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V58C2512164SHI5

产品描述DDR DRAM,
产品类别存储    存储   
文件大小1MB,共61页
制造商ProMOS Technologies Inc
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V58C2512164SHI5概述

DDR DRAM,

V58C2512164SHI5规格参数

参数名称属性值
Objectid8309607263
包装说明TSOP2,
Reach Compliance Codecompliant
ECCN代码EAR99
访问模式FOUR BANK PAGE BURST
其他特性AUTO/SELF REFRESH
JESD-30 代码R-PDSO-G66
长度22.22 mm
内存密度536870912 bit
内存集成电路类型DDR DRAM
内存宽度16
功能数量1
端口数量1
端子数量66
字数33554432 words
字数代码32000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织32MX16
封装主体材料PLASTIC/EPOXY
封装代码TSOP2
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
座面最大高度1.2 mm
自我刷新YES
最大供电电压 (Vsup)2.7 V
最小供电电压 (Vsup)2.3 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
宽度10.16 mm

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V58C2512(804/164)SH
HIGH PERFORMANCE 512 Mbit DDR SDRAM
4 BANKS X 16Mbit X 8 (804)
4 BANKS X 8Mbit X 16 (164)
4
DDR500
Clock Cycle Time (t
CK2
)
Clock Cycle Time (t
CK2.5
)
Clock Cycle Time (t
CK3
)
System Frequency (f
CK max
)
7.5ns
6ns
4ns
250 MHz
5
DDR400
7.5ns
6ns
5ns
200 MHz
6
DDR333
7.5ns
6ns
6ns
166 MHz
Features
-
-
-
-
-
-
Description
The V58C2512(804/164)SH is a four bank DDR DRAM
organized as 4 banks x 16Mbit x 8 (804), 4 banks x 8Mbit x
16 (164). The V58C2512(804/164)SH achieves high
speed data transfer rates by employing a chip architec-
ture that prefetches multiple bits and then synchronizes
the output data to a system clock.
All of the control, address, circuits are synchronized
with the positive edge of an externally supplied clock. I/O
transactions are occurring on both edges of DQS.
Operating the four memory banks in an interleaved
fashion allows random access operation to occur at a
higher rate than is possible with standard DRAMs. A se-
quential and gapless data rate is possible depending on
burst length, CAS latency and speed grade of the device.
-
-
-
-
-
-
-
-
-
-
-
-
-
High speed data transfer rates with system frequency
up to 250MHz
Data Mask for Write Control
Four Banks controlled by BA0 & BA1
Programmable CAS Latency: 2, 2.5, 3
Programmable Wrap Sequence: Sequential
or Interleave
Programmable Burst Length:
2, 4, 8 for Sequential Type
2, 4, 8 for Interleave Type
Automatic and Controlled Precharge Command
Power Down Mode
Auto Refresh and Self Refresh
Refresh Interval: 8192 cycles/64 ms
Available in 60 Ball FBGA and 66 Pin TSOP II
SSTL-2 Compatible I/Os
Double Data Rate (DDR)
Bidirectional Data Strobe (DQS) for input and output
data, active on both edges
On-Chip DLL aligns DQ and DQs transitions with CK
transitions
Differential clock inputs CK and CK
Power Supply 2.5V ± 0.2V(-5,-6), 2.5V ± 0.1V(-4)
tRAS lockout supported
Concurrent auto precharge option is supported
Device Usage Chart
Operating
Temperature
Range
0°C to 70°C
-40°C to 85°C
Package Outline
JEDEC 66 TSOP II
60 FBGA
CK Cycle Time (ns)
-4
Power
-6
-5
Std.
Temperature
Mark
Blank
I
V58C2512(804/164)SH Rev.1.0 April 2017
1

 
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