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FT7C261-35DMB

产品描述OTP ROM, 8KX8, 35ns, CMOS, CDIP24
产品类别存储    存储   
文件大小536KB,共20页
制造商Force Technologies Ltd
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FT7C261-35DMB概述

OTP ROM, 8KX8, 35ns, CMOS, CDIP24

FT7C261-35DMB规格参数

参数名称属性值
Objectid105315116
包装说明DIP, DIP24,.3
Reach Compliance Codecompliant
Country Of OriginUK
ECCN代码EAR99
YTEOL3.65
最长访问时间35 ns
I/O 类型COMMON
JESD-30 代码R-XDIP-T24
内存密度65536 bit
内存宽度8
端子数量24
字数8192 words
字数代码8000
最高工作温度125 °C
最低工作温度-55 °C
组织8KX8
输出特性3-STATE
封装主体材料CERAMIC
封装代码DIP
封装等效代码DIP24,.3
封装形状RECTANGULAR
封装形式IN-LINE
电源5 V
认证状态Not Qualified
筛选级别38535Q/M;38534H;883B
最大待机电流0.03 A
最大压摆率0.12 mA
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL

文档预览

下载PDF文档
SCD#QM5323
Source Control Drawing
Upscreening/Manufacturing Specification P/N FT7C261-55WMB-CY
Title Page ................................................................................................
List of Effective Pages ...........................................................................
Change List .............................................................................................
Definitions .................................................................................................
Acronyms and Abbreviations ................................................................
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3.1
3.2
3.3
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4.1
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Contents.
Introduction/Purpose ..............................................................................
Reference Documents ............................................................................
Source of Parts ........................................................................................
Original Part Manufacturer.....................................................................
Screening Company ...............................................................................
UK Supplier ..............................................................................................
Manufacturing ..........................................................................................
Screening ..................................................................................................
Certificate of Conformity.........................................................................
FT Certificate of Conformity...................................................................
Package Description...............................................................................
Marking .....................................................................................................
Traceability...............................................................................................
Component selection ..............................................................................
General .....................................................................................................
Nuclear Hardness....................................................................................
Baseline Component .............................................................................
Obsolescence notice ..............................................................................
Date-17.03.04
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Force Technologies Ltd
2003

 
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