PRODUCT SPECIFICATION
LANGUAGE
ENGLISH
TITLE:
MEMORY STICK CONNECTOR
REVISE ON PC ONLY
TITLE:
A
REV
T2004-0115
MEMORY STICK CONNECTOR
THIS DOCUMENT CONTAINS INFORMATION THAT IS ROPRIETARY TO MOLEX INC.
AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DESCRIPTION
STATUS
WRITTEN BY:
CHECK BY:
APPROVED BY:
DATE:YR/MO/DAY
2004/01/20
DESIGN CETER
MOLEX TAIWAN
HU YAN MING
Sam Shin
Eric Lan
DOCUMENT NO.
FILE NAME
PS-48094-001
PS4809401.pdf
SHEET
1 OF 6
PRODUCT SPECIFICATION
LANGUAGE
ENGLISH
1.
SCOPE
This specification covers performance, tests and quality requirements for the memory
stick connector.
2.
Applicable Documents
The following documents form a part of this specification to the extent specified herein.
In the event of conflict between requirements of this specification and the product
drawing, the product drawing shall take precedence. In the event of conflict between
requirements of this specification and referenced documents, this specification shall
take precedence.
3.
MECHANICAL Requirements
3.1 DESIGN AND CONSTRUCTION
Product shall be of design, construction and physical dimensions specified on
applicable product drawing.
3.2 MATERIAL AND FINISH
See Sales Drawing
3.3 RATING
3.3.1. Voltage: 125V AC.
3.3.2. Current: 0.5 Ampere max.
3.3.3. Operating temperature: -55°C to +85°C.
Relative humidity: 95% max. (non-condensing)
4.
TEST CONDITION
The product is designed to meet the electrical, mechanical and environmental performance
requirements specified. All the tests shall be performed in the room temperature(5°C~35°C), relative
humidity(45~85%), air pressure(85~106Kpa), unless otherwise specified.
REVISE ON PC ONLY
TITLE:
A
REV
T2004-0115
MEMORY STICK CONNECTOR
THIS DOCUMENT CONTAINS INFORMATION THAT IS ROPRIETARY TO MOLEX INC.
AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DESCRIPTION
STATUS
WRITTEN BY:
CHECK BY:
APPROVED BY:
DATE:YR/MO/DAY
2004/01/20
DESIGN CETER
MOLEX TAIWAN
HU YAN MING
Sam Shin
Eric Lan
DOCUMENT NO.
FILE NAME
PS-48094-001
PS4809401.pdf
SHEET
2 OF 6
PRODUCT SPECIFICATION
LANGUAGE
ENGLISH
5.
no
TEST REQUIREMENTS AND PROCEDURES SUMMARY
test description
requirement
procedured
1
Examination of
product
Meets the requirements of product
drawing
Electrical
Visually, dimensionally and functionally
inspected per applicable inspection plan.
LOW LEVEL
2
CONTACT
RESISTANCE
70 mΩ Max initial
80 mΩ Max final
Mate connectors measure by dry circuit.
20 mV Max. 10 mA.
3
Dielectric
Withstanding
Voltage
Insulation
Resistance
Temperature
Rising
Card Insertion
Force
Card Extraction
Force
Contact retention
force
500VAC initial and 250 VAC final at Test between adjacent contacts of
sea level for 1 minute. No discharge, mated/unmated connectors.
flashover or breakdown.
Current leakage: 1mA max
MIL-STD-1344A, Method 3001.1 Test
Condition I
4
1000MΩ min
Base upon 30℃ Max. Rise above
ambient temperature
MECHANICAL
Mate connectors. Apply 500 V DC
between adjacent contact and ground
EIA-364-21
Carry rated current load.
5.
6
7
8
10N max
1.4N min
2N
min
Insert connectors at the speed rate of 25±3
mm/min.
Insert connectors at the speed rate of 25±3
mm/min.
Apply axial pull out force at 25±3 mm/min
on the assembly in the housing.
Mate and Un-mate the connector for a
total of 12000 cycles
(Operation speed: 1 cycles/sec)
The card shall be changed new one in each
5000 times.
9
Durability
12000 cycles
After test, insulation resistance,
dielectric strength, contact
resistance shall be satisfied.
REVISE ON PC ONLY
TITLE:
A
REV
T2004-0115
MEMORY STICK CONNECTOR
THIS DOCUMENT CONTAINS INFORMATION THAT IS ROPRIETARY TO MOLEX INC.
AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DESCRIPTION
STATUS
WRITTEN BY:
CHECK BY:
APPROVED BY:
DATE:YR/MO/DAY
2004/01/20
DESIGN CETER
MOLEX TAIWAN
HU YAN MING
Sam Shin
Eric Lan
DOCUMENT NO.
