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M32192D4D56R0JM

产品描述NTC Thermistor, 56ohm, Surface Mount, CHIP, 0805
产品类别无源元件    电阻器   
文件大小27KB,共1页
制造商QTI Sensing Solutions
官网地址https://www.qtisensing.com
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M32192D4D56R0JM概述

NTC Thermistor, 56ohm, Surface Mount, CHIP, 0805

M32192D4D56R0JM规格参数

参数名称属性值
Objectid1715307842
包装说明CHIP, 0805
Reach Compliance Codecompliant
JESD-609代码e4
制造商序列号M32192
安装特点SURFACE MOUNT
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
额定功率耗散 (P)0.125 W
额定温度25 °C
参考标准MIL-PRF-32192
电阻56 Ω
电阻器类型NTC THERMISTOR
表面贴装YES
端子面层SILVER PLATINUM
端子位置DUAL ENDED
端子形状WRAPAROUND
热敏电阻器应用TEMPERATURE SENSING
容差5%

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Percent of Maximum Power
NTC THERMISTORS
NTC Military Grade Thermistors
Military Grade Chip Thermistors
Screened, high-rel surface mount NTC thermistors
are provided in the EIA 0805 package. Resistance
values are specified at 25ºC with resistances at other
temperatures calculated using the appropriate resist-
ance vs. temperature tables.
Military Grade
Engineering Information
Thermal Time Constant*:
8 seconds maximum.
Dissipation Constant*:
Power Rating:
2mW/°C min.
The thermistor shall be capable of
dissipating a maximum power of
.125 watt at 25°C. Thermistors
shall be derated in accordance
with Table 1.
Zero power resistance values at
25°C (See Table 2).
T
he data provided on this page outlines the DSCC
(Defense Supply Center, Columbus) drawing MIL-PRF-
32192. The complete specifications can be obtained by
contacting DSCC (Defense Supply Center, Columbus). Please
contact Quality Thermistor Inc., for devices provided to the
MIL-PRF-32192 (1206 package) specification.
Resistance At 25°C:
*Thermal Time and Dissipation Constant may vary depending on mounting.
Dimensions MIL-PRF-32192/4 NTC STYLE
L = .078" +/– .008"
W = .049" +/– .008"
T = .055" Max
BW = .020" +/– .005"
Ordering Information
M 3 21 9 2 A 4 B 10 0 2 J M
Level Designator
Tolerance Code
# of Zeros
1st 3 Resistance Digits
Termination Finish
MIL-PRF-32192 Slash
Sheet Designation
Resistance/Temperature
Ratio
DSCC Drawing Number
TABLE 3
Termination Materials
TYPE
MATERIAL
Solderable
Base metalization barrier metal, solder coated
Epoxy Bondable Gold
Epoxy Bondable Platinum Gold
Epoxy Bondable Platinum Gold
Epoxy Bondable Palladium Silver or Platinum Silver
Epoxy Bondable Palladium Silver or Platinum Silver
Wire Bondable Silver
Wire Bondable Gold
TABLE 1
Derating Curve for High Ambient Temperatures
100
80
60
40
20
0
-.55
-.20
0
20
40
80
120
Ambient Temperature (°C)
25°C
CODE
B
G
U
T
C
D
S
W
125°C
140
160
TABLE 2
25°C to 125°C Ratio
RATIO
D
(7.1)
47 Ohm
to
250 Ohm
RATIO
H
(13.0)
470 Ohm
to
1.5K Ohm
RATIO
L
(16.1)
2K Ohm
to
4.7K Ohm
RATIO
A
(19.8)
5K Ohm
to
20K Ohm
RATIO
B
(29.4)
47K Ohm
to
100K Ohm
RATIO
M
(23.3)
100K Ohm
to
200K Ohm
RATIO
N
(38.5)
240K Ohm
to
510K Ohm
RATIO
C
(48.7)
750K Ohm
to
2M Ohm
RATIO
R
(62.5)
4.7M Ohm
to
10M Ohm
16

 
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