303133, 303134, 303135, 303136, 303137, 303138
Models 303133 through to 303138 (Ultra High Precision Surface Mount Chip
Resistors, VSMP Z-Foil Technology Configuration), Screen/Test Flow in Compliance
with EEE-INST-002, (Tables 2A and 3A, Film/Foil, Level 1) and MIL-PRF-55342
FEATURES
Temperature coefficient of resistance (TCR):
0.2 ppm/°C typical (- 55 °C to + 125 °C, + 25 °C ref.)
Tolerance: to ± 0.01 %
Power coefficient “R due to self heating”:
5 ppm at rated power
Power rating: to 400 mW at + 70 °C
Top View
Load life stability: to ± 0.03 % at 70 °C, 2000 h at rated
power
Resistance range: 10 to 75 k
Bulk Metal Foil resistors are not restricted to standard
values, we can supply specific “as required” values at no
extra cost or delivery (e.g. 1K2345 vs. 1K)
Fast thermal stabilization < 1 s
Electrostatic discharge (ESD) up to 25 000 V
Short time overload:
0.02 %
Non-inductive, non-capacitive design
Rise time: 1 ns effectively no ringing
Current noise: - 42 dB
Non-inductive: < 0.08 µH
Non hot spot design
Terminal finish: tin/lead alloy
Matched sets are available on request
For prototype units, append a “U” to the model number
(example: 303134U). These units have all of the table 2A
(page 3) 100 % tests performed, with no destructive
qualification testing required (table 3A, page 4). For more
information, please contact
foil@vpgsensors.com
INTRODUCTION
The 303133 through to 303138 series is the first surface
mount device to provide high rated power, excellent load life
stability along with extremely low TCR all in one resistor.
One of the most important parameters influencing stability is
the temperature coefficient of resistance (TCR). Although the
TCR of foil resistors is considered extremely low, this
characteristic has been further refined over the years. The
303133 through to 303138 Series utilizes ultra high precision
Bulk Metal
®
Z-Foil. The Z-Foil technology provides a
significant reduction of the resistive element’s sensitivity to
ambient temperature variations (TCR) and to self heating
when power is applied (power coefficient). Along with the
inherently low PCR and TCR, Z-Foil technology also
provides remarkably improved load life stability, low noise
and availability of tight tolerance.
The 303133 through to 303138 series has a full wraparound
termination which ensures safe handling during the
manufacturing process, as well as providing stability during
multiple thermal cyclings.
Our application engineering department is available to
advise and make recommendations.
FIGURE 1 - POWER DERATING CURVE
Percent of Rated Power
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
(- 55 °C to + 125 °C, + 25 °C ref.)
RESISTANCE
VALUE
()
250to 75K
100to < 250
50to < 100
25to < 50
10to < 25
TOLERANCE
(%)
± 0.01
± 0.05
± 0.1
± 0.25
± 0.5
MAXIMUM TCR
(ppm/°C)
±3
±3
±4
±5
±5
- 55 °C
100
75
50
25
0
- 75
+ 70 °C
- 50
- 25
0
+ 25 + 50 + 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
Document Number: 63169
Revision: 29-Oct-15
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
1
303133, 303134, 303135, 303136, 303137, 303138
FIGURE 2 - TRIMMING TO VALUES
(Conceptual Illustration)
Interloop
capacitance
reduction
in series
Mutual
inductance
reduction
due to change
in current
direction
Current path
before trimming
Current path after trimming
FIGURE 3 - TYPICAL RESISTANCE/
TEMPERATURE CURVE
TCR Values for Different Temperature Ranges
+ 500
+ 400
+ 300
+ 200
+ 100
ΔR
0
R
(ppm)
- 100
- 200
- 300
- 400
- 500
- 55
- 25
0
+ 25
+ 60 + 75
Ambient Temperature (°C)
+ 100 + 125
- 0.16 ppm/°C
Trimming process
removes this material
from shorting strip area
changing current path
and increasing
resistance
Foil shown in black, etched spaces in white
0.05 ppm/°C
- 0.1 ppm/°C
0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C
Note
To acquire a precision resistance value, the Bulk Metal Foil
chip is trimmed by selectively removing built-in “shorting bars.”
To increase the resistance in known increments, marked
areas are cut, producing progressively smaller increases in
resistance. This method reduces the effect of “hot spots” and
improves the long-term stability of VFR resistors.
Note
• The TCR values for < 100
are influenced by the termination
composition and result in deviation from this curve.
TABLE 2 - DIMENSIONS AND LAND PATTERN
in Inches (Millimeters)
Top View
L
X
T
D
MODEL
(CHIP SIZE)
303133 (0603)
303134 (0805)
303135 (1206)
303136 (1506)
303137 (2010)
L
± 0.005 (0.13)
0.063 (1.60)
0.080 (2.03)
0.126 (3.20)
0.150 (3.81)
0.198 (5.03)
W
± 0.005 (0.13)
0.032 (0.81)
0.050 (1.27)
0.062 (1.57)
0.062 (1.57)
0.097 (2.46)
THICKNESS
MAXIMUM
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
D
± 0.005 (0.13)
0.011 (0.28)
0.015 (0.38)
0.020 (0.51)
0.020 (0.51)
0.025 (0.64)
0.032 (0.81)
Z
(1)
0.102 (2.59)
0.122 (3.10)
0.175 (4.45)
0.199 (5.05)
0.247 (6.27)
0.291 (7.39)
G
(1)
0.031 (0.78)
0.028 (0.71)
0.059 (1.50)
0.083 (2.11)
0.115 (2.92)
0.150 (3.81)
X
(1)
0.031 (0.78)
0.050 (1.27)
0.071 (1.80)
0.071 (1.80)
0.103 (2.62)
0.127 (3.23)
Recommended Land Pattern
Footprint
W
Z
G
303138 (2512)
0.249 (6.32)
0.127 (3.23)
Note
(1)
Land Pattern Dimensions are per IPC-7351A
TABLE 3 - SPECIFICATIONS
MODEL
(CHIP SIZE)
303133 (0603)
303134 (0805)
303135 (1206)
303136 (1506)
303137 (2010)
303138 (2512)
RATED POWER (mW)
at + 70 °C
50
100
150
200
300
400
MAX. WORKING
VOLTAGE (
P
R
)
14 V
22 V
46 V
57 V
102 V
173 V
RESISTANCE RANGE
()
100 TO 2K
10to 5K
10to 14K
10to 16K
10to 35K
10to 75K
MAXIMUM WEIGHT
(mg)
4
6
11
12
27
40
www.vishayfoilresistors.com
2
For any questions, contact
foil@vpgsensors.com
Document Number: 63169
Revision: 29-Oct-15
303133, 303134, 303135, 303136, 303137, 303138
TABLE 4 - PERFORMANCES
TEST OR CONDITIONS
Thermal Shock, 100 x (- 65 °C to + 150 °C)
Low Temperature Operation, - 65 °C, 45 min at Rated Power
Short Time Overload, 6.25 x Rated Power, 5 s
High Temperature Exposure, + 150 °C, 100 h
Resistance to Soldering Heat
Moisture Resistance
Load Life Stability + 70 °C for 2000 h at Rated Power
Note
(1)
As shown + 0.01
to allow for measurement errors at low values.
MIL-PRF-55342
CHARACTERISTIC E
R
LIMITS
± 0.1 %
± 0.1 %
± 0.1 %
± 0.1 %
± 0.2 %
± 0.2 %
± 0.5 %
TYPICAL
R
LIMITS
MAXIMUM
R
LIMITS
(1)
± 0.005 % (50 ppm) ± 0.01 % (100 ppm)
± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
± 0.01 % (100 ppm) ± 0.03 % (300 ppm)
± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
± 0.005 % (50 ppm) ± 0.04 % (400 ppm)
± 0.005 % (50 ppm) ± 0.03 % (300 ppm)
FIGURE 4 - RECOMMENDED MOUNTING
Notes
(1)
IR and vapor phase reflow are recommended.
(2)
Avoid the use of cleaning agents which could attack epoxy resins, which form part
of the resistor construction
(3)
Vacuum pick up is recommended for handling
(4)
If the use of a soldering iron becomes necessary, precautionary measures should
be taken to avoid any possible damage / overheating of the resistor
* Recommendation: The solder fillet profile should be such as to avoid running over
the top metallization
MODEL NUMBER
CHIP SIZE
VALUE RANGE (SPACE APPLICATIONS)
RATED POWER AT 70 °C
303133
0603
100
to 2 k
50 mW
303134
0805
10
to 5 k
100 mW
303135
1206
303136
1506
303137
2010
*
303138
2512
10
to 14 k 10
to 16 k 10
to 35 k 10
to 75 k
150 mW
200 mW
300 mW
400 mW
Notes
(1)
Measurement error allowed for
R
limits: 0.01
.
(2)
An additional 54 sample units per lot which successfully pass 100 % screening are to be used for destructive testing and are to be kept on
file at the plant of manufacture.
(3)
Lot definition (1 lot = 1 primary flowcard): Each value per chip size should be qualified individually. Contact Vishay application engineering for
alternative lot definitions.
(4)
For prototype units, append a “U” to the model number (example: 303134U). These units have all of the table 2A 100 % tests performed, with
no destructive qualification testing required.
TABLE 5 - EEE-INST-002 (TABLE 2A FILM/FOIL, LEVEL 1) 100 % TESTS/INSPECTIONS
Pre-cap Visual Inspection
RC Record
Thermal Shock
Power Conditioning
RC Record
Final Inspection
Visual Inspection
Mechanical Inspection
Performed in production flow prior overcoating
In tolerance
25 x (- 65 °C to + 150 °C)
70 °C, 100 h, 1.5 rated power - not to exceed max. voltage
In tolerance
R
= 0.05 % for thermal shock and conditioning combined
5 % PDA on
R
only, 10 % PDA on “Out of Final Tolerance”
Materials, design, etc.
Physical dimensions, sample size: 3 units, zero failure
Document Number: 63169
Revision: 29-Oct-15
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
3
303133, 303134, 303135, 303136, 303137, 303138
TABLE 6 - EEE-INST-002 (TABLE 3A FILM/FOIL, LEVEL 1) DESTRUCTIVE TESTS
Sample size: 3, zero failure
Group 2
Solderability
Sample size: 10, zero failure - mounted on FR4
Values
TCR
(- 55 °C/+ 25 °C/+ 125 °C)
100
50
to < 100
10
to < 50
Group 3
Low temperature storage
R
= 0.02 %
- 65 °C no load dwell for 24 h ± 4 h
+ 25 °C ambient no load dwell for 2 h to 8 h
R
= 0.02 %
- 65 °C no load dwell for 1 h
rated power for 45 min
+ 25 °C ambient no load dwell for 24 h ± 4 h
R
= 0.02 %
6.25 x rated power, 5 s - no “I” limitation: not to exceed twice the maximum voltage
TCR limits
± 3 ppm/°C
± 4 ppm/°C
± 5 ppm/°C
Low temperature operation
Short time overload
Sample size: 9, zero failure - mounted on FR4
Group 4
Resistance to soldering heat
R
= 0.02 %
Performed per MIL-PRF-55342 para. 4.8.8.1
Sample size: 12, zero failure - mounted on FR4
Group 6
Life
R
= 0.03 %
2000 h, + 70 °C, rated power
Sample size: 10, zero failure - mounted on FR4
Group 7B
Solder mounting integrity
Performed per MIL-PRF-55342
For 0603: force applied 1 kg, 30 s
For 0805, 1206, 1506: force applied: 2 kg, 30 s
For 2010, 2512: force applied: 3 kg, 30 s
Sample Size: 5, zero failure - chips not mounted
Group 8
Voltage coefficient
R
= 3 ppm/V
Applicable resistors
1K
Performed per MIL-STD-202 method 309
Sample size: 5, zero failure - mounted on FR4
Group 9
High temperature exposure
R
= 0.03 %
Performed per MIL-PRF-55342
100 h at + 150 °C ± 5 °C
www.vishayfoilresistors.com
4
For any questions, contact
foil@vpgsensors.com
Document Number: 63169
Revision: 29-Oct-15
303133, 303134, 303135, 303136, 303137, 303138
TABLE 7 - PART NUMBER IDENTIFICATION
Model #
Chip Size
Value Range
(Space Application)
303133
0603
100 Ω to 2 kΩ
303134
0805
10 Ω to 5 kΩ
303135
1206
10 Ω to 14 kΩ
303136
1506
10 Ω to 16 kΩ
303137
2010
10 Ω to 35 kΩ
303138
2512
10 Ω to 75 kΩ
Part Number:
{Model} - {Value} - {Tolerance} - {Termination} - {Packaging}
Resistance Value
250R to 75K
100R to < 250R
50R to < 100R
25R to < 50R
10R to < 25R
Tolerance (Tightest) Code
0.01 %
0.05 %
0.1 %
0.25 %
0.5 %
T
A
B
C
D
Termination
Tin/lead
Code
B
Packaging
Waffle
Tape and reel
Code
W
T
Example:
303135 - 10K025 - DBW
1206 chip size, 10.025 kΩ, 0.5 %, tin/lead termination, waffle packaging
Document Number: 63169
Revision: 29-Oct-15
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
5
Linux开发
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