FILE NAME
PS-48094-001
PS4809401.pdf
SHEET
3 OF 6
PRODUCT SPECIFICATION
LANGUAGE
ENGLISH
10
No electrical discontinuity of 1
Microsecond or longer duration.
Mechanical Shock
△R=10mΩ
maximum
No physical damage allowed
ENVIRONMENTAL
Accelerated Velocity:50G Wave form:
Half-sine, Duration: 11msec. Three
shocks in each direction shall be applied
along the three mutually perpendicular
axes of the test specimen (18 shocks).
MIL-STD-202,method 213,Condition B.
11
12
Heat Resistance
Cool Resistance
△R=10mΩ
maximum
No physical damage allowed
△R=10mΩ
maximum
No physical damage allowed
△R=10mΩ
maximum
No physical damage allowed
Mated connector,85℃±3ºC , 250 Hrs.
EIA 364-17
Mated connector,-55℃±3ºC , 96 Hrs.
EIA 364-17
Mated connector,90~95%R.H.40℃±2ºC ,
96 Hrs.
EIA-364-31B&IEC-60512-11-3.
Amplitude : 1.5mm P-P,
Sweep time :10-55-10 Hz in 1min.
Duration : 1.5 hours in each of 3
mutually perpendicular planes.
MIL-STD-1344A,Method 2005.1,
Condition V Test Condition letter A.
Mated connector, 3PPM H
2
S, 40ºC, 80%
RH, 96 hours.
Temperature:100~150℃ for 60s Min, 210
℃for
30s Max, peak:230℃,
MIL-STD-202,Method 210
Solder temperature: 230±2ºC
Immersion duration: 3 seconds max.
Mated connector
-55±3ºC/30 min, room temp: 10~15 min
85±2ºC/30 min, room temp: 10~15 min
making this a cycle, repeat 5 cycles
13
Humidity
14
Vibration
No electrical discontinuity of 1
Microsecond or longer duration.
△R=10mΩ
maximum
No physical damage allowed
15
Gas (H
2
S)
Resistance to IR
reflow
Solder ability
Contact resistance:80mΩ Max.
16
No physical damage allowed
17
Wet solder coverage: 95% min.
18
Temperature
Cycling
△
R=10mΩ maximum
No physical damage allowed
REVISE ON PC ONLY
TITLE:
A
REV
T2004-0115
MEMORY STICK CONNECTOR
THIS DOCUMENT CONTAINS INFORMATION THAT IS ROPRIETARY TO MOLEX INC.
AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DESCRIPTION
STATUS
WRITTEN BY:
CHECK BY:
APPROVED BY:
DATE:YR/MO/DAY
2004/01/20
DESIGN CETER
MOLEX TAIWAN
HU YAN MING
Sam Shin
Eric Lan
DOCUMENT NO.
FILE NAME
PS-48094-001
PS4809401.pdf
SHEET
4 OF 6
PRODUCT SPECIFICATION
LANGUAGE
ENGLISH
19
Salt Spray
By visual inspection, without
noticeable rust
48±4 Hrs exposure to a salt spray from the
5±1％ solution at 35±2ºC
6. Product Qualification and Requalification test sequence
Test Group
Test of Examination
1
2
3
4
5
6
7
8
9
Examination of product
1
2
3
4
6 7
8
5
Test Sequence
2.5
9
10
11
12
1,9 1,9 1,9 1,5 1,5 1,9 1,3 1,6 1,3 1,9 1,4 1,5
2,6 2,6 2,6 2,4 2,4 2,6
4,8 4,8 4,8
3,7 3,7 3,7
4,8
3,7
2,6
4,8
3,7
3
2
3
6
5
4
5
5
5
3
3
2
2
5
3
2,4
Low Level Contact Resistance
Dielectric Withstanding Voltage
Insulation Resistance
Temperature Rising
Card Insertion Force (max.)
Card Extraction Force (min)
Contact retention Force(min)
Durability
10 Mechanical Shock
11 Heat Resistance
12 Cool Resistance
13 Humidity
14 Vibration
15 Gas (H
2
S)
16 Resistance to IR reflow
17 Solderability
18 Temperature Cycling
19 Salt Spray
Figure 2
REVISE ON PC ONLY
TITLE:
A
REV
T2004-0115
MEMORY STICK CONNECTOR
THIS DOCUMENT CONTAINS INFORMATION THAT IS ROPRIETARY TO MOLEX INC.
AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DESCRIPTION
STATUS
WRITTEN BY:
CHECK BY:
APPROVED BY:
DATE:YR/MO/DAY
2004/01/20
DESIGN CETER
MOLEX TAIWAN
HU YAN MING
Sam Shin
Eric Lan
DOCUMENT NO.
FILE NAME
PS-48094-001
PS4809401.pdf
SHEET
5 OF 6
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