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HN2E01F_07

产品描述multi chip discrete device super high speed switching application
文件大小500KB,共7页
制造商Toshiba(东芝)
官网地址http://toshiba-semicon-storage.com/
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HN2E01F_07概述

multi chip discrete device super high speed switching application

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HN2E01F
TOSHIBA MULTI CHIP DISCRETE DEVICE
HN2E01F
Super High Speed Switching Application
Audio Frequency Amplifier Application
General Switching Application
Q1
Low Forward Voltage Drop
Fast Reverse Recovery Time
Low Total Capacitance
:
:
:
V
F(3
)=0.98V(typ.)
t
rr
=1.6ns(typ.)
C
T
=0.5pF(typ.)
h
FE
=600~3600
V
CEO
=50V
I
C
=150mA(max.)
1SS352 Equivalent
2SC4666 Equivalent
Unit: mm
Q2
High DC Current Gain
High Voltage
High Collector Current
Q1 (Diode)
Q2 (Transistor)
:
:
:
:
:
Q1 (Diode) Absolute Maximum Ratings
(Ta = 25°C)
Characteristic
Maximum (peak) reverse voltage
Reverse voltage
Maximum (peak) forward current
Average forward current
Surge current (10ms)
Symbol
V
RM
V
R
I
FM
I
O
I
FSM
Rating
85
80
300
100
1
Unit
V
V
mA
mA
A
1.Anode
2.Base
3.Collector
4.Emitter
5.NC
6.Cathode
JEDEC
JEITA
TOSHIBA
2-3N1D
Weight: 0.015g (typ.)
Q2 (Transistor) Absolute Maximum Ratings (
Ta = 25°C
)
Characteristic
Collector-base voltage
Collector-emitter voltage
Emitter-base voltage
Collector current
Base current
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
B
Rating
50
50
5
150
30
Unit
V
V
V
mA
mA
Absolute Maximum Ratings
(Ta = 25°C) (Q1, Q2 Common)
Characteristic
Collector power dissipation
Junction temperature
Storage temperature range
Symbol
P
C
*
T
j
T
stg
Rating
300
125
−55~125
Unit
mW
°C
°C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
* Total rating: 200mW per element should not be exceeded.
1
2007-11-22

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