X7R Dielectric
General Specifications
X7R formulations are called “temperature stable” ceramics
and fall into EIA Class II materials. X7R is the most popular
of these intermediate dielectric constant materials. Its tem-
perature variation of capacitance is within ±15% from
-55°C to +125°C. This capacitance change is non-linear.
Capacitance for X7R varies under the influence of electrical
operating conditions such as voltage and frequency.
X7R dielectric chip usage covers the broad spectrum of
industrial applications where known changes in capaci-
tance due to applied voltages are acceptable.
PART NUMBER (see page 2 for complete part number explanation)
0805
Size
(L" x W")
5
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
C
Dielectric
X7R = C
103
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
M
Capacitance
Tolerance
Preferred
J = ± 5%
K = ±10%
M = ± 20%
A
Failure
Rate
A = Not
Applicable
T
Terminations
T = Plated Ni
and Sn
7 = Gold
Plated
2
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
A
Special
Code
A = Std.
Product
Contact
Factory For
Multiples
Capacitance vs. Frequency
+30
+20
Insulation Resistance (Ohm-Farads)
X7R Dielectric
Typical Temperature Coefficient
10
5
Insulation Resistance vs Temperature
10,000
Capacitance
% Cap Change
0
-5
-10
-15
-20
-25
-60 -40 -20
0
20
40
60
80 100 120 140
+10
0
-10
-20
-30
1KHz
1,000
100
%
10 KHz
100 KHz
1 MHz
10 MHz
0
0
20
40
60
80
100
120
Temperature
°C
Frequency
Temperature
°C
Variation of Impedance with Cap Value
Impedance vs. Frequency
1,000 pF vs. 10,000 pF - X7R
0805
10.00
1,000 pF
10,000 pF
Variation of Impedance with Chip Size
Impedance vs. Frequency
10,000 pF - X7R
10
1206
0805
1210
Variation of Impedance with Chip Size
Impedance vs. Frequency
100,000 pF - X7R
10
1206
0805
1210
Impedance,
Impedance,
1.00
1.0
Impedance,
1.0
0.10
0.1
0.1
0.01
10
100
1000
.01
1
10
.01
100
1,000
1
10
100
1,000
Frequency, MHz
Frequency, MHz
Frequency, MHz
11
X7R Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Dissipation Factor
X7R Specification Limits
-55ºC to +125ºC
Within specified tolerance
≤
2.5% for
≥
50V DC rating
≤
3.0% for 25V DC rating
≤
3.5% for 16V DC rating
≤
5.0% for
≤
10V DC rating
100,000MΩ or 1000MΩ - µF,
whichever is less
No breakdown or visual defects
No defects
≤
±12%
Meets Initial Values (As Above)
≥
Initial Value x 0.3
≥
95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
≤
±7.5%
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤
±7.5%
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤
±12.5%
≤
Initial Value x 2.0 (See Above)
≥
Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
≤
±12.5%
≤
Initial Value x 2.0 (See Above)
≥
Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Charge device with twice rated voltage in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
Step 1: -55ºC ± 2º
Step 2: Room Temp
Step 3: +125ºC ± 2º
Step 4: Room Temp
30 ± 3 minutes
≤
3 minutes
30 ± 3 minutes
≤
3 minutes
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
90 mm
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
For Cap > 10 µF, 0.5Vrms @ 120Hz
Charge device with rated voltage for
60 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Insulation Resistance
Dielectric Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Resistance to
Flexure
Stresses
Solderability
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
Resistance to
Solder Heat
Thermal
Shock
Repeat for 5 cycles and measure after
24 ± 2 hours at room temperature
Load Life
Load
Humidity
12
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
(W) Width
(t) Terminal
WVDC
Cap
(pF)
MM
(in.)
MM
(in.)
MM
(in.)
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
3.3
4.7
10
22
47
100
0201
Reflow Only
All Paper
0.60 ± 0.03
(0.024 ± 0.001)
0.30 ± 0.03
(0.011 ± 0.001)
0.15 ± 0.05
(0.006 ± 0.002)
10
16
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
0402
Reflow Only
All Paper
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
10
16
25
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
0603
Reflow/Wave
All Paper
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
16
25
50
0805
Reflow/Wave
Paper/Embossed
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16
25
50
100
1206
Reflow/Wave
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25
50 100
Cap.
(µF)
6.3
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
50
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
6.3
10
100
200
10
200
10
16
200
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
N
N
N
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
J
J
J
J
J
J
J
J
J
J
J
J
M
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
J
J
J
J
J
J
J
J
J
J
M
M
M
E
E
E
E
E
E
E
E
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
L
W
T
t
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
P
P
P
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
Q
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
P
P
WVDC
10
16
6.3
10
16
25
50
6.3
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
SIZE
Letter
Max.
