating ProductsA30300-ND - CONN RCPT 3MM 16POS DL MATE-N-L
Other NamesA30445TR

文档预览

下载PDF文档
8
THIS DRAWING IS UNPUBLISHED.
RELEASED FOR PUBLICATION
BY -
ALL RIGHTS RESERVED.
7
20
6
5
4
3
2
REVISIONS
P
LTR
DESCRIPTION
1
DATE
DWN
APVD
C
COPYRIGHT
20
K2
REVISED PER ECR-17-017609
04DEC2017
JB
DZ
DIM W
-B-
3.00
TYP
1
MATERIAL;
CONTACTS - BRASS.
HOUSING - UL 94V-0 RATED HIGH TEMP NYLON, COLOR; BLACK.
HOLDDOWNS - PHOSPHOR BRONZE.
PLATING;
CONTACTS - 0.76µm
MATING
NICKEL
HOLDOWNS - 2.54µm
MINIMUM GOLD OVER 2.54µm MINIMUM NICKEL ON
AREA. 2.54µm TIN-LEAD MINIMUM OVER 2.54µm
MINIMUM ON SOLDER TAILS.
TIN LEAD.
2
D
11.28
10.60
4
5
6
7
SCALE
5:1
8
RECOMMENDED PC BOARD THICKNESS OF 1.57.
KAPTON VACUUM PICK UP BUTTON.
DIMENSION APPLIES TO SOLDERTAIL SURFACES
AND STANDOFF SURFACES.
ALL SOLDERTAILS AND HOLDDOWNS.
PLATING;
CONTACTS - 0.76µm
MATING
NICKEL
HOLDOWNS - 2.54µm
MINIMUM GOLD OVER 2.54µm MINIMUM NICKEL ON
AREA. 2.54µm MATTE TIN MINIMUM OVER 2.54µm
MINIMUM ON SOLDER TAILS.
MATTE TIN.
D
5
6.00
REF
DIM Z
CIRCUIT NO. 1
9
9
CIRCUIT NUMBER 1 IS LOCATED AT THE BOTTOM RIGHT
WITH THE LATCH-LOCK ON TOP LOOKING INTO THE CAVITIES
DIM X
# 0.39
6.86
-C-
LATCH-LOCK
C
9.24
HOUSING
C
CONTACT
DIM V
# 0.35
6
0
+0.05
-0.15
7
HOLDDOWN
8
8
43.04
40.04
37.04
34.04
31.04
28.04
25.04
22.04
19.04
16.04
13.04
10.04
43.04
40.04
37.04
34.04
31.04
28.04
25.04
22.04
19.04
16.04
13.04
10.04
DIM V
DWN
36.86
33.86
30.86
27.86
24.86
21.86
18.86
15.86
12.86
9.86
6.86
3.86
36.86
33.86
30.86
27.86
24.86
21.86
18.86
15.86
12.86
9.86
6.86
3.86
DIM W
40.27
37.27
34.27
31.27
28.27
25.27
22.27
19.27
16.27
13.27
10.27
7.27
40.27
37.27
34.27
31.27
28.27
25.27
22.27
19.27
16.27
13.27
10.27
7.27
DIM Y
33.00
31.00
27.00
24.00
21.00
18.00
15.00
12.00
9.00
6.00
3.00
-
33.00
30.00
27.00
24.00
21.00
18.00
15.00
12.00
9.00
6.00
3.00
-
DIM Z
40.00
37.00
34.00
31.00
28.00
25.00
22.00
19.00
16.00
13.00
10.00
7.00
40.00
37.00
34.00
31.00
28.00
25.00
22.00
19.00
16.00
13.00
10.00
7.00
DIM X
24
22
20
18
16
14
12
10
8
6
4
2
24
22
20
18
16
14
12
10
8
6
4
2
NO. OF
POSN.
