Octal Transparent D-type Latches With 3-State Outputs 20-LCCC -55 to 125
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | QLCC |
包装说明 | QCCN, LCC20,.35SQ |
针数 | 20 |
Reach Compliance Code | _compli |
Factory Lead Time | 1 week |
系列 | AHCT/VHCT/VT |
JESD-30 代码 | S-CQCC-N20 |
长度 | 8.89 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.008 A |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
Prop。Delay @ Nom-Su | 10 ns |
传播延迟(tpd) | 10 ns |
认证状态 | Not Qualified |
筛选级别 | MIL-PRF-38535 Class Q |
座面最大高度 | 2.03 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 8.89 mm |
Base Number Matches | 1 |
5962-9685501Q2A | SN54AHCT573WR | SN74AHCT573DBLE | SN74AHCT573DGV | SN54AHCT573FK | SN54AHCT573FKR | SNJ54AHCT573FK | SN74AHCT573PWLE | SN54AHCT573W | |
---|---|---|---|---|---|---|---|---|---|
描述 | Octal Transparent D-type Latches With 3-State Outputs 20-LCCC -55 to 125 | AHCT/VHCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | Octal Transparent D-Type Latches With 3-State Outputs 20-SSOP -40 to 85 | AHCT/VHCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, TVSOP-20 | AHCT/VHCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | AHCT/VHCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, LCC-20 | Octal Transparent D-type Latches With 3-State Outputs 20-LCCC -55 to 125 | Octal Transparent D-Type Latches With 3-State Outputs 20-TSSOP -40 to 85 | AHCT/VHCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 |
零件包装代码 | QLCC | DFP | SSOP | SOIC | QLCC | QLCC | QLCC | TSSOP | DFP |
包装说明 | QCCN, LCC20,.35SQ | DFP, | SSOP, SSOP20,.3 | TSSOP, TSSOP20,.25,16 | QCCN, | QCCN, | QCCN, LCC20,.35SQ | PLASTIC, TSSOP-20 | DFP, |
针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | _compli | unknown | not_compliant | unknown | unknown | unknown | not_compliant | not_compliant | unknown |
系列 | AHCT/VHCT/VT | AHCT/VHCT | AHCT/VHCT/VT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT/VT | AHCT/VHCT/VT | AHCT/VHCT |
JESD-30 代码 | S-CQCC-N20 | R-GDFP-F20 | R-PDSO-G20 | R-PDSO-G20 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 | R-PDSO-G20 | R-GDFP-F20 |
长度 | 8.89 mm | 13.09 mm | 7.2 mm | 5 mm | 8.89 mm | 8.89 mm | 8.89 mm | 6.5 mm | 13.09 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | DFP | SSOP | TSSOP | QCCN | QCCN | QCCN | TSSOP | DFP |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | FLATPACK | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | FLATPACK |
传播延迟(tpd) | 10 ns | 9 ns | 10 ns | 10 ns | 9 ns | 9 ns | 10 ns | 10 ns | 9 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.03 mm | 2.54 mm | 2 mm | 1.2 mm | 2.03 mm | 2.03 mm | 2.03 mm | 1.2 mm | 2.54 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY |
端子形式 | NO LEAD | FLAT | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD | GULL WING | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 0.65 mm | 0.4 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL |
宽度 | 8.89 mm | 6.92 mm | 5.3 mm | 4.4 mm | 8.89 mm | 8.89 mm | 8.89 mm | 4.4 mm | 6.92 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
封装等效代码 | LCC20,.35SQ | - | SSOP20,.3 | TSSOP20,.25,16 | - | - | LCC20,.35SQ | TSSOP20,.25 | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
其他特性 | - | BROADSIDE VERSION OF 373 | BROADSIDE VERSION OF 373 | - | BROADSIDE VERSION OF 373 | BROADSIDE VERSION OF 373 | BROADSIDE VERSION OF 373 | BROADSIDE VERSION OF 373 | BROADSIDE VERSION OF 373 |
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