Datasheet> 器件分类 > 无源元件> 电容器> 060330250151JXR

060330250151JXR: 产品描述Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.00015uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT; 产品类别无源元件电容器; 文件大小197KB，共2页; 制造商Syfer; 标准

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060330250151JXR概述

Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.00015uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT

060330250151JXR规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
Objectid	1673946153
包装说明	, 0603
Reach Compliance Code	compliant
Country Of Origin	Mainland China
ECCN代码	EAR99
YTEOL	6.95
电容	0.00015 µF
电容器类型	CERAMIC CAPACITOR
介电材料	CERAMIC
JESD-609代码	e3
制造商序列号	0603
安装特点	SURFACE MOUNT
多层	Yes
负容差	5%
端子数量	2
最高工作温度	125 °C
最低工作温度	-55 °C
封装形状	RECTANGULAR PACKAGE
包装方法	TR, 13 INCH
正容差	5%
额定（直流）电压（URdc）	25 V
尺寸代码	0603
表面贴装	YES
温度特性代码	X7R
温度系数	15% ppm/°C
端子面层	Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状	WRAPAROUND

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MLCCs

for Non-

magnetic

applications

C0G/NP0, High Q and X7R

Copper Barrier MLCCs

Multilayer ceramic capacitors

with silver/palladium (Ag/Pd)

terminations have often been

used in medical applications

where non-magnetic

components are required, for

example in MRI equipment.

The use of conventional nickel

barrier terminations is not

suitable due to nickel exhibiting

magnetic properties.

However, RoHS requirements

have dictated the use of

lead-free solders, and the

composition of these solders

has resulted in an increase in

soldering temperatures. This

has caused solder leaching

problems for the Ag/Pd

termination, and meant

alternative terminations have

had to be found.

Specification

Capacitance Values

C0G/NP0 & High Q

0.1pF - 15nF

X7R

47pF - 6.8µF

See overleaf for full list of values

Mechanical

Termination Material

See ordering information below

Solderability

IEC 60068-2-58. Passed 3 times reflow

profile defined in J-STD-020

Printing

Consult sales office

Lead Free Soldering

Termination codes 2 and 3 ranges are

fully compliant with the RoHS and WEEE

directives and parts are compatible with lead

free solders.

Climatic Category

55/125/56

Reeled Quantities

See Capacitance tables overleaf

Electrical

C0G/NP0

-55°C to

+125°C

High Q

-55°C to

+125°C

X7R

-55°C to

+125°C

Operating Temperature

Temperature Coefficient

(Typical)

0 ± 30

ppm/°C

0 ± 30

ppm/°C

±15%

Insulation Resistance

Time constant (Ri xCr) (whichever is the least)

100GΩ or

1000s

Ageing Rate

None

Typical 1% per

time decade

100GΩ or

1000s

100GΩ or

1000s

Ordering Information

1210

Chip

size

0402

0603

0505

0805

1206

1111

1210

1808

1812

2220

2225

Termination

(for C0G/NP0

& High Q only)

= Sintered

silver base with

copper barrier

(100% matte tin

plating). RoHS

compliant.

100

Voltage

0103

Capacitance in

picofarads (pF)

Capacitance

tolerance

Dielectric

Packaging

___

Suffix

As copper is non-magnetic,

one solution is to use a copper

barrier instead of a nickel

barrier, with a tin finish on top,

and this is the solution Syfer

has developed.

This copper barrier termination

is offered with selected non-

magnetic C0G/NP0, High Q

and X7R dielectrics, providing a

fully non-magnetic component.

To meet high temperature

260ºC soldering reflow profiles

as detailed in J-STD-020, C0G/

NP0 dielectrics are supplied

with sintered termination and

X7R dielectrics are supplied

with Syfer’s award winning

FlexiCap™ termination.

41/09

016 = 16V <10pF Insert a P for

= C0G/

= 178mm Used for

<4.7pF

the decimal point, H = ±0.05pF NP0 (1B)

025 = 25V

(7”) reel

specific

050 = 50V

eg P300 = 0.3pF,

customer

B = ±0.1pF

= X7R

= 330mm

8P20 = 8.2pF.

063 = 63V

C = ±0.25pF

(2R1)

(13”) reel requirements

100 = 100V

D = ±0.5pF

10pF 1st digit

= High Q

= Bulk

150 = 150V

is 0. 2nd and

4.7pF &

pack - tubs

200 = 200V

3rd digits are

<10pF

250 = 250V significant figures

B = ±0.1pF

= FlexiCap™ 500 = 500V

of capacitance

C = ±0.25pF

630 = 630V code. The 4th digit D = ±0.5pF

base with

1K0 = 1000V is number of 0’s

copper barrier

10pF

(100% matte 1K2 = 1200V

following

F = ±1%

1K5 = 1500V

tin plating).

eg. 0103 =

G = ±2%

RoHS compliant. 2K0 = 2000V

10000pF

J = ±5%

3K0 = 3000V

K = ±10%

Values <1pF in

0.1pF steps, above

this values are E24

series

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