5- 794638 -4
5- 794638 -2
5- 794638 -0
4- 794638 -8
4- 794638 -6
4- 794638 -4
4- 794638 -2
4- 794638 -0
3- 794638 -8
3- 794638 -6
3- 794638 -4
3- 794638 -2
2- 794638 -4
2- 794638 -2
2- 794638 -0
1- 794638 -8
1- 794638 -6
1- 794638 -4
1- 794638 -2
1- 794638 -0
794638 -8
794638 -6
794638 -4
794638 -2
PART NUMBER
TE Connectivity
DIM Z
1.27
0.08
TYP
8
8
8
8
( 0.635 )
B
( 1.715 )
EDGE OF BOARD
3
8
8
8
2.54
8
8
SUPERSEDED BY 5-794638-4
SUPERSEDED BY 5-794638-2
8
2
2
2
2
2
2
2
2
2
2
2
2
FINISH
B
( 1.27 )
4.7
SUPERSEDED BY 5-794638-0
SUPERSEDED BY 4-794638-8
SUPERSEDED BY 4-794638-6
9.4
SUPERSEDED BY 4-794638-4
SUPERSEDED BY 4-794638-2
( 0.825 )
1.65
TYP
0.08
SUPERSEDED BY 4-794638-0
SUPERSEDED BY 3-794638-8
SUPERSEDED BY 3-794638-6
SUPERSEDED BY 3-794638-4
2.5
MIN
SUPERSEDED BY 3-794638-2
A
3.0
MIN
DIM Y
RECOMMENDED PCB LAYOUT
(COMPONENT SIDE)
4805 (3/13)
MATERIAL
A
THIS DRAWING IS A CONTROLLED DOCUMENT.
3.43
TYP
0.08
DIMENSIONS:
mm
TOLERANCES UNLESS
OTHERWISE SPECIFIED:
EDGE OF BOARD
4
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
FINISH
-
-
0.13
-
-
19-MAR-2003
K. WHITAKER
CHK
19-MAR-2003
C. JONES
APVD
19-MAR-2003
C. JONES
PRODUCT SPEC
APPLICATION SPEC
NAME
-
-
-
WEIGHT
1
-
SEE TABLE
CUSTOMER DRAWING
A1
00779
SIZE
SURFACE MOUNT,VERTICAL,SURFACE MOUNT
HOLDDOWN,ASSEMBLY,30 GOLD HEADER,
DUAL ROW, MICRO MATE-N-LOK(TM)
CAGE CODE
DRAWING NO
RESTRICTED TO
794638
SCALE
8:1
SHEET
1
OF
1
REV
-
K2
答题赢京东卡|PI InnoSwitch产品系列学习中心
InnoSwitch系列IC将初级、次级和反馈电路同时集成到一个表面贴装离线式反激开关IC中。所有InnoSwitch IC都集成了初级MOSFET、初级侧控制器、用于同步整流的次级侧控制器以及可省去光耦器的创新 ......
EEWORLD社区 电源技术
LPC1500体验+ADC定时转换
设计背景: 1、选用LPC1518,编译环境keil5,jlink 2、功能应用:ADC0_9监控某电源变化 A、开发调试经验分享 例程永远只是参考,具体应用仍需仔细看手册。不少朋友一定参考过例程,在此 ......
xiaotianwang78 NXP MCU
sersontile之Bluemicrosystem2、DataLog固件库代码分析
1、Bluemicrosystem2 从main函数看起: 首先初始化HAL_Init(); 然后配置时钟SystemClock_Config(); #ifdef STM32_NUCLEO InitTargetPlatform(TARGET_NUCLEO); #elif STM32_SENSORTILE ......
1059682127 MEMS传感器
讨论: 5G NSA vs SA ?(回帖赠20-100芯币)
政府明确要求 5G 不再支持NSA模式(非独立组网)手机入网,所有5G终端产品必须具备SA模式(独立组网)。 通俗的说NSA非独立组网是基于在现有的4G基础设备上,再部署5G网络,通过4G实现5G;SA独 ......
EEWORLD社区 无线连接
DSP之外部设备连接接口之HPI
通过主机借口HPI,外部主机可以直接访问DSP内部的双访问RAM(DARAM). HPI可以让外部的主处理器直接访问DSP内存映射中的部分内存,而无需DSP干预。通过主机接口还可以完成DSP的程序引 ......
Aguilera DSP 与 ARM 处理器
GaN 如何改变了市场(上)
本章将探讨如何将氮化镓 (GaN) 用于现有的和新的军事、航天和商业应用中。随着技术进步,GaN 越来越受工程师的青睐。在本章,我们将深入了解 GaN 有望处于领先地位的一些新应用和行业。 ......
石榴姐 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 75  2706  2827  2382  558  7  46  13  17  44 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved