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BM14EC-54DP-0.4V(51)

产品描述conn hdr 54pos 0.4mm smd
产品类别连接器   
文件大小701KB,共12页
制造商Hirose
官网地址http://www.hirose-connectors.com/
标准  
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BM14EC-54DP-0.4V(51)概述

conn hdr 54pos 0.4mm smd

BM14EC-54DP-0.4V(51)规格参数

参数名称属性值
Datasheets
BM14/BM14E Series
Standard Package8,000
CategoryConnectors, Interconnects
FamilyRectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine
系列
Packaging
Tape & Reel (TR)
Connector TypeReceptacle, Center Strip Contacts
位置数量
Number of Positions
54
节距
Pitch
0.016" (0.40mm)
排数
Number of Rows
2
Mounting TypeSurface Mou
FeaturesSolder Retenti
Contact FinishGold
Contact Finish Thickness3.9µin (0.10µm)
Mated Stacking Heights1.3mm
Height Above Board0.051" (1.30mm)
Other Names684-8167-2-51

文档预览

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0.4 mm Contact Pitch, Board-to-FPC Connectors
BM14 Series
Mating Cross-Section Diagram (H = 0.8 mm type)
Molded structure
Two-point
contact system
■Features
1. Two stacking height options
Two separate heights available: 0.8 and 1.3 mm
Molded structure
The molded structure provides security and
insulation between the terminals and the board
2. Ultra space-saving design
With its drastically reduced depth of 1.98 mm,
this series can fit in the tightest designs.
Fig. 1
Solid mating feedback
Dimple on contact
Point A
3. Two point contact system
The two point contact structure encloses the
plug contacts and assures a completely secure
connection. (Fig.1)
4. Superior tactile feedback
A clear tactile click is delivered upon the
successful completion of the mating process
(Fig. 2).
5. Drop and shock resistant structure
Dimples were designed into the plug contacts;
they increase retention force and absorb shock
when dropped.
Insertion force
70
60
50
6. User friendly operations
Insertion force (N)
The low-profile connectors with stacking height
of 0.8 mm maintain the mating self-alignment
ra n g e o f 0 . 3 m m , s e c u r i n g e a s y m a t i n g
operations.
40
30
20
10
0
-10
Distance (mm)
Time
Clear tactile
feeling
7. No pattern prohibited area
No restrictions on PCB layout patter n are
imposed, as thin molding technology maintains
the effective mating length of 0.2 mm while
achieving complete insulation between the
bottom side of the receptacle and the board.
Image: 0.8 mm stacking height
Fig. 2
2013.11
1

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