Thickness
A
0.33
(0.013)
0201
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
0402
G
0.86
(0.034)
J
0.94
(0.037)
K
1.02
(0.040)
0603
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
0805
Q
X
1.78
2.29
(0.070)
(0.090)
EMBOSSED
Y
2.54
(0.100)
Z
2.79
(0.110)
1206
BB
3.05
(0.120)
CC
3.175
(0.125)
Contact Factory for Multiples
13
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
(W) Width
(t) Terminal
Cap
(pF)
MM
(in.)
MM
(in.)
MM
(in.)
10
1210
Reflow/Wave
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16
25
1812
Reflow Only
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
25
50
1825
Reflow Only
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
2220
Reflow Only
All Embossed
5.7 ± 0.40
(0.224 ± 0.016)
5.0 ± 0.40
(0.197 ± 0.016)
0.64 ± 0.39
(0.025 ± 0.015)
100
200
2225
Reflow Only
All Embossed
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
WVDC
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
Cap.
0.010
(µF)
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
3.3
4.7
10
22
47
100
WVDC
50
100
16
100
50
L
W
T
t
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
N
N
N
N
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
N
N
N
P
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
P
P
P
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
P
P
Z
Z
Z
Z
Z
Z
M
X
X
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
P
Q
X
X
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Q
Q
Q
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
10
16
25
50
100
16
25
50
100
50
100
50
100
200
50
100
SIZE
Letter
Max.
Thickness
A
0.33
(0.013)
C
0.56
(0.022)
1210
E
0.71
(0.028)
PAPER
G
0.86
(0.034)
J
0.94
(0.037)
K
1.02
(0.040)
1812
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
1825
Q
X
1.78
2.29
(0.070)
(0.090)
EMBOSSED
2220
Y
2.54
(0.100)
Z
2.79
(0.110)
2225
BB
3.05
(0.120)
CC
3.175
(0.125)
Contact Factory for Multiples
14
High Voltage Chips
For 500V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chips capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/DC blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to
make high voltage chips. These larger sizes require that special pre-
cautions be taken in applying these chips in surface mount assem-
blies. This is due to differences in the coefficient of thermal expansion
(CTE) between the substrate materials and chip capacitors. Apply heat
at less than 4°C per second during the preheat. Maximum preheat
temperature must be within 50°C of the soldering temperature.
The solder temperature should not exceed 230°C. Chips 1808 and
larger to use reflow soldering only.
Capacitors with X7R Dielectrics are not intended for AC line filtering
applications.
Contact plant for recommendations. Capacitors may require protective
surface coating to prevent external arcing.
PART NUMBER (see page 2 for complete information and options)
1808
A
A
271
K
A
1
1A
AVX
Style
1206
1210
1808
1812
1825
2220
2225
3640
Voltage
7
=
500V
C
=
600V
A
=
1000V
S
=
1500V
G
=
2000V
W
=
2500V
H
=
3000V
J
=
4000V
K
=
5000V
Temperature Capacitance Capacitance
Failure
Coefficient
Code
Tolerance
Rate
(2 significant digits
C0G: J = ±5%
A = C0G
A=Not
+ no. of zeros)
K = ±10% Applicable
C = X7R
Examples:
M = ±20%
10 pF = 100 X7R: K = ±10%
100 pF = 101
M = ±20%
1,000 pF = 102
Z = +80%,
22,000 pF = 223
-20%
220,000 pF = 224
1 µF = 105
Termination
1= Pd/Ag
T = Plated Ni
and Solder
Packaging/Marking
1A = 7" Reel
Unmarked
3A = 13" Reel
Unmarked
9A = Bulk/Unmarked
W
L
T
t
DIMENSIONS
SIZE
(L) Length
(W) Width
(T) Thickness
Max.
(t) terminal
1206
1210
1808*
1812*
1825*
2220*
millimeters (inches)
2225*
3640*
3.20 ± 0.2
3.20 ± 0.2
4.57 ± 0.25
4.50 ± 0.3
4.50 ± 0.3
5.7 ± 0.4
5.72 ± 0.25
9.14 ± 0.25
(0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
1.60 ± 0.2
2.50 ± 0.2
2.03 ± 0.25
3.20 ± 0.2
6.40 ± 0.3
5.0 ± 0.4
6.35 ± 0.25
10.2 ± 0.25
(0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
1.52
1.70
2.03
2.54
2.54
3.3
2.54
2.54
(0.060)
(0.067)
(0.080)
(0.100)
(0.100)
(0.130)
(0.100)
(0.100)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.76 (0.030)
0.75 (0.030)
0.75 (0.030)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.52 (0.060)
min.
max.
*Reflow Soldering Only
39
嵌入式系统
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