CDHV 2512
Vishay Techno
Thick Film Chip Dividers, High Voltage
FEATURES
•
•
•
•
•
•
High voltage up to 3000 V
Typical resistance ratios of 250:1, 500:1, etc.
Flow solderable
Tape and reel packaging available
Available with either wraparound terminations
or as a single termination flip chip
Suitable for solderable, epoxy bondable, or wire bondable
applications
Termination: Gold, palladium silver, platinum gold,
platinum silver, platinum palladium gold or solder-coated
nickel barrier available
Multiple styles, termination materials and configurations,
allow wide design flexibility
Non-magnetic terminations available
Lead (Pb)-free version is RoHS compliant
ELECTRICAL SPECIFICATIONS
Resistance Range:
1 MΩ to 1 GΩ
Resistance Tolerance:
± 1 % to ± 20 %
Power Rating:
See table
Voltage Coefficient:
See table
Temperature Coefficient:
See table
Ratio Tracking:
± 50 ppm/°C typical
•
•
•
•
MECHANICAL SPECIFICATIONS
Construction:
96 % alumina substrate with proprietary
cermet resistance element and specified termination
material
ENVIRONMENTAL SPECIFICATIONS
Operating temperature:
- 55 °C to + 150 °C
Life:
Less than 0.5 % change when tested at full rated power
(Reference only: Not for all values specified. Consult factory for your
size and value.)
STANDARD ELECTRICAL SPECIFICATIONS
RESISTANCE (Ω)
(1)
1M to 1G
POWER RATING (mW)
contact factory
VOLTAGE RATING (V max.)
3000
Note
(1)
Resistance values are calibrated at 100 V . Calibration at other voltages available upon request.
DC
VOLTAGE AND TEMPERATURE COEFFICIENTS OF RESISTANCE CHART TYPICAL
RESISTANCE (Ω)
20M
150M
800M
Note
•
Contact factory for other ratios
RATIO (typical)
250:1
300:1
500:1
VCR (ppm/V)
10
10
10
TCR (ppm/°C) - 55 °C to + 150 °C
100
150
200
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: CDHVAF20M0J2500GFB (preferred part number format)
C
GLOBAL
MODEL
D
TERM
STYLE
H
V
A
F
2
0
M
0
J
2
RATIO
R1/R2
5
0
0
G
F
B
TERM MATERIAL
RESISTANCE
TOLERANCE
VALUE (R1)
RATIO
SOLDER
PACKAGING
TOLERANCE TERMINATION
G
= ± 2.0 %
H
= ± 3.0 %
J
= ± 5.0 %
E
= Sn100
B
= Bulk
F
= Sn95/Ag5
T
= Tape and
reel
N
= No solder
S
=
W
= Waffle
Sn62/Pb36/Ag2
T
= Sn90/Pb10
CDHV
=
A
= 3-sided
CDHV2512
B
= top only
A
= Palladium silver
F
= ± 1.0 %
M = Million
B
= Platinum gold
G
= ± 2.0 %
G = Billion
C
= Gold
20M0
= 20 MΩ
H
= ± 3.0 %
D
= Platinum silver
800M
= 800 MΩ
J
= ± 5.0 %
E
= Platinum
1G00
= 1 GΩ
K
= ± 10.0 %
palladium gold
M
= ± 20.0 %
F
= Nickel barrier
3 digit
significant
figure, followed
by a multiplier
2500
= 250:1
3000
= 300:1
5000
= 500:1
Historical Part Numbering: CDHV2512AF2005J2500Ge2 (will continue to be accepted)
CDHV2512
HISTORICAL
MODEL
A
TERM
STYLE
F
TERM
MATERIAL
2005
RESISTANCE
VALUE (R1)
J
TOLERANCE
2500
RATIO
R1/R2
G
RATIO
TOLERANCE
e2
SOLDER
TERMINATION
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 68020
Revision: 23-Feb-09
For technical questions, contact: te1resistors@vishay.com
www.vishay.com
5
CDHV 2512
Vishay Techno
Thick Film Chip Dividers, High Voltage
DIMENSIONS
in inches [millimeters]
B
B
L
A
C
T
B
W
T
B
C
A
W
Style A
A
C
B
Style B
A
E
A
W
Style A Bottom
(3-sided wraparound)
TERMINATION
STYLE A
(wraparound 3 sided)
STYLE B
(top only)
LENGTH (L)
± 0.006 [0.152]
0.250
WIDTH (W)
± 0.006 [0.152]
0.126
THICKNESS (T)
± 0.005 [0.127]
0.025
A ± 0.005
B ± 0.005
C ± 0.005
E ± 0.005
0.025
0.025
0.040
0.046
0.240
0.126
0.025
0.025
0.025
0.040
-
DERATING CURVE
120
% OF RATED POWER
100
80
60
40
20
0
20
50
70
100
150
AMBIENT TEMPERATURE IN °C
(Reference only: Not for all values specified. Consult factory for your specific value.)
www.vishay.com
6
For technical questions, contact: te1resistors@vishay.com
Document Number: 68020
Revision: 23-Feb-09
CDHV 2512
Thick Film Chip Dividers, High Voltage
Vishay Techno
TYPE
TERMINATION
MATERIAL
TERMINATION
STYLE
3-sided (wraparound)
TERMINATION STYLE/
MATERIAL CODE
AF
SOLDER TERMINATION
CODE
Solderable
Nickel barrier
Top only (flip chip)
BF
BE
E, F, S or T
(3)
Wire bondable/
Solderable
Wire bondable/
Epoxy bondable
Platinum palladium gold
Top only (flip chip)
N, F or S
(1)
Gold
Palladium silver
(2)
Top only (flip chip)
BC
BA
N
Epoxy bondable
Platinum gold
Platinum silver
Top only (flip chip)
BB
BD
N
Notes
(1)
Use solder termination N for applications requiring wire bondable mounting, and solder terminations F or S for applications requiring solderable
mounting.
(2)
While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
(3)
Standard solder plating for the nickel barrier parts are solder terminations E or T. Hot solder dipped terminations F or S are also available.
Document Number: 68020
Revision: 23-Feb-09
For technical questions, contact: te1resistors@vishay.com
www.vishay.com
7
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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1
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