电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

5962-8868105LA

产品描述Standard SRAM, 64KX4, 25ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
产品类别存储    存储   
文件大小161KB,共12页
制造商Micross
官网地址https://www.micross.com
下载文档 详细参数 全文预览

5962-8868105LA概述

Standard SRAM, 64KX4, 25ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24

5962-8868105LA规格参数

参数名称属性值
厂商名称Micross
零件包装代码DIP
包装说明DIP, DIP24,.3
针数24
Reach Compliance Codecompliant
ECCN代码3A001.A.2.C
最长访问时间25 ns
其他特性TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
I/O 类型COMMON
JESD-30 代码R-CDIP-T24
JESD-609代码e0
内存密度262144 bit
内存集成电路类型STANDARD SRAM
内存宽度4
功能数量1
端子数量24
字数65536 words
字数代码64000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织64KX4
输出特性3-STATE
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DIP
封装等效代码DIP24,.3
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
电源5 V
认证状态Qualified
筛选级别MIL-STD-883
座面最大高度5.08 mm
最大待机电流0.02 A
最小待机电流4.5 V
最大压摆率0.14 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度7.62 mm
Base Number Matches1

文档预览

下载PDF文档
SRAM
MT5C2564
64K x 4 SRAM
SRAM MEMORY ARRAY
AVAILABLE AS MILITARY
SPECIFICATIONS
• SMD 5962-88681
• SMD 5962-88545
• MIL-STD-883
PIN ASSIGNMENT
(Top View)
FEATURES
High Speed: 15, 20, 25, 35, 45, 55, and 70
Battery Backup: 2V data retention
Low power standby
High-performance, low-power, CMOS double-metal
process
• Single +5V (+10%) Power Supply
• Easy memory expansion with CE\
• All inputs and outputs are TTL compatible
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
CE\
Vss
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
Vcc
A15
A14
A13
A12
A11
A10
DQ4
DQ3
DQ2
DQ1
WE\
A1
A0
NC
Vcc
NC
3 2 1 28 27
A2 4
A3 5
A4 6
A5 7
A6 8
A7 9
A8 10
A9 11
CE\ 12
26
25
24
23
22
21
20
19
18
A15
A14
A13
A12
A11
A10
DQ4
DQ3
DQ2
24-Pin DIP (C)
(300 MIL)
28-Pin LCC (EC)
13 14 15 16 17
DQ1
WE\
NC
Vss
NC
28-Pin Flat Pack (F)
OPTIONS
• Timing
15ns access
20ns access
25ns access
35ns access
45ns access
55ns access
70ns access
• Package(s)
Ceramic DIP (300 mil)
Ceramic LCC
Ceramic Flatpack
MARKING
-15
-20
-25
-35
-45
-55*
-70*
NC
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
CE\
NC
Vss
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Vcc
A15
A14
A13
A12
A11
A10
NC
NC
DQ3
DQ2
DQ1
DQ0
WE\
C
EC
F
No. 106
No. 204
GENERAL DESCRIPTION
• Operating Temperature Ranges
IT
Industrial (-40
o
C to +85
o
C)
o
o
Military (-55 C to +125 C)
XT
• 2V data retention/low power
L
The Austin Semiconductor SRAM family employs
high-speed, low-power CMOS and are fabricated using double-
layer metal, double-layer polysilicon technology.
For flexibility in high-speed memory applications,
Austin Semiconductor offers chip enable (CE\) on all
or-
ganizations. This enhancement can place the outputs in
High-Z for additional flexibility in system design. The x4
configuration features common data input and output.
Writing to these devices is accomplished when
write enable (WE\) and CE\ inputs are both LOW. Reading
is
accomplished when WE\ remains HIGH and CE\ goes
LOW. The device offers a reduced power standby mode when
disabled. This allows system designs to achieve low standby
power requirements.
These devices operate from a single +5V power
supply and all inputs and outputs are fully TTL compatible.
Micross Components reserves the right to change products or specifications without notice.
*Electrical characteristics identical to those provided for the 45ns
access devices.
For more products and information
please visit our web site at
www.micross.com
MT5C2564
Rev. 3.2 01/10
1

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2503  1012  1938  1552  1298  55  22  47  37  18 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved