Datasheet> 器件分类 > 无源元件> 电阻器> M55342K03U5H60S-W

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M55342K03U5H60S-W: 产品描述Fixed Resistor, Metal Glaze/thick Film, 0.2W, 5600ohm, 75V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1005, CHIP; 产品类别无源元件电阻器; 文件大小101KB，共1页; 制造商State of the Art Inc

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M55342K03U5H60S-W概述

Fixed Resistor, Metal Glaze/thick Film, 0.2W, 5600ohm, 75V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1005, CHIP

M55342K03U5H60S-W规格参数

参数名称	属性值
是否Rohs认证	不符合
Objectid	1919622249
包装说明	CHIP
Reach Compliance Code	compliant
Country Of Origin	USA
YTEOL	7.65
JESD-609代码	e4
制造商序列号	M55342/03
安装特点	SURFACE MOUNT
端子数量	2
最高工作温度	150 °C
封装形状	RECTANGULAR PACKAGE
包装方法	WAFFLE PACK
额定功率耗散 (P)	0.2 W
额定温度	70 °C
参考标准	MIL-PRF-55342
电阻	5600 Ω
电阻器类型	FIXED RESISTOR
尺寸代码	1005
表面贴装	YES
技术	METAL GLAZE/THICK FILM
温度系数	100 ppm/°C
端子面层	Gold (Au)
端子形状	WRAPAROUND
容差	2%
工作电压	75 V

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State of the Art, Inc.

Thick Film Chip Resistor

M55342/03 RM1005

GLASS

PASSIVATION

WRAPAROUND

TERMINATIONS

RESISTOR

FILM

96% ALUMINA CHIP

PERFORMANCE

TEMPERATURE RISE (°C)

Resistance Range

Tolerances

Maximum Power

Maximum Voltage

- 22M

1%, 2%, 5%, 10%

200 mW

75 Volts

CHARACTERISTICS*

±100

±0.5%

±0.25%

±0.5%

±300

±0.5%

±0.25%

±0.5%

±2.0%

±1.0%

CURRENT NOISE

POWER DISSIPATION

fiber epoxy board

ceramic board

TESTS

TCR (-55 to +125

C) in ppm/

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Soldering Heat

Moisture Resistance

Life, 2,000 Hours

High Temperature Exposure

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

*Maximum allowable change per MIL-PRF-55342,

typical change is 10% of these values.

PART NUMBERING

M55342 K 03 B 100D S - TR

PACKAGING CODE: TR = Tape & Reel W= Waffle Pack

PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER

RESISTANCE AND TOLERANCE CODE:

Three significant digits, with a letter indicating the

decimal location, the tolerance, and the value range.

D: 1%

E: 1% K

F: 1% M

G: 2%

H: 2% K

T: 2% M

J: 5%

K: 5% K

L: 5% M

M: 10%

N: 10% K

P: 10% M

TERMINATION MATERIALS:

B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound

W: Gold wire bondable

G: Gold wraparound

SIZE CODE: /03 = RM1005

TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm

PERFORMANCE SPECIFICATION MIL-PRF-55342

MECHANICAL

INCHES

MILLIMETERS

.130

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.100 (.098 - .112)

.048 (.045 - .055)

.018 (.015 - .033)

.014 (.010 - .020)

.072 (.068 - .076)

.0054 grams

2.54

1.22

0.46

0.36

1.83

(2.49 - 2.84)

(1.14 - 1.40)

(0.38 - 0.84)

(0.25 - 0.51)

(1.73 - 1.93)

.052

.066

.032

State of the Art, Inc.

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401

“Specifications subject to change without notice.”

www.resistor.com

04/09/08

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