FEATURES AND SPECIFICATIONS
s
s
s
s
s
Features and Benefits
For parallel board packaging
Available in press-fit or solder tail
Up to 32mm board-to-board stack heights
Mezzanine card to facilitate blind mate
Surface Mount Compatible
Electrical
Current: 1.0A
Contact Resistance:
Row
m
Ω
max.
A
13
B
18
C
20
D
25
E
30
F
32
2.00mm (.079") Pitch
HDM*
Board-to-Board
Stacking Header
73783
High Rise Vertical
Solder Tail Guide Pin Option
Reference Information
Product Specification: PS-73670-9999
Packaging: Tube
UL File No.: E29179
Mates With:
73632/73780
Designed In: Millimeters
Dielectric Withstanding Voltage: 1000V
Insulation Resistance: 1000 M
Ω
min.
Mechanical
Mating Force: 0.35N typical per contact
Unmating Force: 0.15N min.
Signal Normal Force: 0.75N nom./0.60N min.
Durability: 250 cycles
Physical
Housing: Liquid crystal polymer
Contact: Phosphor Bronze
Plating: 30
µ
" Gold
Operating Temperature: -55 to +105˚C
Backplane Connector Systems
CATALOG DRAWING (FOR REFERENCE ONLY)
J
ORDERING INFORMATION AND DIMENSIONS
Circuits
Order No.
P = 2.00 (.079)
73783-0100
73783-0101
73783-0102
73783-0200
73783-0201
73783-0202
73783-0300
73783-0301
73783-0302
73783-1100
73783-1101
73783-1102
73783-1200
73783-1201
73783-1202
73783-1300
73783-1301
73783-1302
P = 2.50 (.098)
73783-2100
73783-2101
73783-2102
73783-2200
73783-2201
73783-2202
73783-2300
73783-2301
73783-2302
73783-3100
73783-3101
73783-3102
73783-3200
73783-3201
73783-3202
73783-3300
73783-3301
73783-3302
P = 3.00 (.118)
73783-4100
73783-4101
73783-4102
73783-4200
73783-4201
73783-4202
73783-4300
73783-4301
73783-4302
73783-5100
73783-5101
73783-5102
73783-5200
73783-5201
73783-5202
73783-5300
73783-5301
73783-5302
P = 3.50 (.138)
73783-6100
73783-6101
73783-6102
73783-6200
73783-6201
73783-6202
73783-6300
73783-6301
73783-6302
73783-7100
73783-7101
73783-7102
73783-7200
73783-7201
73783-7202
73783-7300
73783-7301
73783-7302
Guide Post
Location
A
B
N/A
A
B
N/A
A
B
N/A
A
B
N/A
A
B
N/A
A
B
N/A
A
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
Dimension
B
C
22.00 (.866)
15.05 (.593)
22.00 (.866)
15.05 (.593)
22.00 (.866)
15.05 (.593)
22.00 (.866)
6.05 (.238)
22.00 (.866)
6.05 (.238)
22.00 (.866)
6.05 (.238)
22.00 (.866)
10.05 (.396)
22.00 (.866)
10.05 (.396)
22.00 (.866)
10.05 (.396)
46.00 (1.811)
15.05 (.593)
46.00 (1.811)
15.05 (.593)
46.00 (1.811)
15.05 (.593)
46.00 (1.811)
6.05 (.238)
46.00 (1.811)
6.05 (.238)
46.00 (1.811)
6.05 (.238)
46.00 (1.811)
10.05 (.396)
46.00 (1.811)
10.05 (.396)
46.00 (1.811)
10.05 (.396)
M
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
5.00 (.197)
72
144
* High Density Metric and HDM
PLUS
are trademarks of Teradyne, Inc.
Note: Additional key combinations and locations are available, please contact Molex
Note: The guide pin must mate with the top position on the mating receptacle to clear the board edge.
Therefore, if guidepin headers are used on each end of a header array, you should select one with the
pin in location B and the second with the guidepin in location A.
J-50
MX01
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