16-bit inverting buffer/driver with 30ohm termination resistors (3-state)
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
Reach Compliance Code | compli |
其他特性 | CAN ALSO OPERATE AT 3.3V VCC |
控制类型 | ENABLE LOW |
系列 | ALVT |
JESD-30 代码 | R-PDSO-G48 |
JESD-609代码 | e4 |
长度 | 12.5 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.012 A |
湿度敏感等级 | 1 |
位数 | 4 |
功能数量 | 4 |
端口数量 | 2 |
端子数量 | 48 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE WITH SERIES RESISTOR |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP48,.3,20 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 2.5/3.3 V |
最大电源电流(ICC) | 4.5 mA |
Prop。Delay @ Nom-Su | 4.3 ns |
传播延迟(tpd) | 3.5 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 2.7 V |
最小供电电压 (Vsup) | 2.3 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 6.1 mm |
74ALVT162240DGG | AV162240DGG | AV162240DL | |
---|---|---|---|
描述 | 16-bit inverting buffer/driver with 30ohm termination resistors (3-state) | 16-bit inverting buffer/driver with 30ohm termination resistors (3-state) | 16-bit inverting buffer/driver with 30ohm termination resistors (3-state) |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
Reach Compliance Code | compli | unknow | unknow |
其他特性 | CAN ALSO OPERATE AT 3.3V VCC | CAN ALSO OPERATE AT 3.3V VCC | CAN ALSO OPERATE AT 3.3V VCC |
系列 | ALVT | ALVT | ALVT |
JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
长度 | 12.5 mm | 12.5 mm | 15.875 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 4 | 4 | 4 |
功能数量 | 4 | 4 | 4 |
端口数量 | 2 | 2 | 2 |
端子数量 | 48 | 48 | 48 |
最高工作温度 | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR |
输出极性 | INVERTED | INVERTED | INVERTED |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
最大电源电流(ICC) | 4.5 mA | 4.5 mA | 4.5 mA |
传播延迟(tpd) | 3.5 ns | 3.5 ns | 3.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 2.8 mm |
最大供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V |
最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL |
宽度 | 6.1 mm | 6.1 mm | 7.5 mm |
包装说明 | - | TSSOP, | SSOP, |
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