4 Pad Metal Package Quartz Crystal, 4.8 mm x 12.5 mm
HC49USM4 Series
Product Features:
SMD Package
Compatible with Leadfree Processing
Grounded package for low EMI
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
Frequency
ESR (Equivalent Series Resistance)
3.2 MHz – 3.49 MHz
3.5 MHz – 3.99 MHz
4.0 MHz – 4.99 MHz
5.0 MHz – 5.99 MHz
6.0 MHz – 6.99 MHz
7.0 MHz – 8.9 MHz
9.0 MHz – 12.9 MHz
13 MHz – 19.9 MHz
20 MHz – 36 MHz
27 MHz – 100 MHz (3
rd
O.T.)
Shunt Capacitance
Frequency Tolerance @ +25 C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Operating Temperature
Storage Temperature
3.2 MHz to 100.000 MHz
300
Max.
200
Max.
150
Max.
120
Max.
100
Max.
80
Max.
60
Max.
40
Max.
30
Max.
100
Max.
7 pF Max.
30
ppm Standard (see Part Number Guide for more options)
50
ppm Standard (see Part Number Guide for more options)
AT Cut Standard
18 pF Standard (see Part Number Guide for more options)
1 mW Max.
5
ppm Max. / Year Standard
0 C to +70 C Standard (see Part Number Guide for more
options)
-40 C to +85 C Standard
`
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
HC49USM4 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
HC49USM4 -
(5.2 mm H)
HC49USM6 -
(4.5 mm H)
HC49USM8 -
(5.2 mm H)
18 pF Standard
Or Specify.
- 20.000 MHz
HC49USM9 -
(4.5 mm H)
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 11/22/17_B
Page 1 of 2
4 Pad Metal Package Quartz Crystal, 4.8 mm x 12.5 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
HC49USM4 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N/A
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
24 +/-.3
12 +/-.2
11.5 +/-.2
25 +/-1.5
80 / 100
330
Environmental Specifications
Thermal Shock
Moisture Resistance
``Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Frequency, Date Code
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 11/22/17_B
Page 2 of 2
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