Approval sheet
WA06Y
±
5%,
±
1% Convex Type
General purpose chip resistors array
Size 0603x2
*Contents in this sheet are subject to change without prior notice.
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ASC_WA06Y_V08
Jul.2010
Approval sheet
FEATURE
1. Small size and light weight
2. Reduced size of final equipment
3. Lower surface mounted assembly costs
4. Higher component and equipment reliability
5. RoHS compliant and Lead free products
APPLICATION
•
•
•
Consumer electrical equipment
EDP, Computer application
Telecom
DESCRIPTION
The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
within tolerance by laser cutting of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is a Tin (Pb free) solder alloy.
Fig 1. Consctruction of a Chip-R array WA06Y
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ASC_WA06Y_V08
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Approval sheet
QUICK REFERENCE DATA
Item
Series No.
Size
Termination construction
Resistance Tolerance
Resistance Range
TCR (ppm/°C)
≥10Ω
<10Ω
Max. dissipation at T
amb
=70°C
Rated current of jumper
Max. Operation Voltage (DC or RMS)
Max. overload voltage
Climatic category (IEC 60068)
Note :
1.
2.
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
≤ ±
200 ppm/°C
-300~+500 ppm/°C
1/10W
1A
50V
100V
55/155/56
General Specification
WA06Y
0603x2 (1608x2)
Convex type
±5%
,
±1%
(E24 series)
1Ω ~ 1MΩ, Jumper (0Ω)
RCWV
=
Rated Power
×
Resistance Value
or Max. RCWV listed above, whichever is lower.
DIMENSIONS(unit : mm)
WA06Y
L
W
T
A
Ta
Tb
C
1.60
±
0.10
1.50
±
0.10
0.50
±
0.10
0.60
±
0.10
0.30
±
0.15
0.30
±
0.15
0.40
±
0.10
a
T
W
P
b
T T
A
L
C
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Approval sheet
MARKING
3-digits marking
Each resistor is marked with a three digits code on the protective coating to designate the nominal resistance
value. For values up to 9.1 the R is used as a decimal point. For values of 10.0 or greater the first 2 digits
apply to the resistance value and third indicate the number of zeros to follow.
Example
RESISTANCE
3-digits marking
4.7Ω
4R7
10Ω
100
100Ω
101
6800Ω
682
47000Ω
473
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal resistance are taken from the E24 series for resistors with a tolerance of
±5%,
The values of the E24 series are in accordance with “IEC publication 60063”
Derating
The power that the resistor can dissipate depends on the operating temperature; see Fig.2
Figure 2. Maximum dissipation in percentage of rated power
As a function of the ambient temperature
CONSTRUCTION
R1=R2
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Approval sheet
MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by
automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
SOLDERING CONDITION
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C for 10
seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete
components on the reverse (mixed PCBs).
Surface Mount Resistors are tested for solderability at 235°C during 2 seconds. The test condition for no
leaching is 260°C for 30 seconds. Typical examples of soldering processes that provide reliable joints without
any damage are given in Fig 3.
Fig 3. Infrared soldering profile for Chip Resistors array
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated
temperature range :
Lower Category Temperature, Upper Category Temperature;
damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
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Jul.2010