Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
FEATURES
•
Ultra stable class 1 dielectric
•
High Q and low ESR at high frequency
•
Four standard sizes
RoHS
COMPLIANT
•
•
•
•
High capacitance per unit volume
Supplied in tape on reel
For high frequency applications
Ni-barrier with 100 % tin terminations
GENERAL SPECIFICATIONS
NOTE:
Electrical characteristics values -
temperature at 20 ± 1 °C, pressure at 86 to 106 Kpa and
humidity at 63 to 67 % unless otherwise stated
Rated Voltage U
R
(DC):
16 V; 25 V; 50 V; 100 V
Capacitance Range:
0.5 pF to 3300 pF
Tolerance on Capacitance:
C < 10 pF = ± 0.1 pF; ± 0.5 pF; ± 0.25 pF
C
≥
10 pF = ± 1 %; ± 2 %; ± 5 %
Q
<
30 pF = Q
≥
400 + 20C
Q
≥
30 pF = Q
≥
1000
APPLICATIONS
•
•
•
•
Mobile telecommunication
WLAN
RF modules
Tuner
Temperature Coefficient:
± 30 ppm/ °C
Insulation Resistance after 120 seconds at U
R
(DC):
10 GΩ minimum or 500
ΩF
minimum, whichever is less
Climatic Category (IEC 68):
55/125/56
DIMENSIONS
in inches [millimeters]
SIZE
CODE
L
W
T
MAX.
MB
T
W
0402
0.040
±
0.002
[1.0
±
0.05]
0.020
±
0.002
[0.5
±
0.05]
0.022
[0.55]
0.010 + 0.002/- 0.004
[0.25 + 0.05/- 0.10]
MB
L
MB
0603
0.063
±
0.004
[1.6
±
0.10]
0.030
±
0.004
[0.8
±
0.10]
0.035
[0.87]
0.015
±
0.006
[0.40
±
0.15]
ORDERING INFORMATION
VJ0402
Q
101
CAPACITANCE
F
TOLERANCE
X
TERMINATION
J
VOLTAGE
C
PACKAGING
W1BC
PROCESS CODE FOR
VISHAY BCC
PRODUCTS
SIZE CODE DIELECTRIC
0402
0603
Q = High Q
Cap. value < 10 pF
expressed in pF
B =
±
0.10 pF
two significant digits
C =
±
0.25 pF
followed by the
D =
±
0.50 pF
number of zeros:
Cap. value
≥
10 pF
1R0 = 1.0 pF
F=
±
1%
101 = 100 pF
G=
±
2%
J=
±
5%
X = Ni Barrier
100% tin
termination
J = 16 V
X = 25 V
A = 50 V
B = 100 V
C = 7 inches
reel/paper
P = 13 inches
reel/paper
www.vishay.com
38
For technical questions contact MLCC@vishay.com
Document Number 28534
Revision 02-Aug-05
Class 1 High Q 16/25/50/100V
Surface Mount Multilayer Chip Capacitors
Vishay BCcomponents
SELECTION CHART FOR 16/25/50 AND 100 V
DIELECTRIC
EIA CAP
EIA SIZE
0402
CAP
16 V
25 V
50 V
CODE
0R5
0.5 pF
N
N
N
1R0
1.0
N
N
N
1R2
1.2
N
N
N
1R5
1.5
N
N
N
1R8
1.8
N
N
N
2R2
2.2
N
N
N
2R7
2.7
N
N
N
3R3
3.3
N
N
N
3R9
3.9
N
N
N
4R7
4.7
N
N
N
5R6
5.6
N
N
N
6R8
6.8
N
N
N
8R2
8.2
N
N
N
100
10 pF
N
N
N
120
12
N
N
N
150
15
N
N
N
180
18
N
N
N
220
22
N
N
N
270
27
N
N
N
330
33
N
N
N
390
39
N
N
N
470
47
N
N
N
560
56
N
N
N
680
68
N
N
N
820
82
N
N
N
101
100 pF
N
N
N
121
120
N
N
N
151
150
N
N
N
181
180
N
N
N
221
220
N
N
N
271
270
N
331
