3.3V arinc 429 terminal IC
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Holt Integrated Circuits |
| 零件包装代码 | QFN |
| 包装说明 | QCCJ, |
| 针数 | 52 |
| Reach Compliance Code | unknow |
| ECCN代码 | 7A994 |
| 其他特性 | ALSO REQUIRES +/-10 V SUPPLY |
| 地址总线宽度 | |
| 边界扫描 | NO |
| 最大时钟频率 | 1 MHz |
| 最大数据传输速率 | 0.0152587890625 MBps |
| 外部数据总线宽度 | 16 |
| JESD-30 代码 | S-CQCC-J52 |
| JESD-609代码 | e0 |
| 长度 | 19.05 mm |
| 低功率模式 | NO |
| 串行 I/O 数 | 2 |
| 端子数量 | 52 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 225 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.826 mm |
| 最大供电电压 | 3.45 V |
| 最小供电电压 | 3.15 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 19.05 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| HI-3582CJI | HI-3582 | HI-3582CJI-10 | HI-3582CJIF | HI-3582CJIF-10 | HI-3582PCI | HI-3582PCI-10 | HI-3582PCIF | HI-3582PCT | HI-3582PCT-10 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 3.3V arinc 429 terminal IC | 3.3V arinc 429 terminal IC | 3.3V arinc 429 terminal IC | 3.3V arinc 429 terminal IC | 3.3V arinc 429 terminal IC | 3.3V arinc 429 terminal IC | 3.3V arinc 429 terminal IC | 3.3V arinc 429 terminal IC | 3.3V arinc 429 terminal IC | 3.3V arinc 429 terminal IC |
| 是否无铅 | 含铅 | - | 含铅 | - | - | 含铅 | 含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | - | 不符合 | 不符合 | 符合 | 不符合 | 不符合 |
| 厂商名称 | Holt Integrated Circuits | - | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits |
| 零件包装代码 | QFN | - | QFN | - | - | QFN | QFN | QFN | QFN | QFN |
| 包装说明 | QCCJ, | - | QCCJ, | , | , | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, |
| 针数 | 52 | - | 52 | - | - | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | unknow | - | unknow | compli | compli | unknow | unknow | compli | unknow | unknow |
| ECCN代码 | 7A994 | - | 7A994 | - | - | 7A994 | 7A994 | 7A994 | 7A994 | 7A994 |
| 其他特性 | ALSO REQUIRES +/-10 V SUPPLY | - | ALSO REQUIRES +/-10 V SUPPLY | - | - | ALSO REQUIRES +/-10 V SUPPLY | ALSO REQUIRES +/-10 V SUPPLY | ALSO REQUIRES +/-10 V SUPPLY | ALSO REQUIRES +/-10 V SUPPLY | ALSO REQUIRES +/-10 V SUPPLY |
| 边界扫描 | NO | - | NO | - | - | NO | NO | NO | NO | NO |
| 最大时钟频率 | 1 MHz | - | 1 MHz | - | - | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| 最大数据传输速率 | 0.0152587890625 MBps | - | 0.0152587890625 MBps | - | - | 0.0152587890625 MBps | 0.0152587890625 MBps | 0.0152587890625 MBps | 0.0152587890625 MBps | 0.0152587890625 MBps |
| 外部数据总线宽度 | 16 | - | 16 | - | - | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | S-CQCC-J52 | - | S-CQCC-J52 | - | - | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 |
| JESD-609代码 | e0 | - | e0 | - | - | e0 | e0 | e3 | e0 | e0 |
| 长度 | 19.05 mm | - | 19.05 mm | - | - | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm |
| 低功率模式 | NO | - | NO | - | - | NO | NO | NO | NO | NO |
| 串行 I/O 数 | 2 | - | 2 | - | - | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 52 | - | 52 | - | - | 64 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 85 °C | - | 85 °C | - | - | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | - | QCCJ | - | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | - | SQUARE | - | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | - | CHIP CARRIER | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 225 | - | 225 | - | - | 240 | 240 | 260 | 240 | 240 |
| 认证状态 | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.826 mm | - | 4.826 mm | - | - | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 最大供电电压 | 3.45 V | - | 3.45 V | - | - | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V |
| 最小供电电压 | 3.15 V | - | 3.15 V | - | - | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
| 标称供电电压 | 3.3 V | - | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | - | YES | - | - | YES | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | - | J BEND | - | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | - | 1.27 mm | - | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | - | QUAD | - | - | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | - | - | 30 | 30 | 40 | 30 | 30 |
| 宽度 | 19.05 mm | - | 19.05 mm | - | - | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
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