Board Level
Heat Sinks
P/N: 833900T00000 & 8339TRT00000
D PAK, TO-263,
SO-10,
MO-184
PRODUCT SPECIFICATIONS
• Devices: D PAK, TO-263, SO-10, MO-184
• Size: 25.9 x 15.0 x 9.5 mm
• Material: Copper, 0.6 mm Thick
• Type: Stamped
• PCB Mounting: Surface Mount Technology
• Finish: Tin Plate
• Package: Bulk or Tape & Reel
Air Velocity - LFM
0
o
200
400
600
800
1000
Thermal Resistance -
o
C/ Watt
(Mounting Surface to Ambient)
10
8
6
4
2
0
100
80
60
40
20
0
0
1
2
3
4
5
Heat Dissipated - Watts
FEATURES & BENEFITS
•
No Hardware Device Attachment
• Direct SMT Contact to PCB
• Solderable Legs
• RoHS Compliant
CUSTOMIZED HEATSINKS
• Specialized Tabs, Plating
• Specialized Body Configurations
• Contact Applications Engineering
Part Number
833900T00000
8339TRT00000
Packaging
Bulk
Tape & Reel
Notes
Contact Factory for Tape and Reel Specs
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
Temp Rise Above Ambient -
(Mounting Surface)
C