330
N
391
390
N
471
470
N
561
560
681
680
821
820
102
1000 pF
122
1200
152
1500
182
1800
222
2200
272
2700
332
3300
472
4700
562
5600
682
6800
822
8200
103
10000 pF
Letters indicate product thickness, see packaging quantities
NP0
0603
100 V
16 V
25 V
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
50 V
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
100 V
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
Document Number 28534
Revision 02-Aug-05
For technical questions contact MLCC@vishay.com
www.vishay.com
39
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
PACKAGING QUANTITIES
THICKNESS
CLASSIFICATION
(mm)
N
=
S
=
X
=
A
=
B
=
C
=
D
=
J
=
I
=
P
=
G
=
0.50 ± 0.05
0.8 ± 0.07
0.8 + 0.15/ - 0.10
0.6 ± 0.1
0.8 ± 0.1
0.95 ± 0.1
1.25 ± 0.1
1.15 ± 0.15
1.25 ± 0.2
1.60 + 0.30/- 0.10
1.60 ± 0.2
AMOUNT PER REEL
Δ180
mm; 7 inch
0402
Paper 10 Kp/Reel
-
-
-
-
-
-
-
-
-
-
0603
-
Paper 4 Kp/Reel
Paper 4 Kp/Reel
-
-
-
-
-
-
-
-
0805
-
-
-
Paper 4 Kp/Reel
Paper 4 Kp/Reel
-
Plastic 3 Kp/Reel
-
Plastic 3 Kp/Reel
-
-
1206
-
-
-
-
Paper 4 Kp/Reel
Plastic 3 Kp/Reel
Plastic 3 Kp/Reel
Plastic 3 Kp/Reel
-
Plastic 2 Kp/Reel
Plastic 2 Kp/Reel
Surface Mount Multilayer Chip Capacitors
PACKAGING QUANTITIES
THICKNESS
CLASSIFICATION
(mm)
N
=
S
=
X
=
A
=
B
=
C
=
D
=
J
=
I
=
P
=
G
=
0.50 ± 0.05
0.8 ± 0.07
0.8 + 0.15/ - 0.10
0.6 ± 0.1
0.8 ± 0.1
0.95 ± 0.1
1.25 ± 0.1
1.15 ± 0.15
1.25 ± 0.2
1.60 + 0.30/- 0.10
1.60 ± 0.2
AMOUNT PER REEL
Δ330
mm; 13 inch
0402
Paper 50 Kp/Reel
-
-
-
-
-
-
-
-
-
-
0603
-
Paper 15 Kp/Reel
Paper 15 Kp/Reel
-
-
-
-
-
-
-
-
0805
-
-
-
Paper 15 Kp/Reel
Paper 15 Kp/Reel
-
Plastic 10 Kp/Reel
-
Plastic 10 Kp/Reel
-
-
1206
-
-
-
-
Paper 15 Kp/Reel
Plastic 10 Kp/Reel
Plastic 10 Kp/Reel
Plastic 10 Kp/Reel
-
-
-
COVER TAPE (POLYESTER - ANTISTATIC)
PROPERTIES OF COVER TAPE
PARAMETER
Breaking force
Elongation at break
Surface resistance
Softening point
Thickness
WIDTH
5.5
±
0.1 mm
≥
10.7 N
≥
63 %
< 10
10
Ω
/sq.
71
±
5 °C
62
μm
CARRIER TAPE (POLYCARBONATE)
PROPERTIES OF CARRIER TAPE
PARAMETER
Thickness
Tensile strength at break
Elongation at break
Surface resistance
WIDTH
8.1
±
0.2 mm
190 to 280 µm
>
60 N /mm
2
100 to 150 %
>
10
12
Ω
/sq.
PAPER TAPE SPECIFICATIONS
P0
D0
P2
DIMENSIONS OF PAPER TAPE
in millimeters
SYMBOL
E
F
W
B0
A0
P1
A
0
B
0
W
E
F
D
0
P
0
P
1
P
2
0402
SIZE TOL.
0.62 ± 0.05
1.12 ± 0.05
8.00 ± 0.10
1.75 ± 0.05
3.50 ± 0.05
1.55 ± 0.05
4.00 ± 0.10
2.00 ± 0.05
2.00 ± 0.05
PRODUCT SIZE CODE
0603
0805
SIZE TOL. SIZE TOL.
