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BZX84C4V3ET1

产品描述4.3V, 0.225W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236AB, PLASTIC PACKAGE-3
产品类别分立半导体    二极管   
文件大小75KB,共6页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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BZX84C4V3ET1概述

4.3V, 0.225W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236AB, PLASTIC PACKAGE-3

BZX84C4V3ET1规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称ON Semiconductor(安森美)
零件包装代码SOT-23
包装说明R-PDSO-G3
针数3
Reach Compliance Codenot_compliant
ECCN代码EAR99
其他特性UL RECOGNIZED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
最大动态阻抗90 Ω
JEDEC-95代码TO-236AB
JESD-30 代码R-PDSO-G3
JESD-609代码e0
湿度敏感等级1
元件数量1
端子数量3
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)240
极性UNIDIRECTIONAL
最大功率耗散0.225 W
认证状态Not Qualified
标称参考电压4.3 V
表面贴装YES
技术ZENER
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间30
最大电压容差6.98%
工作测试电流5 mA
Base Number Matches1

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BZX84C2V4ET1 Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Specification Features
http://onsemi.com
225 mW Rating on FR−4 or FR−5 Board
Zener Breakdown Voltage Range − 2.4 V to 75 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (>16 kV) per Human Body Model
Peak Power − 225 W (8
X
20
ms)
Pb−Free Package is Available
3
Cathode
1
Anode
3
1
2
SOT−23
CASE 318
STYLE 8
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
MARKING DIAGRAM
260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20
ms
(Note 1)
@ T
L
25°C
Total Power Dissipation on FR−5 Board,
(Note 2) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance,
Junction−to−Ambient
Total Power Dissipation on Alumina
Substrate, (Note 3) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage
Temperature Range
Symbol
P
pk
P
D
225
1.8
R
qJA
P
D
300
2.4
R
qJA
T
J
, T
stg
417
−65 to
+150
mW
mW/°C
°C/W
°C
556
mW
mW/°C
°C/W
BZX84CxxxET3
Max
225
Unit
Watts
xxxM
xxx = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
BZX84CxxxET1
BZX84CxxxET1G
Package
SOT−23
SOT−23
(Pb−Free)
SOT−23
Shipping
3000/Tape & Reel
3000/Tape & Reel
10,000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. Nonrepetitive current pulse per Figure 9.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
©
Semiconductor Components Industries, LLC, 2004
1
July, 2004 − Rev. 3
Publication Order Number:
BZX84C2V4ET1/D
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