DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D121
PRLL4001; PRLL4002
Rectifiers
Product specification
Supersedes data of November 1993
1996 Jun 10
Philips Semiconductors
Product specification
Rectifiers
FEATURES
•
Glass passivated
•
High maximum operating
temperature
•
Low leakage current
•
Excellent stability
•
Shipped in 8 mm embossed tape
•
Smallest surface mount rectifier
outline.
handbook, 4 columns
PRLL4001; PRLL4002
DESCRIPTION
Cavity free cylindrical glass package
through Implotec™
(1)
technology.
(1) Implotec is a trademark of Philips.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
k
a
MAM061
Marking code PRLL4001:
4001.
Marking code PRLL4002:
4002.
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
V
RRM
PARAMETER
repetitive peak reverse voltage
PRLL4001
PRLL4002
V
R
continuous reverse voltage
PRLL4001
PRLL4002
I
F(AV)
average forward current
averaged over any 20 ms
period; T
tp
= 105
°C
averaged over any 20 ms
period; T
amb
= 65
°C;
see Fig.2
I
FRM
I
FSM
T
stg
T
j
repetitive peak forward current
non-repetitive peak forward current
storage temperature
junction temperature
half sinewave; 60 Hz
−
−
−
−
−
−
−65
−65
50
100
V
V
−
−
50
100
V
V
CONDITIONS
MIN.
MAX.
UNIT
1.60 A
0.68 A
10
20
+175
+175
A
A
°C
°C
1996 Jun 10
2
Philips Semiconductors
Product specification
Rectifiers
ELECTRICAL CHARACTERISTICS
T
j
= 25
°C;
unless otherwise specified.
SYMBOL
V
F
V
F(AV)
I
R
I
R(AV)
PARAMETER
forward voltage
full-cycle average forward voltage
reverse current
full-cycle average reverse current
I
F(AV)
= 1 A
V
R
= V
Rmax
V
R
= V
Rmax
; T
amb
= 100
°C
PRLL4001; PRLL4002
CONDITIONS
I
F
= 1 A; see Fig.3
MAX.
1.1
0.8
10
50
30
V
V
UNIT
µA
µA
µA
V
R
= V
RRMmax
; T
amb
= 75
°C
THERMAL CHARACTERISTICS
SYMBOL
R
th j-tp
R
th j-a
Note
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper
≥40 µm,
see Fig.4.
For more information please refer to the
“General Part of associated Handbook”.
PARAMETER
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
note 1
CONDITIONS
VALUE
30
150
UNIT
K/W
K/W
1996 Jun 10
3
Philips Semiconductors
Product specification
Rectifiers
GRAPHICAL DATA
PRLL4001; PRLL4002
handbook, halfpage
1.0
MBH384
handbook, halfpage
10
MBH385
IF(AV)
(A)
IF
(A)
0.5
1
(1)
(2)
(3)
0
0
100
Tamb (°C)
200
10
−1
0
0.5
1
VF (V)
1.5
(1) T
amb
= 100
°C.
(2) T
amb
= 20
°C.
(3) T
amb
=
−50 °C.
Fig.2
Maximum average forward current as a
function of ambient temperature.
Fig.3
Forward current as a function of forward
voltage; typical values.
50
4.5
50
2.5
1.25
MSB213
Dimensions in mm.
Fig.4 Printed-circuit board for surface mounting.
1996 Jun 10
4
Philips Semiconductors
Product specification
Rectifiers
PACKAGE OUTLINE
PRLL4001; PRLL4002
handbook, full pagewidth
3.5
0.3
0.2
OD=
2.05
0.05
MBA505
O D1 =
1.9
0.1
Dimensions in mm.
Fig.5 SOD87.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
1996 Jun 10
5
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