1.02 ± 0.05 1.50 ± 0.10
1.82 ± 0.05 2.30 ± 0.10
8.00 ± 0.10 8.00 ± 0.10
1.75 ± 0.05 1.75 ± 0.05
3.50 ± 0.05 3.50 ± 0.05
1.55 ± 0.05 1.55 ± 0.05
4.00 ± 0.10 4.00 ± 0.10
4.00 ± 0.10 4.00 ± 0.10
2.00 ± 0.05 2.00 ± 0.05
1206
SIZE TOL.
2.00 ± 0.10
3.50 ± 0.10
8.00 ± 0.10
1.75 ± 0.10
3.50 ± 0.05
1.50 ± 0.05
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
www.vishay.com
40
For technical questions contact MLCC@vishay.com
Document Number 28534
Revision 02-Aug-05
Class 1 High Q 16/25/50/100V
Surface Mount Multilayer Chip Capacitors
Vishay BCcomponents
BLISTER TAPE SPECIFICATIONS
DIMENSIONS OF BLISTER TAPE
in millimeters
P0
D0
P2
E
DIMENSION
A
0
B
0
W
E
F
D
0
D
1
P
0
P
1
P
2
F
B0
W
A0
P1
D1
direction of unreeling
PRODUCT
0805
1206
< 1.57
< 2.00
< 2.45
< 3.60
8.00
8.00
1.75
1.75
3.50
3.50
1.50
1.50
1.00
1.00
4.00
4.00
4.00
4.00
2.00
2.00
TOLERANCE
-
-
± 0.10
± 0.10
± 0.05
± 0.05
± 0.10
± 0.10
± 0.10
± 0.05
REEL SPECIFICATIONS
A
D
C
B
REEL DIMENSIONS AND TAPE WIDTH
in millimeters
∅
180 mm; 7 inch
A
B
C
D
13.0
±
1.0
9.0
±
1.0
178.0
±
1.0
60.5
±
1.0
∅
330 mm; 13 inch
13.0
±
0.5
9.0
±
1.0
330.0
±
1.0
100.0
±
1.0
METHOD OF MOUNTING AND DIMENSIONS OF SOLDER LANDS
For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering and
reflow soldering.
An improper combination of soldering, substrate and chip size can lead to a damaging of the component. The risk increases with
the chip size and with temperature fluctuations (> 100 °C) Therefore, it is advised to use the smallest possible size and follow the
dimensional recommendations given.
Document Number 28534
Revision 02-Aug-05
For technical questions contact MLCC@vishay.com
www.vishay.com
41
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
SOLDERING GRAPHS
IR REFLOW WITH SnAgCu SOLDERING
300
300
Max temperature
IR REFLOW WITH SnPb SOLDER
T
(°C)
Max temperature
250
> 215°C: 20 ~ 40 seconds
T
(°C)
250
200
200
Sn-Ag-Cu solder paste
150
150
Min temperature
Min temperature
100
100
Sn-Pb Eutectic solder paste
50
50
0
60 ~ 120 seconds
60 ~ 120 seconds
30 ~ 60 sec
60 ~ 120 seconds
time
0
time
30 ~ 60 seconds
30 ~ 60 seconds
30 ~ 60 seconds
WAVE SOLDERING
300
10 s
REFLOW SOLDERING
300
10 s
260
°C
250
245
°C
215
°C
10 s
T
(°C)
250
235
°C
to 260
°C
second wave
T
(°C)
200
first wave
5 K/s
2 K/s
200
180
°C
40 s
150
200 K/s
150
130
°C
100
°C
to 130
°C
100
forced
cooling
100
2 K/s
50
2 K/s
50
0
0
50
100
150
200
t (s)
250
0
0
50
100
150
200
t (s)
250
RECOMMENDED DIMENSIONS OF SOLDER LANDS
in millimeters
solder land /
solder paste
pattern
preferred direction during wave soldering
D
G
solder resist
pattern
occupied area
E
C
B
A
F
tracks
www.vishay.com
42
For technical questions contact MLCC@vishay.com
Document Number 28534
Revision 02-Aug-05
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
