Silicon PIN Chips
PIN Diode Chips
Rev. V23
Features
Switch & Attenuator Die
Extensive Selection of I-Region Lengths
Hermetic
Glass Passivated Cermachip
Oxide Passivated Planar Chips
Voltage Ratings to 3000 V
Fast Switching Speed
Low Loss
High Isolation
RoHS* Compliant
Anode
Description
MACOM offers a comprehensive line of low
capacitance, planar and mesa, silicon PIN diode
chips which use ceramic glass and silicon nitride
passivation technology. The silicon PIN chip series
of devices cover a broad spectrum of performance
requirements for control circuit applications. They
are available in several choices of I-region lengths
and have been optimally designed to minimize
parametric trade offs when considering low
capacitance, low series resistance, and high
breakdown voltages. Their small size and low
parasitics, make them an ideal choice for
broadband, high frequency, micro-strip hybrid
assemblies.
The attenuator line of PIN diode chips are a planar
or mesa construction and because of their thicker
I-regions and predictable R
S
vs. I characteristics,
they are well suited for low distortion attenuator
and switch circuits. Incorporated in the chip’s
construction is MACOM’s, time proven, hard glass,
Cermachip process. The hard glass passivation
completely encapsulates the entire PIN junction area
resulting in a hermetically sealed chip which has
been qualified in many military applications. These
Cermachip diodes are available in a wide range of
voltages, up to 3,000 volts, which are capable of
controlling kilowatts of RF power.
Many of MACOM ’s silicon PIN diode chips are also available
in several different package styles. Please refer to the
“Packaged PIN Diode Datasheet” for case style availability
and electrical specifications located on the MACOM website.
Also for high voltage, high power devices refer to
MA4PK2000.
Full Area Cathode
Absolute Maximum Ratings
1
T
A
= +25°C (
Unless otherwise specified
)
Parameter
Forward Current (I
F
)
Reverse Voltage (V
R
)
Power Dissipation (W)
Operating Temperature
Storage Temperature
Junction Temperature
Mounting Temperature
Absolute Maximum
Per P/N R
s
vs. I Graph
Per Specification Table
175°C – T
ambient
°C
Theta
-55°C to +175°C
-55°C to +200°C
+175°C
+320°C for 10 seconds
1. Exceeding these limits may cause permanent damage to the
chip.
1
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008899
Silicon PIN Chips
PIN Diode Chips
Rev. V23
Electrical Specifications: T
A
= +25°C
Low Capacitance PIN
Maximum Characteristics
Reverse
Voltage
2
V
R
<10 µA
VDC
MA4P161-134
MA4P203-134
MA4P7493-134
MADP-000165-01340W
MADP-000135-01340W
100
100
150
200
200
Capacitance Series Res.
1 MHz
500 MHz
C
J
@ -10 V R
S
@ 10 mA
pF
0.10
0.15
0.05
0.06
0.15
Ω
1.50
1.50
1.80
2.50
1.20
Carrier
Lifetime
3
T
L
ηs
150
150
80
200
440
Nominal Characteristics
Reverse
Recovery
Time
4
T
RR
ηs
15
25
8
20
44
I Region
Length
µm
13
13
19
19
19
Part Number
Theta
°C/W
65
75
60
30
30
Attenuator PIN
Maximum Characteristics
Reverse
Voltage
2
V
R
<10 µA
V
DC
MA47416-132
MA47418-134
200
200
Nominal Characteristics
Part Number
Capacitance Series Res. Carrier Series Res. Series Res.
I Region
1 MHz
100 MHz
Lifetime
3
100 MHz
100 MHz
Theta
Length
C
J
@ -100 V R
S
@ 10 mA
T
L
R
S
@ 10
μA
R
S
@ 1 mA
pF
0.15
0.15
Ω
6
3
µs
2
1
Ω
2000
500
Ω
30
15
mils
4
2
°C/W
30
25
2. Reverse Voltage (V
R
) is sourced and the resultant reverse leakage current (I
R
) is measured to be <10
μA.
3. Nominal carrier life time (T
L
) specified at I
F
= +10 mA , I
REV
= - 6 mA.
4. Nominal reverse recovery time specified at I
F
= +20 mA , I
REV
= - 200 mA.
2
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008899
Silicon PIN Chips
PIN Diode Chips
Rev. V23
Electrical Specifications: T
A
= +25°C (cont.)
