4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2.0 mm
Product Features:
Low Cost SMD Package
Ultra Miniature Package
Compatible with Leadfree Processing
ILCX19 Series
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
2.00±0.10
MARKING
1.60±0.10
Frequency
ESR (Equivalent Series Resistance)
16.0 MHz – 23.9 MHz
24.0 MHz – 25.9 MHz
26.0 MHz – 39.9 MHz
40.0 MHz – 60.0 MHz
60.0 MHz – 72.0 MHz
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
16.0 MHz to 72.0 MHz
CASE LID
0.50 MAX
150
Max.
80
Max.
60
Max.
60
Max
60
Max
3 pF Max.
30
ppm Standard (see Part Number Guide
for more options)
50
ppm Standard (see Part Number Guide
for more options)
AT Cut
18 pF Standard
100 µW Max.
0.55
0.70
1
2*
0.50
4*
3
0.65
*PIN 2 AND PIN 4 ARE INTERNALLY
CONNECTED TO CASE LID AND SHOULD
BE CONNECTED TO GROUND
1.25
1.05
5
ppm Max. / Year Standard
0.75
0.85
0 C to +70 C Standard (see Part Number
Guide for more options)
-40 C to +85 C Standard
SUGGESTED LAND PATTERN
DIMENSIONS: mm
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
ILCX19 -
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX19 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
F = Fundamental
18 pF Standard
Or Specify
- 20.000 MHz
Mode
(overtone)
Load Capacitance
(pF)
Frequency
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 08/07/15_D
Page 1 of 2
4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2.0 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
ILCX19 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
3000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I, Date Code (yww)
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 08/07/15_D
Page 2 of 2
FPGA/CPLD
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