QUAD LINE DRIVER, CDFP16, CERAMIC, DFP-16
| 参数名称 | 属性值 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL16,.3 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 差分输出 | YES |
| 驱动器位数 | 4 |
| 高电平输入电流最大值 | 0.000001 A |
| 输入特性 | STANDARD |
| 接口集成电路类型 | LINE DRIVER |
| 接口标准 | GENERAL PURPOSE |
| JESD-30 代码 | R-CDFP-F16 |
| JESD-609代码 | e4 |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最小输出摆幅 | 2 V |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装等效代码 | FL16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大接收延迟 | |
| 筛选级别 | MIL-PRF-38535 |
| 座面最大高度 | 2.92 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 总剂量 | 100k Rad(Si) V |
| 最大传输延迟 | 28 ns |
| 宽度 | 6.73 mm |
| Base Number Matches | 1 |

| 5962R9563201TXC | 5962F9563201QEC | 5962F9563201VXC | 5962R9563201TEC | |
|---|---|---|---|---|
| 描述 | QUAD LINE DRIVER, CDFP16, CERAMIC, DFP-16 | QUAD LINE DRIVER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 | QUAD LINE DRIVER, CDFP16, CERAMIC, FP-16 | QUAD LINE DRIVER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 |
| 零件包装代码 | DFP | DIP | DFP | DIP |
| 包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 |
| 针数 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compli | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 差分输出 | YES | YES | YES | YES |
| 驱动器位数 | 4 | 4 | 4 | 4 |
| 高电平输入电流最大值 | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A |
| 输入特性 | STANDARD | STANDARD | STANDARD | STANDARD |
| 接口集成电路类型 | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER |
| 接口标准 | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE |
| JESD-30 代码 | R-CDFP-F16 | R-CDIP-T16 | R-CDFP-F16 | R-CDIP-T16 |
| JESD-609代码 | e4 | e4 | e4 | e4 |
| 功能数量 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 最小输出摆幅 | 2 V | 2 V | 2 V | 2 V |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DIP | DFP | DIP |
| 封装等效代码 | FL16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-PRF-38535 | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class V | MIL-PRF-38535 |
| 座面最大高度 | 2.92 mm | 5.08 mm | 2.92 mm | 5.08 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | GOLD | GOLD | GOLD | GOLD |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 总剂量 | 100k Rad(Si) V | 300k Rad(Si) V | 300k Rad(Si) V | 100k Rad(Si) V |
| 最大传输延迟 | 28 ns | 28 ns | 28 ns | 28 ns |
| 宽度 | 6.73 mm | 7.62 mm | 6.73 mm | 7.62 mm |
| 厂商名称 | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
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