电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HIF3F-26PA-2.54DS(71)

产品描述conn hdr 26pos 2.54mm
产品类别连接器    连接器   
文件大小143KB,共3页
制造商Hirose
官网地址http://www.hirose-connectors.com/
标准
下载文档 详细参数 全文预览

HIF3F-26PA-2.54DS(71)概述

conn hdr 26pos 2.54mm

HIF3F-26PA-2.54DS(71)规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证符合
厂商名称Hirose
包装说明ROHS COMPLIANT
Reach Compliance Codeunknown
ECCN代码EAR99
主体宽度0.354 inch
主体深度0.547 inch
主体长度1.606 inch
连接器类型BOARD CONNECTOR
联系完成配合NOT SPECIFIED
联系完成终止Gold (Au)
触点性别MALE
触点材料NOT SPECIFIED
触点模式RECTANGULAR
触点电阻15 mΩ
触点样式SQ PIN-SKT
DIN 符合性NO
介电耐压650VAC V
耐用性500 Cycles
滤波功能NO
IEC 符合性NO
绝缘电阻1000000000 Ω
绝缘体颜色BLACK
绝缘体材料POLYBUTYLENE TEREPHTHALATE
JESD-609代码e4
MIL 符合性NO
插接触点节距0.1 inch
匹配触点行间距0.1 inch
混合触点NO
安装选项1LOCKING
安装方式RIGHT ANGLE
安装类型BOARD
连接器数ONE
PCB行数2
装载的行数2
最高工作温度85 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
PCB触点行间距2.54 mm
极化密钥POLARIZED HOUSING
额定电流(信号)1 A
参考标准UL
可靠性COMMERCIAL
端子长度0.118 inch
端子节距2.54 mm
端接类型SOLDER
触点总数26
UL 易燃性代码94V-0
Base Number Matches1

文档预览

下载PDF文档
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
Box type Pin Header to Prevent Mis-insertion
HIF3F Series
■Features
1. Prevent to Reverse Insertion
The pin header to prevent reverse insertion is equipped
with contact protective walls to the HIF3E series.
2. Compatibility
This pin header is compatible with HIF3B series.
■Applications
Computers, terminal equipment, PPC, various kinds of
electronic equipment, office automation machines, etc.
■Product
Specifications
Rating
Current rating: 1A
Voltage rating: 200V AC
Specification
Operating Temperature Range:–55 to
+85ç
(Note 1)
Operating Moisture Range:40 to 80%
Storage Temperature Range:–10 to
+60ç(Note
2)
Storage Humidity Range:40 to 70% (Note 2)
Condition
Item
1. Insulation Resistance 1000M
ohms
min.
2. Withstanding voltage
No flashover or insulation breakdown.
3. Contact Resistance 15m
ohms
max.
4. Vibration
No electrical discontinuity of 1μs or more
5.
Humidity (Steady state)
Insulation resistance: 1000M
ohms
min.
6. Temperature Cycle
No damage, cracks, or parts looseness.
7. Durability (Mating/un-mating) Contact resistance15m
ohms
max.
8. Resistance to
Soldering heat
500V DC
650V AC/1 minute
0.1A
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions.
96 hours at temperature of 40ç and humidity of 90% to 95%
(–55ç: 30 minutes
15 to 35ç: 5 minutes max.
125ç: 30 minutes
15 to 35ç: 5 minutes max.) 5 cycles
500 cycles
No deformation of components affecting performance.
Solder bath: 260ç for 10 seconds
Manual soldering: 360ç for 5 seconds
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range
and Humidity range covers non conducting condition of installed connectors in storage, shipment or during transportation.
Note 3: Information contained in this catalog represents general requirements for this Series.Contact us for the drawings and
specifications for a specific part number shown.
■Material
Part
Insulator
Contact
Material
PBT
Brass
Finish
Black
Selective gold plating over nickel underplated
Remarks
UL94V-0
---------------
■Ordering
Information
HIF3F
1
1
Series Name: HIF3F
-
*
P A - 2.54 DS
2
3
4
5
6
5
Contact Pitch: 2.54mm
6
Terminal type DS: Right angle type
DSA: Straight type
2
Number of contacts: 10, 16, 20, 26, 30, 34, 40, 50, 60
3
P: Pin header
4
A: Selective gold plating
B44
AD 模拟接口
各位,设计AD采集电路的时候,模拟信号的硬件输入接口一般选择什么类型,比如SMA这种接口 ...
萤火 ADI 工业技术
招聘MCU+RF 软硬件工程师
初创公司,可能比较辛苦、需要比较持久才可能看到好的结果,所以没有耐心的兄弟可略过。 我自己本人经历过10余年的IC应用工作经验(软硬件、Sales、PM、Marketing等),于去年底终于决定暂别 ......
smile3 求职招聘
Atmega16返回long型数据时高位出错
ulong avg_1(ulong p,ulong data) { uchar h; ulong sum=0; for(h=9;h>0;h--) { p=p; sum+=p; ......
xd63011 Microchip MCU
询问TI-M3地址对应的数据的位数问题
TI的M3在4G的寻址空间是不是在某一地址位置FLASH和SRAM的容量是1byte(手册上说的多少kB是指kbytes?),而寄存器是32位(4byte)的?...
flyicdsp 微控制器 MCU
atf 16v8 CPLD芯片 编程
我们有一款产品需要为 atf 16v8 写程序。 什么人用过这个芯片? 请求指教。...
jovew FPGA/CPLD
关于DSP中头文件的问题
编译时一直出现line 25: fatal error: could not open source file "DSP281x_Device.h"怎么回事啊,我明显已经有DSP281x_Device.h文件啊,急求高手给提供一条解决方法!...
念兴 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 172  2577  248  1771  1652  12  52  51  53  14 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved