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IS61NVF25618EC-6.5B2L

产品描述ZBT SRAM, 256KX18, 6.5ns, CMOS, PBGA119, 14 X 22 MM, LEAD FREE, PLASTIC, MS-028, BGA-119
产品类别存储    存储   
文件大小2MB,共40页
制造商ISSI(芯成半导体)
官网地址http://www.issi.com/
标准
下载文档 详细参数 全文预览

IS61NVF25618EC-6.5B2L概述

ZBT SRAM, 256KX18, 6.5ns, CMOS, PBGA119, 14 X 22 MM, LEAD FREE, PLASTIC, MS-028, BGA-119

IS61NVF25618EC-6.5B2L规格参数

参数名称属性值
是否Rohs认证符合
Objectid1247972027
包装说明BGA, BGA119,7X17,50
Reach Compliance Codecompliant
Country Of OriginMainland China, Taiwan
ECCN代码3A991.B.2.A
YTEOL5.05
最长访问时间6.5 ns
最大时钟频率 (fCLK)133 MHz
I/O 类型COMMON
JESD-30 代码R-PBGA-B119
长度22 mm
内存密度4718592 bit
内存集成电路类型ZBT SRAM
内存宽度18
功能数量1
端子数量119
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA119,7X17,50
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
电源2.5 V
认证状态Not Qualified
座面最大高度3.5 mm
最大待机电流0.035 A
最小待机电流2.38 V
最大压摆率0.235 mA
最大供电电压 (Vsup)2.625 V
最小供电电压 (Vsup)2.375 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
宽度14 mm

文档预览

下载PDF文档
IS61(4)NLF12836EC/IS61(4)NVF12836EC/IS61(4)NLF12832EC
IS61(4)NVF12832EC/IS61(4)NLF25618EC/IS61(4)NVF25618EC
128K x36/32 and 256K x18 4Mb, ECC, FLOW THROUGH 'NO WAIT'
STATE BUS SYNCHRONOUS SRAM
APRIL 2017
FEATURES
100 percent bus utilization
No wait cycles between Read and Write
Internal self-timed write cycle
Individual Byte Write Control
Single R/W (Read/Write) control pin
Clock controlled, registered address, data and
control
Interleaved or linear burst sequence control
using MODE input
Three chip enables for simple depth
expansion and address pipelining
Power Down mode
Common data inputs and data outputs
/CKE pin to enable clock and suspend
operation
JEDEC 100-pin QFP, 165-ball BGA and 119-
ball BGA packages
Power supply:
NLF: V
DD
3.3V (± 5%), V
DDQ
3.3V/2.5V (± 5%)
NVF: V
DD
2.5V (± 5%), V
DDQ
2.5V (± 5%)
JTAG Boundary Scan for BGA packages
Industrial and Automotive temperature support
Lead-free available
Error Detection and Error Correction
DESCRIPTION
The 4Mb product family features high-speed, low-
power synchronous static RAMs designed to
provide a burstable, high-performance, 'no wait'
state, device for networking and communications
applications. They are organized as 128K words
by 36 bits and 256K words by 18 bits, fabricated
with
ISSI's
advanced CMOS technology.
Incorporating a 'no wait' state feature, wait cycles
are eliminated when the bus switches from read
to write, or write to read. This device integrates a
2-bit burst counter, high-speed SRAM core, and
high-drive capability outputs into a single
monolithic circuit.
All synchronous inputs pass through registers are
controlled by a positive-edge-triggered single
clock input. Operations may be suspended and all
synchronous inputs ignored when Clock Enable,
/CKE is HIGH. In this state the internal device will
hold their previous values.
All Read, Write and Deselect cycles are initiated
by the ADV input. When the ADV is HIGH the
internal burst counter is incremented. New
external addresses can be loaded when ADV is
LOW.
Write cycles are internally self-timed and are
initiated by the rising edge of the clock inputs and
when /WE is LOW. Separate byte enables allow
individual bytes to be written.
A burst mode pin (MODE) defines the order of the
burst sequence. When tied HIGH, the interleaved
burst sequence is selected. When tied LOW, the
linear burst sequence is selected.
-6.5
6.5
7.5
133
FAST ACCESS TIME
Symbol
tKQ
tKC
Parameter
Clock Access Time
Cycle time
Frequency
-7.5
7.5
8.5
117
Units
ns
ns
MHz
Copyright © 2017 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such
applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.- www.issi.com
Rev. C2
04/21/2017
1
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