Cermachip PIN
Maximum Characteristics
Part Number
Reverse
Voltage
5
V
R
<10 µA
V
DC
MA4P303-134
MA4P404-132
MA4P504-132
MA4P505-131
MA4P506-131
MADP-000488-13740W
MA4P604-131
MA4P606-131
MA4P607-212
MA4PK3000-1252
7
200
250
500
500
500
900
1000
1000
1000
3000
Capacitance
1 MHz
C
J
@ -100 V
pF
0.15 @ 10 V
0.20 @ 50 V
0.20
0.35
0.70
0.19 @ 50 V
0.30
0.60
1.30
2.90
Series Res.
100 MHz
R
S
@ 100 mA
Ω
1.5 @ 10 mA
8
0.70 @ 50 mA
8
0.60
0.45
0.30
1.6 @ 50 mA
1.00
0.70
0.40
0.25 @ 500 mA
9
Nominal Characteristics
Carrier
Lifetime
6
µs
0.3
0.6
1
2
3
4
3
4
12
60
I Region
Length
µm
20
30
50
50
50
140
90
90
127
350
Theta
°C/W
30
20
20
14
11
45
10
8
4
1.5
5. Reverse Voltage (V
R
) is sourced and the resultant reverse leakage current (I
R
) is measured to be <10
μA.
6. Nominal carrier life time (T
L
) specified at I
F
= +10 mA , I
REV
= - 6 mA.
7. Upon completion of circuit installation, the chip must be covered with a dielectric conformal coating such as SYLGARD 539
®
to prevent
voltage arcing.
8. Test Frequency = 500 MHz
9. Test Frequency = 4 MHz
3
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008899
Silicon PIN Chips
PIN Diode Chips
Rev. V23
Chip Dimensions
Anode
Low Capacitance PIN Chip
Part Number
MA4P161-134
MA4P203-134
MA4P7493-134
MADP-000165-01340W
MADP-000135-01340W
Nominal Characteristics (mils.)
Anode Diameter
Chip Size
Chip Thickness
± 0.5
± 0.5
± 0.5
3.5
13 x 13
6.0
3.1
3.8
1.8
3.1
13 x 13
13 x 13
13 x 13
13 x 13
6.0
6.5
10.0
10.0
Attenuator PIN Chip
Part Number
MA47416-132
MA47418-134
10. Anode top contact is square.
Nominal Characteristics (mils.)
Anode Diameter
Chip Size
Chip Thickness
± 0.5
± 2.0
± 1.0
10
7.5x7.5
19 x 19
7.0
7.5
13 x 13
7.0
Cermachip PIN Chip
Part Number
MA4P303-134
MA4P404-132
MA4P504-132
MA4P505-131
MA4P506-131
MADP-000488-13740W
MA4P604-131
MA4P606-131
MA4P607-212
4
Nominal Characteristics (mils.)
Anode Diameter
Chip Size
Chip Thickness
± 0.5
± 2.0
± 1.0
3.0
13 x 13
10.0
6.8
6.8
13.0
15.8
12.2
17.0
21.0
37.0
85.0
20 x 20
20 x 20
27 x 27
27 x 27
23 x 23
27 x 27
32 x 32
62 x 62
172 x 172
10.0
10.0
11.0
12.0
13.5
13.5
14.0
18.5
28.0
MA4PK3000-1252
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008899
Silicon PIN Chips
PIN Diode Chips
Rev. V23
Typical Series Resistance vs. Forward Current Performance
MA4P203, MA4P303, MA4P404
1000
MA4P504, MA4P505, MA4P506
1000
Series Resistance ()
100
Series Resistance ()
MA4P203
MA4P303
MA4P404
100
MA4P504
MA4P505
MA4P506
10
10
1
1
0.1
0
0.1
1
10
100
1000
0.1
0
0.1
1
10
100
1000
Forward Current (mA)
Forward Current (mA)
MA4P604, MA4P606, MA4P607
1000
MA47416, MA47418
10000
Series Resistance ()
100
MA4P604
MA4P606
MA4P607
Series Resistance ()
1000
MA47416
MA47418
100
10
10
1
1
0.1
0
0.1
1
10
100
1000
0.1
0
0.1
1
10
100
1000
Forward Current (mA)
Forward Current (mA)
5
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008899
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