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GUB-GM8ALF-03-2741-C-F

产品描述Array/Network Resistor, Isolated, Thin Film, 1.2W, 2740ohm, 0.25% +/-Tol, 25ppm/Cel, Surface Mount, 2244, DIP, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小439KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准  
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GUB-GM8ALF-03-2741-C-F概述

Array/Network Resistor, Isolated, Thin Film, 1.2W, 2740ohm, 0.25% +/-Tol, 25ppm/Cel, Surface Mount, 2244, DIP, ROHS COMPLIANT

GUB-GM8ALF-03-2741-C-F规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1076426118
包装说明SMT, 2244
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN代码EAR99
YTEOL6.5
其他特性ULTRA PRECISION
构造Molded
元件功耗0.16 W
第一元件电阻2740 Ω
JESD-609代码e3
安装特点SURFACE MOUNT
网络类型ISOLATED
元件数量1
功能数量8
端子数量16
最高工作温度125 °C
最低工作温度-55 °C
封装高度2.286 mm
封装长度11.176 mm
封装形状RECTANGULAR PACKAGE
封装形式SMT
封装宽度5.588 mm
额定功率耗散 (P)1.2 W
额定温度70 °C
电阻2740 Ω
电阻器类型ARRAY/NETWORK RESISTOR
尺寸代码2244
表面贴装YES
技术THIN FILM
温度系数25 ppm/°C
温度系数跟踪5 ppm/°C
端子面层Matte Tin (Sn)
端子形状GULL WING
容差0.25%

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Resistors
TaNFilm
®
Small Outline
Surface Mount
Small Outline
TaNFilm
®
Resistor Network
GUB Series
Surface
Mount Resistor Network
Thin-film on ceramic technology
GUB Series
0.33” sizes available
0.22” and
Thin film on ceramic
version available
RoHS compliant
technology
0.220” and 0.300” sizes available
DESC 87012 and 87013 available
RoHS compliant version available
Standard JEDEC packages for
DESC 87012 and 87013 available
automatic placement equipment
Standard JEDEC packages for automatic placement equipment
Compliant leads to
compensate for
thermal expansion
and contractions.
Ultra precision tantalum
nitride resistance element
on high purity alumina.
IRC Advanced Film Division
Rugged, molded
construction.
Ultra precision tantalum
nitride resistance element
on high purity alumina.
Compliant leads to
compensate for
thermal expansion
and contractions.
Rugged, molded
construction.
All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
IRC’s TaNFilm®, Small Outline Integrated Circuit resistor networks are ideally suited for surface mounting.
The 0.05 inch lead spacing provides higher lead density, increased component count, lower installed resistor
cost, and better reliability. They are ideally suited for the latest surface mount assembly techniques, and each
lead can be 100% visually inspected. The compliant leads relieve thermal expansion and contraction stresses
created by soldering and temperature excursions.
The tantalum nitride film system provides precision tolerance, exceptional TCR tracking, and low noise.
TaNFilm® provides stability, high reliability, and long life characteristics. Testing has demonstrated performance
exceeding MIL-PRF-83401 characteristic H.
Electrical Data
Resistance Range (Ω)
GM Type
GL Type
Absolute Tolerance
Ratio Tolerance To R1
TCR (ppm/°C)
TCR Tracking To R1 (ppm°C)
Operating Temperature Range
Noise
Substrate
Custom circuits and special testing available.
Schem A: 10 to 150K
Schem A: 10 to 200K
Schem B: 10 to 75K
Schem B: 10 to 100K
Available to ±0.1%
Available to ±0.05%
±25, ±50, ±100
±5
-55°C to +125°C
Less than -25 dB
High purity alumina substrate
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
General Note
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
TT Electronics reserves the right to make changes in product specification without notice or liability.
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC
TT electronics plc
Welwyn
www.ttelectronics.com/resistors
A subsidiary of
GUB Series Issue November 2008 Sheet 1 of 3
© TT Electronics plc
12.19

 
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