SOMC
Vishay Dale
Thick Film, Dual-in-Line Resistor Networks
FEATURES
•
•
•
•
•
•
•
•
14,16 or 20 terminal package
Isolated, bussed or TTL-terminator circuits
Molded case construction
Highly stable thick film elements
Reflow solderable
Compatible with automatic surface mounting equipment
Reduces total assembly costs
For wave flow soldering contact factory
STANDARD ELECTRICAL SPECIFICATIONS
MODEL ELEMENT PACKAGE POWER RATING CIRCUIT
P
70
°
C
W
SOMC
0.08
0.16
0.08
1)
LIMITING ELEMENT TEMPERATURE TOL.
VOLTAGE MAX.
COEFFICIENT
1)
ppm/
°
C
%
1, 2, 5
50
100
1, 2, 5
1, 2, 5
RESISTANCE E-SERIES
RANGE
P
70
°
C
W
14
1.05
1.125
1.05
16
1.20
1.28
1.20
20
1.52
1.60
1.52
01
03
05
V
Ω
10R – 1M
24
Temperature Range: - 55°C to + 125°C
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material
• Jumper: Zero-Ohm-Resistor on request (100mΩ)
• Packaging: according to EIA; see appropriate catalog or web page
TECHNICAL CHARACTERISTICS
PARAMETER
Rated Dissipation at 70°C per Element
Limiting Element Voltage
Voltage Coefficient
Insulation Voltage (1min)
Category Temperature Range
Insulation Resistance
TC Tracking (- 55°C to + 125°C)
2)
UNIT
W
V
ppm/V
V
dc/ac peak
°C
Ω
ppm/°C
01 CIRCUIT
0.08
03 CIRCUIT
0.16
50
< 50
200
- 55 / + 150
> 10
10
50
05 CIRCUIT
0.08
2)
Rated voltage:
PxR
ORDERING INFORMATION
01, 03 Schematic
SOMC
MODEL
16
20
NUMBER OF
LEADS
01
03
SCHEMATIC
xxx or xxxx
R
1
VALUE
First 2 digits (3 for F tolerance) are
significant figures. Last digit
specifies number of zeros to follow.
xxx
or
xxxx
R
1
VALUE
xxx
or
xxxx
R
2
VALUE
G
TOLERANCE
F =
±
1%
G=
±
2%
J =
±
5%
05 Schematic
SOMC
MODEL
16
20
NUMBER OF
LEADS
05
SCHEMATIC
G
TOLERANCE
F =
±
1%
G=
±
2%
J =
±
5%
First 2 digits (3 for F tolerance) are
significant figures. Last digit
specifies number of zeros to follow.
www.vishay.com
116
For Technical Questions, contact: ff2aresistors@vishay.com
Document Number 31508
Revision 05-Aug-02
SOMC
Thick Film, Dual-in-Line Resistor Networks
16-TERMINAL DEVICE
Vishay Dale
SOLDER PAD DIMENSIONS
[in millimeters]
a
WAVE
Pin 1
b
1.91
1.91
c
5.34
5.34
l
9.53
9.53
p
1.27
1.27
w
9.15
9.15
0.64
0.64
REFLOW
The dimensions shown are for 16 pin part. For parts with different
pin numbers use the same pitch and add or substract pads as
required.
Note: Maximum solder reflow temperature + 255ºC
DIMENSIONS
[in millimeters]
PIN NO#
14
16
20
Tol
L
9.91
11.18
13.72
±
0.254
W
7.62
7.62
7.62
±
0.381
B
7.62
8.89
11.43
±
0.254
E
6.20
6.20
6.20
±
0.381
F
5.59
5.59
5.59
±
0.127
G
2.16
2.16
2.16
±
0.127
H
2.03
2.03
2.03
±
0.127
K
0.914
0.914
0.914
R
0.457
0.457
0.457
S
1.27
1.27
1.27
±
0.254
T
1.14
1.14
1.14
CIRCUIT SCHEMATICS
01 Circuit
03 Circuit
05 Circuit
R1
R2
R2
R1
R2
R1
R2
R1
R2
R1
R1
R1
R1
R1
R2
R1
R1
R2
R2
R2
R1
14 pin
14 pin
Pin 1
16
pin
20 pin
16 pin
20 pin
R2
Pin 1
14 pin
PERFORMANCE
TEST
Power Conditioning
Load Life at 70°C
Short Time Overload
Thermal Shock
Moisure Resistance
Resistance to Soldering Heat
Low Temperature Operation
Vibration
Shock
Terminal Strength
CONDITIONS OF TEST
MIL STD-202
MIL STD-202
MIL STD-202
MIL STD-202
MIL STD-202
MIL STD-202
MIL STD-202
MIL STD-202
MIL STD-202
MIL STD-202
TEST RESULTS
±
0.5%
±
0.5%
±
0.25%
±
0.5%
±
0.5%
±
0.25%
±
0.25%
±
0.25%
±
0.25%
±
0.25%
www.vishay.com
117
Document Number 31508
Revision 05-Aug-02
For Technical Questions, contact: ff2aresistors@vishay.com
R2
R2
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